KR102871799B1 - 에폭시 수지, 경화성 조성물, 경화물, 반도체 봉지 재료, 반도체 장치, 프리프레그, 회로 기판, 및, 빌드업 필름 - Google Patents

에폭시 수지, 경화성 조성물, 경화물, 반도체 봉지 재료, 반도체 장치, 프리프레그, 회로 기판, 및, 빌드업 필름

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Publication number
KR102871799B1
KR102871799B1 KR1020237011018A KR20237011018A KR102871799B1 KR 102871799 B1 KR102871799 B1 KR 102871799B1 KR 1020237011018 A KR1020237011018 A KR 1020237011018A KR 20237011018 A KR20237011018 A KR 20237011018A KR 102871799 B1 KR102871799 B1 KR 102871799B1
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KR
South Korea
Prior art keywords
epoxy resin
group
compound
mass
hydroxyl group
Prior art date
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KR1020237011018A
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English (en)
Korean (ko)
Other versions
KR20230059829A (ko
Inventor
가즈마사 아오야마
가즈히사 야모토
겐스케 아키모토
Original Assignee
디아이씨 가부시끼가이샤
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Publication of KR20230059829A publication Critical patent/KR20230059829A/ko
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Publication of KR102871799B1 publication Critical patent/KR102871799B1/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • H01L23/293—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Compounds (AREA)
KR1020237011018A 2020-12-03 2021-11-25 에폭시 수지, 경화성 조성물, 경화물, 반도체 봉지 재료, 반도체 장치, 프리프레그, 회로 기판, 및, 빌드업 필름 Active KR102871799B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020200933 2020-12-03
JPJP-P-2020-200933 2020-12-03
PCT/JP2021/043092 WO2022118723A1 (ja) 2020-12-03 2021-11-25 エポキシ樹脂、硬化性組成物、硬化物、半導体封止材料、半導体装置、プリプレグ、回路基板、及び、ビルドアップフィルム

Publications (2)

Publication Number Publication Date
KR20230059829A KR20230059829A (ko) 2023-05-03
KR102871799B1 true KR102871799B1 (ko) 2025-10-16

Family

ID=81855009

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237011018A Active KR102871799B1 (ko) 2020-12-03 2021-11-25 에폭시 수지, 경화성 조성물, 경화물, 반도체 봉지 재료, 반도체 장치, 프리프레그, 회로 기판, 및, 빌드업 필름

Country Status (5)

Country Link
JP (1) JP7290205B2 (https=)
KR (1) KR102871799B1 (https=)
CN (1) CN116583943A (https=)
TW (1) TWI899388B (https=)
WO (1) WO2022118723A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000044775A (ja) 1998-07-28 2000-02-15 Yuka Shell Epoxy Kk 半導体封止用エポキシ樹脂組成物
JP2007039551A (ja) 2005-08-03 2007-02-15 Dainippon Ink & Chem Inc エポキシ樹脂，エポキシ樹脂組成物，硬化物，半導体装置，エポキシ樹脂の製造法
JP2011026385A (ja) * 2009-07-22 2011-02-10 Dic Corp エポキシ樹脂組成物、その硬化物、半導体封止材料、半導体装置、及びエポキシ樹脂
JP2014037487A (ja) * 2012-08-16 2014-02-27 Dic Corp 硬化性樹脂組成物、硬化物、及びプリント配線基板
WO2015037584A1 (ja) 2013-09-10 2015-03-19 日本化薬株式会社 エポキシ樹脂混合物、エポキシ樹脂組成物、硬化物および半導体装置
JP2018138681A (ja) 2016-04-04 2018-09-06 Dic株式会社 エポキシ樹脂組成物の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839677A (ja) * 1981-09-02 1983-03-08 Mitsubishi Petrochem Co Ltd 新規ポリエポキシ化合物
JPH1160681A (ja) * 1997-08-14 1999-03-02 Jsr Corp ビフェノール型エポキシ樹脂およびその組成物
CN101495533B (zh) * 2005-03-18 2012-02-29 大日本油墨化学工业株式会社 环氧树脂组合物、其固化物、新型环氧树脂、其制造方法和新型酚树脂
JP5245199B2 (ja) * 2005-03-18 2013-07-24 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂、その製造方法、及び新規フェノール樹脂
JP5463859B2 (ja) * 2009-11-06 2014-04-09 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂、新規フェノール樹脂、プリプレグ、及び回路基板
JP5648832B2 (ja) * 2010-07-02 2015-01-07 Dic株式会社 熱硬化性樹脂組成物、その硬化物、活性エステル樹脂、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000044775A (ja) 1998-07-28 2000-02-15 Yuka Shell Epoxy Kk 半導体封止用エポキシ樹脂組成物
JP2007039551A (ja) 2005-08-03 2007-02-15 Dainippon Ink & Chem Inc エポキシ樹脂，エポキシ樹脂組成物，硬化物，半導体装置，エポキシ樹脂の製造法
JP2011026385A (ja) * 2009-07-22 2011-02-10 Dic Corp エポキシ樹脂組成物、その硬化物、半導体封止材料、半導体装置、及びエポキシ樹脂
JP2014037487A (ja) * 2012-08-16 2014-02-27 Dic Corp 硬化性樹脂組成物、硬化物、及びプリント配線基板
WO2015037584A1 (ja) 2013-09-10 2015-03-19 日本化薬株式会社 エポキシ樹脂混合物、エポキシ樹脂組成物、硬化物および半導体装置
JP2018138681A (ja) 2016-04-04 2018-09-06 Dic株式会社 エポキシ樹脂組成物の製造方法

Also Published As

Publication number Publication date
TW202231701A (zh) 2022-08-16
WO2022118723A1 (ja) 2022-06-09
KR20230059829A (ko) 2023-05-03
JP7290205B2 (ja) 2023-06-13
TWI899388B (zh) 2025-10-01
JPWO2022118723A1 (https=) 2022-06-09
CN116583943A (zh) 2023-08-11

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