JP7281146B2 - 弾性波デバイス - Google Patents
弾性波デバイス Download PDFInfo
- Publication number
- JP7281146B2 JP7281146B2 JP2020132054A JP2020132054A JP7281146B2 JP 7281146 B2 JP7281146 B2 JP 7281146B2 JP 2020132054 A JP2020132054 A JP 2020132054A JP 2020132054 A JP2020132054 A JP 2020132054A JP 7281146 B2 JP7281146 B2 JP 7281146B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- idt
- pattern wiring
- piezoelectric substrate
- acoustic wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02614—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02637—Details concerning reflective or coupling arrays
- H03H9/02685—Grating lines having particular arrangements
- H03H9/02724—Comb like grating lines
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020132054A JP7281146B2 (ja) | 2020-08-03 | 2020-08-03 | 弾性波デバイス |
CN202110779572.4A CN114070240A (zh) | 2020-08-03 | 2021-07-09 | 弹性波装置及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020132054A JP7281146B2 (ja) | 2020-08-03 | 2020-08-03 | 弾性波デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022028566A JP2022028566A (ja) | 2022-02-16 |
JP7281146B2 true JP7281146B2 (ja) | 2023-05-25 |
Family
ID=80233282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020132054A Active JP7281146B2 (ja) | 2020-08-03 | 2020-08-03 | 弾性波デバイス |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7281146B2 (zh) |
CN (1) | CN114070240A (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006211612A (ja) | 2005-01-31 | 2006-08-10 | Sony Corp | Sawデバイス、通信モジュール及びsawデバイスの製造方法 |
WO2012063521A1 (ja) | 2010-11-10 | 2012-05-18 | 株式会社村田製作所 | 弾性波装置及びその製造方法 |
JP2019192994A (ja) | 2018-04-20 | 2019-10-31 | 太陽誘電株式会社 | 弾性波共振器、フィルタおよびマルチプレクサ |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1075141A (ja) * | 1996-08-30 | 1998-03-17 | Fujitsu Ltd | 弾性表面波素子の製造方法 |
JPH11163662A (ja) * | 1997-11-27 | 1999-06-18 | Kyocera Corp | 弾性表面波フィルタ |
JPH11312942A (ja) * | 1998-04-27 | 1999-11-09 | Toshiba Corp | 弾性表面波デバイスの製造方法 |
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2020
- 2020-08-03 JP JP2020132054A patent/JP7281146B2/ja active Active
-
2021
- 2021-07-09 CN CN202110779572.4A patent/CN114070240A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006211612A (ja) | 2005-01-31 | 2006-08-10 | Sony Corp | Sawデバイス、通信モジュール及びsawデバイスの製造方法 |
WO2012063521A1 (ja) | 2010-11-10 | 2012-05-18 | 株式会社村田製作所 | 弾性波装置及びその製造方法 |
JP2019192994A (ja) | 2018-04-20 | 2019-10-31 | 太陽誘電株式会社 | 弾性波共振器、フィルタおよびマルチプレクサ |
Also Published As
Publication number | Publication date |
---|---|
JP2022028566A (ja) | 2022-02-16 |
CN114070240A (zh) | 2022-02-18 |
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