JP7243065B2 - シート材、メタルメッシュ、配線基板及び表示装置、並びにそれらの製造方法 - Google Patents
シート材、メタルメッシュ、配線基板及び表示装置、並びにそれらの製造方法 Download PDFInfo
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- JP7243065B2 JP7243065B2 JP2018138549A JP2018138549A JP7243065B2 JP 7243065 B2 JP7243065 B2 JP 7243065B2 JP 2018138549 A JP2018138549 A JP 2018138549A JP 2018138549 A JP2018138549 A JP 2018138549A JP 7243065 B2 JP7243065 B2 JP 7243065B2
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- Prior art keywords
- plated film
- electroless plated
- resin layer
- main surface
- electroless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/161—Process or apparatus coating on selected surface areas by direct patterning from plating step, e.g. inkjet
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
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- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C18/1689—After-treatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
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- C—CHEMISTRY; METALLURGY
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- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
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- H—ELECTRICITY
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- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
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- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L2224/161—Disposition
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- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Description
図1は、シート材の一実施形態を示す模式断面図である。図1に示すように、本実施形態に係るシート材1は、バインダー2及び複数の触媒粒子3を含む樹脂層4と、樹脂層4の一方の主面4a側に設けられ、第1の無電解めっき膜5及び第2の無電解めっき膜6を有する無電解めっき膜7と、樹脂層4の他方の主面4b側に設けられた基材8とを備えている。複数の触媒粒子3の少なくとも一部は、樹脂層4の一方の主面4aから露出する露出面3aを有し、複数の露出面3aは、樹脂層4の一方の主面4a上に散在している。第1の無電解めっき膜5は、複数の触媒粒子3の複数の露出面3aのそれぞれを囲むように樹脂層4の一方の主面4a上に設けられており、第2の無電解めっき膜6は、第1の無電解めっき膜5を覆うように設けられ、第2の無電解めっき膜6の第1の無電解めっき膜5側の主面6aが、第1の無電解めっき膜5の表面に沿う凹部6rを形成している。
本実施形態に係る第1のメタルメッシュは、バインダー及び複数の触媒粒子を含む樹脂層と、樹脂層の一方の主面側にメッシュ状のパターンを形成するように設けられ、第1の無電解めっき膜及び第2の無電解めっき膜を有する無電解めっき膜と、樹脂層の他方の主面側に設けられた基材と、を備え、複数の触媒粒子の少なくとも一部が、樹脂層の一方の主面から露出する露出面を有し、複数の露出面が、樹脂層の一方の主面上に散在しており、第1の無電解めっき膜が、複数の触媒粒子の露出面のそれぞれを囲むように樹脂層の一方の主面上に設けられており、第2の無電解めっき膜が、第1の無電解めっき膜を覆うように設けられ、第2の無電解めっき膜の第1の無電解めっき膜側の主面が、第1の無電解めっき膜の表面に沿う凹部を形成している。
本実施形態に係る第2のメタルメッシュは、基材と、基材上にメッシュ状のパターンを形成するように設けられ、バインダー及び複数の触媒粒子を含む樹脂層と、樹脂層を覆いながら樹脂層のメッシュ状のパターンに沿って基材上に設けられ、第1の無電解めっき膜及び第2の無電解めっき膜を有する無電解めっき膜と、を備え、複数のポリピロール粒子の少なくとも一部が、樹脂層の表面から露出する露出面を有し、複数の露出面が、樹脂層の表面上に散在しており、第1の無電解めっき膜が、触媒粒子の複数の露出面のそれぞれを囲むように樹脂層の表面上に設けられており、第2の無電解めっき膜が、第1の無電解めっき膜を覆うように設けられ、第2の無電解めっき膜の第1の無電解めっき膜側の主面が、第1の無電解めっき膜の表面に沿う凹部を形成している。
上述した本実施形態に係るシート材から得られる配線基板に発光素子を実装することによって、当該配線基板と、発光素子と、を備える表示装置を製造することができる。
本実施形態に係る第1の配線基板は、バインダー及び複数の触媒粒子を含む樹脂層と、樹脂層の一方の主面側に配線パターンを形成するように設けられ、第1の無電解めっき膜及び第2の無電解めっき膜を有する無電解めっき膜と、樹脂層の他方の主面側に設けられた基材と、を備え、複数の触媒粒子の少なくとも一部が、樹脂層の一方の主面から露出する露出面を有し、複数の露出面が、樹脂層の一方の主面上に散在しており、第1の無電解めっき膜が、複数の触媒粒子の露出面のそれぞれを囲むように樹脂層の一方の主面上に設けられており、第2の無電解めっき膜が、第1の無電解めっき膜を覆うように設けられ、第2の無電解めっき膜の第1の無電解めっき膜側の主面が、第1の無電解めっき膜の表面に沿う凹部を形成している。
本実施形態に係る第2の配線基板は、基材と、基材上に配線パターンを形成するように設けられ、バインダー及び複数の触媒粒子を含む樹脂層と、樹脂層を覆いながら樹脂層の配線パターンに沿って基材上に設けられ、第1の無電解めっき膜及び第2の無電解めっき膜を有する無電解めっき膜と、を備え、複数のポリピロール粒子の少なくとも一部が、樹脂層の表面から露出する露出面を有し、複数の露出面が、樹脂層の表面上に散在しており、第1の無電解めっき膜が、触媒粒子の複数の露出面のそれぞれを囲むように樹脂層の表面上に設けられており、第2の無電解めっき膜が、第1の無電解めっき膜を覆うように設けられ、第2の無電解めっき膜の第1の無電解めっき膜側の主面が、第1の無電解めっき膜の表面に沿う凹部を形成している。
(実施例1)
20質量%のパラジウム粒子と、イソシアネート樹脂とを含有する樹脂組成物を準備した。
得られた樹脂組成物をPETフィルム(東洋紡績株式会社製、商品名「コスモシャインA4100」)上に塗布し、乾燥させることにより、PETフィルム上に厚さ60μmでパラジウム粒子が表面に露出している樹脂層を備える第1の積層体を得た。第1の積層体を0.5g/Lのニッケルイオンを含む無電解めっき浴に浸漬し、該めっき浴の温度82℃で、20秒間無電解めっき処理を行い、凹凸表面を有する第1の無電解めっき膜が形成された第2の積層体を得た。続いて、第2の積層体を、3.0g/Lの銅イオンを含む無電解めっき浴に浸漬し、めっき浴の温度38℃で、45分間無電解めっき処理を行い、第1の無電解めっき膜の凹凸表面上に第2の無電解めっき膜が形成されたシート材を作製した。第2の無電解めっき膜の厚さは1μmであり、第1の無電解めっき膜の表面に沿う凹部を形成していた。
ニッケルイオンを含む無電解めっき浴に浸漬させる時間を30秒間とした以外は、実施例1と同様の操作を行い、シート材を得た。
ニッケルイオンを含む無電解めっき浴に浸漬させる時間を40秒間とした以外は、実施例1と同様の操作を行い、シート材を得た。
ニッケルイオンを含む無電解めっき浴に浸漬させる時間を50秒間とした以外は、実施例1と同様の操作を行い、シート材を得た。
ニッケルイオンを含む無電解めっき浴に浸漬させる時間を60秒間とした以外は、実施例1と同様の操作を行い、シート材を得た。
ニッケルイオンを含む無電解めっき浴に浸漬させる時間を90秒間とした以外は、実施例1と同様の操作を行い、シート材を得た。
ニッケルイオンを含む無電解めっき浴に浸漬させる時間を120秒間とした以外は、実施例1と同様の操作を行い、シート材を得た。
PETフィルム(東洋紡績株式会社製、商品名「コスモシャインA4100」)上に、スパッタリング法にてパラジウムを厚さ20nmとなるように製膜し、積層体を得た。続いて、0.5g/Lのニッケルイオンを含む無電解めっき浴に、得られた積層体を浸漬し、該めっき浴の温度82℃で、20秒間無電解めっき処理を行い、平滑な表面を有する第1の無電解めっき膜が形成された第2の積層体を得た。続いて、0.1g/Lのパラジウムイオンを含む水溶液に、第2の積層体を浸漬し、水洗させた後、3g/Lの銅イオンを含む無電解めっき浴に浸漬し、めっき浴の温度38℃で、45分間無電解めっき処理を行い、ニッケルを含む第1の無電解めっき膜の表面上に銅を含む第2の無電解めっき膜が形成されたシート材を得た。銅を含む第2の無電解めっき膜の厚さは1μmであった。
PETフィルム(東洋紡績株式会社製、商品名「コスモシャインA4100」)上に、スパッタリング法にてニッケルを厚さ20nmとなるように製膜し、平滑な表面を有する膜が形成された第2の積層体を得た。続いて、0.1g/Lのパラジウムイオンを含む水溶液に、第2の積層体を浸漬し、水洗させた後、10g/Lの次亜リン酸を含む水溶液に浸漬し、水洗させた。その後、3g/Lの銅イオンを含む無電解めっき浴に浸漬し、めっき浴の温度38℃で、45分間無電解めっき処理を行い、ニッケルを含む膜の表面上に銅を含む第2の無電解めっき膜が形成されたシート材を得た。無電解めっき膜の厚さは1μmであった。
PETフィルム(東洋紡績株式会社製、標品名「コスモシャインA4100」)を、Sn-Pdコロイド溶液に25℃、5分間浸漬し、水洗した後、0.5g/Lのニッケルイオンを含む無電解めっき浴に浸漬し、該めっき浴の温度82℃で、20秒間無電解めっき処理を行い、凹凸表面を有する第1の無電解めっき膜が形成された第2の積層体を得た。続いて、0.1g/Lのパラジウムイオンを含む水溶液に、第2の積層体を浸漬し、水洗させた後、3g/Lの銅イオンを含む無電解めっき浴に浸漬し、めっき浴の温度38℃で、45分間無電解めっき処理を行い、ニッケルを含む膜の凹凸表面上に銅を含む第2の無電解めっき膜が形成されたシート材を得た。
(第1の無電解めっき膜の最長径及び面積比率の測定)
上記各実施例及び比較例で得られた第2の積層体における第1の無電解めっき膜の最長径及び面積比率を、SEM写真の画像解析により測定した。測定は、それぞれの第2の積層体を縦500μm、横600μmの視野で、20万倍の倍率で観察することにより行い、それぞれの第1の無電解めっき膜の最長径の平均値及び、視野に占める第1の無電解めっき膜の面積比率を算出した。なお、比較例1及び2で作製された第2の積層体は、膜の表面が平滑であったため、最長径を測定できなかった。測定結果を表1に示す。
Spectrophotometer CM-5(コニカミノルタ株式会社製、製品名)を用い、JIS K 8729に準拠した方法に従って、上記各実施例及び比較例で得られたシート材におけるPETフィルム側からの光の反射率を測定した。測定結果を表1に示す。反射率が20%以下であれば、反射率が低く抑えられた良好なシート材といえる。
上記各実施例及び比較例で得られたシート材における無電解めっき膜上に、フォトリソグラフィーによりL/S=5/10μmのメッシュ状のレジストパターンを形成した。その後、5%過硫酸ナトリウム水溶液に浸漬して、25℃、5分間でエッチングを行い、レジストを除去することでメタルメッシュを作製した。
(密着性の評価)
得られたメタルメッシュを直径1mmのステンレスの棒に巻き付け、以下の評価基準にしたがって、無電解めっき膜の密着性を評価した。結果を表1に示す。
A:500回の巻き付け後でもめっき膜の剥がれが認められなかった。
B:500回未満の巻き付けでめっき膜の剥がれが認められた。
エッチングによるラインの断線の有無を目視により観察し、以下の評価基準にしたがって、エッチング性を評価した。結果を表1に示す。
A:エッチングを行った際にラインの断線が認められなかった。
B:エッチングを行った際にラインの断線が認められた。
Claims (15)
- バインダー及び複数の触媒粒子を含む樹脂層と、前記樹脂層の一方の主面側に設けられ、第1の無電解めっき膜及び第2の無電解めっき膜を有する無電解めっき膜と、前記樹脂層の他方の主面側に設けられた基材と、を備え、
複数の前記触媒粒子の少なくとも一部が、前記樹脂層の前記一方の主面から露出する露出面を有し、複数の前記露出面が、前記樹脂層の前記一方の主面上に散在しており、
前記第1の無電解めっき膜が、前記触媒粒子の複数の前記露出面のそれぞれを囲むように前記樹脂層の前記一方の主面上に設けられており、
前記第2の無電解めっき膜が、前記第1の無電解めっき膜を覆うように設けられ、前記第2の無電解めっき膜の前記第1の無電解めっき膜側の主面が、前記第1の無電解めっき膜の表面に沿う凹部を形成しており、
前記触媒粒子が、パラジウム、銀、白金、金、ニッケル、銅及びこれらの化合物からなる群より選ばれる少なくとも1種を含む金属粒子であり、
前記樹脂層の前記一方の主面を前記無電解めっき膜側から平面視したときに、前記第1の無電解めっき膜の最長径の平均値が18~90nmであり、
前記樹脂層の前記一方の主面を前記無電解めっき膜側から平面視したときに、前記一方の主面に占める前記第1の無電解めっき膜の面積比率が80~99%である、シート材。 - 前記第2の無電解めっき膜の前記第1の無電解めっき膜とは反対側の主面が粗面である、請求項1に記載のシート材。
- 前記基材が、透明基材である、請求項1又は2に記載のシート材。
- 基材上に、バインダー及び複数の触媒粒子を含む樹脂層を形成する工程であって、複数の前記触媒粒子の少なくとも一部が、前記樹脂層の一方の主面から露出する露出面を有し、複数の前記露出面が前記樹脂層の前記一方の主面上に散在し、前記基材が前記樹脂層の他方の主面側に設けられる、工程と、
複数の前記露出面のそれぞれを囲むように、前記樹脂層の前記一方の主面上に第1の無電解めっき膜を形成する工程と、
前記第1の無電解めっき膜を覆うように第2の無電解めっき膜を形成する工程であって、前記第2の無電解めっき膜の前記第1の無電解めっき膜側の主面が前記第1の無電解めっき膜の表面に沿う凹部を形成する、工程と、
を備え、
前記触媒粒子が、パラジウム、銀、白金、金、ニッケル、銅及びこれらの化合物からなる群より選ばれる少なくとも1種を含む金属粒子であり、
前記樹脂層の前記一方の主面を、前記第1の無電解めっき膜及び前記第2の無電解めっき膜を有する無電解めっき膜側から平面視したときに、前記第1の無電解めっき膜の最長径の平均値が18~90nmであり、
前記樹脂層の前記一方の主面を前記無電解めっき膜側から平面視したときに、前記一方の主面に占める前記第1の無電解めっき膜の面積比率が80~99%である、シート材の製造方法。 - 請求項1~3のいずれか一項に記載のシート材における前記無電解めっき膜に対するエッチングによって、メッシュ状のパターンを有する無電解めっき膜を形成する工程を備える、メタルメッシュの製造方法。
- 請求項1~3のいずれか一項に記載のシート材における前記無電解めっき膜に対するエッチングによって、配線パターンを有する無電解めっき膜を形成する工程を備える、配線基板の製造方法。
- バインダー及び複数の触媒粒子を含む樹脂層と、前記樹脂層の一方の主面側にメッシュ状のパターンを形成するように設けられ、第1の無電解めっき膜及び第2の無電解めっき膜を有する無電解めっき膜と、前記樹脂層の他方の主面側に設けられた基材と、を備え、
複数の前記触媒粒子の少なくとも一部が、前記樹脂層の前記一方の主面から露出する露出面を有し、複数の前記露出面が、前記樹脂層の前記一方の主面上に散在しており、
前記第1の無電解めっき膜が、前記触媒粒子の複数の前記露出面のそれぞれを囲むように前記樹脂層の前記一方の主面上に設けられており、
前記第2の無電解めっき膜が、前記第1の無電解めっき膜を覆うように設けられ、前記第2の無電解めっき膜の前記第1の無電解めっき膜側の主面が、前記第1の無電解めっき膜の表面に沿う凹部を形成しており、
前記触媒粒子が、パラジウム、銀、白金、金、ニッケル、銅及びこれらの化合物からなる群より選ばれる少なくとも1種を含む金属粒子であり、
前記樹脂層の前記一方の主面を前記無電解めっき膜側から平面視したときに、前記第1の無電解めっき膜の最長径の平均値が18~90nmであり、
前記樹脂層の前記一方の主面を前記無電解めっき膜側から平面視したときに、前記一方の主面に占める前記第1の無電解めっき膜の面積比率が80~99%である、メタルメッシュ。 - 基材と、前記基材上にメッシュ状のパターンを形成するように設けられ、バインダー及び複数の触媒粒子を含む樹脂層と、前記樹脂層を覆いながら前記樹脂層のメッシュ状のパターンに沿って前記基材上に設けられ、第1の無電解めっき膜及び第2の無電解めっき膜を有する無電解めっき膜と、を備え、
複数の前記触媒粒子の少なくとも一部が、前記樹脂層の表面から露出する露出面を有し、複数の前記露出面が、前記樹脂層の表面上に散在しており、
前記第1の無電解めっき膜が、前記触媒粒子の複数の前記露出面のそれぞれを囲むように前記樹脂層の表面上に設けられており、
前記第2の無電解めっき膜が、前記第1の無電解めっき膜を覆うように設けられ、前記第2の無電解めっき膜の前記第1の無電解めっき膜側の表面が、前記第1の無電解めっき膜の表面に沿う凹部を形成しており、
前記触媒粒子が、パラジウム、銀、白金、金、ニッケル、銅及びこれらの化合物からなる群より選ばれる少なくとも1種を含む金属粒子であり、
前記樹脂層の表面を前記無電解めっき膜側から平面視したときに、前記第1の無電解めっき膜の最長径の平均値が18~90nmであり、
前記樹脂層の一方の主面を前記無電解めっき膜側から平面視したときに、前記一方の主面に占める前記第1の無電解めっき膜の面積比率が80~99%である、メタルメッシュ。 - 前記第2の無電解めっき膜の前記第1の無電解めっき膜とは反対側の表面が粗面である、請求項7又は8に記載のメタルメッシュ。
- バインダー及び複数の触媒粒子を含む樹脂層と、前記樹脂層の一方の主面側に配線パターンを形成するように設けられ、第1の無電解めっき膜及び第2の無電解めっき膜を有する無電解めっき膜と、前記樹脂層の他方の主面側に設けられた基材と、を備え、
複数の前記触媒粒子の少なくとも一部が、前記樹脂層の前記一方の主面から露出する露出面を有し、複数の前記露出面が、前記樹脂層の前記一方の主面上に散在しており、
前記第1の無電解めっき膜が、前記触媒粒子の複数の前記露出面のそれぞれを囲むように前記樹脂層の前記一方の主面上に設けられており、
前記第2の無電解めっき膜が、前記第1の無電解めっき膜を覆うように設けられ、前記第2の無電解めっき膜の前記第1の無電解めっき膜側の主面が、前記第1の無電解めっき膜の表面に沿う凹部を形成しており、
前記触媒粒子が、パラジウム、銀、白金、金、ニッケル、銅及びこれらの化合物からなる群より選ばれる少なくとも1種を含む金属粒子であり、
前記樹脂層の前記一方の主面を前記無電解めっき膜側から平面視したときに、前記第1の無電解めっき膜の最長径の平均値が18~90nmであり、
前記樹脂層の前記一方の主面を前記無電解めっき膜側から平面視したときに、前記一方の主面に占める前記第1の無電解めっき膜の面積比率が80~99%である、配線基板。 - 基材と、前記基材上に配線パターンを形成するように設けられ、バインダー及び複数の触媒粒子を含む樹脂層と、前記樹脂層を覆いながら前記樹脂層の配線パターンに沿って前記基材上に設けられ、第1の無電解めっき膜及び第2の無電解めっき膜を有する無電解めっき膜と、を備え、
複数の前記触媒粒子の少なくとも一部が、前記樹脂層の表面から露出する露出面を有し、複数の前記露出面が、前記樹脂層の表面上に散在しており、
前記第1の無電解めっき膜が、前記触媒粒子の複数の前記露出面のそれぞれを囲むように前記樹脂層の表面上に設けられており、
前記第2の無電解めっき膜が、前記第1の無電解めっき膜を覆うように設けられ、前記第2の無電解めっき膜の前記第1の無電解めっき膜側の表面が、前記第1の無電解めっき膜の表面に沿う凹部を形成しており、
前記触媒粒子が、パラジウム、銀、白金、金、ニッケル、銅及びこれらの化合物からなる群より選ばれる少なくとも1種を含む金属粒子であり、
前記樹脂層の表面を前記無電解めっき膜側から平面視したときに、前記第1の無電解めっき膜の最長径の平均値が18~90nmであり、
前記樹脂層の一方の主面を前記無電解めっき膜側から平面視したときに、前記一方の主面に占める前記第1の無電解めっき膜の面積比率が80~99%である、配線基板。 - 請求項10又は11に記載の配線基板に、発光素子を実装する工程を備える、表示装置の製造方法。
- 前記実装する工程が、前記配線基板における前記無電解めっき膜の、前記樹脂層とは反対側の主面上に接続部を形成させることと、
前記発光素子を、前記接続部を介して前記無電解めっき膜に接続させることと、を含む、請求項12に記載の表示装置の製造方法。 - 請求項10又は11に記載の配線基板と、前記配線基板に実装されている発光素子と、を備える表示装置。
- 前記表示装置が前記配線基板における前記無電解めっき膜の、前記樹脂層とは反対側の主面上に設けられた接続部を更に備え、
前記発光素子が、前記接続部を介して前記配線基板に接続されている、請求項14に記載の表示装置。
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US10968519B2 (en) | 2021-04-06 |
US11668008B2 (en) | 2023-06-06 |
CN109306479A (zh) | 2019-02-05 |
US20210087692A1 (en) | 2021-03-25 |
CN109306479B (zh) | 2021-09-10 |
TW201910124A (zh) | 2019-03-16 |
KR102169229B1 (ko) | 2020-10-23 |
TWI679107B (zh) | 2019-12-11 |
JP2019026937A (ja) | 2019-02-21 |
KR20190013574A (ko) | 2019-02-11 |
US20190032219A1 (en) | 2019-01-31 |
JP2023021157A (ja) | 2023-02-09 |
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