JP7217999B2 - 複合銅部材 - Google Patents

複合銅部材 Download PDF

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Publication number
JP7217999B2
JP7217999B2 JP2020197075A JP2020197075A JP7217999B2 JP 7217999 B2 JP7217999 B2 JP 7217999B2 JP 2020197075 A JP2020197075 A JP 2020197075A JP 2020197075 A JP2020197075 A JP 2020197075A JP 7217999 B2 JP7217999 B2 JP 7217999B2
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JP
Japan
Prior art keywords
copper
group
composite
layer containing
copper member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020197075A
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English (en)
Japanese (ja)
Other versions
JP2021175820A (ja
JP2021175820A5 (zh
Inventor
牧子 佐藤
慎 寺木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020539869A external-priority patent/JP6806405B1/ja
Application filed by Namics Corp filed Critical Namics Corp
Publication of JP2021175820A publication Critical patent/JP2021175820A/ja
Publication of JP2021175820A5 publication Critical patent/JP2021175820A5/ja
Application granted granted Critical
Publication of JP7217999B2 publication Critical patent/JP7217999B2/ja
Active legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
JP2020197075A 2020-04-27 2020-11-27 複合銅部材 Active JP7217999B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020078603 2020-04-27
JP2020078603 2020-04-27
JP2020539869A JP6806405B1 (ja) 2020-04-27 2020-07-16 複合銅部材

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2020539869A Division JP6806405B1 (ja) 2020-04-27 2020-07-16 複合銅部材

Publications (3)

Publication Number Publication Date
JP2021175820A JP2021175820A (ja) 2021-11-04
JP2021175820A5 JP2021175820A5 (zh) 2021-12-16
JP7217999B2 true JP7217999B2 (ja) 2023-02-06

Family

ID=78300285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020197075A Active JP7217999B2 (ja) 2020-04-27 2020-11-27 複合銅部材

Country Status (2)

Country Link
JP (1) JP7217999B2 (zh)
WO (1) WO2021220524A1 (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017048467A (ja) 2013-09-20 2017-03-09 三井金属鉱業株式会社 銅箔、キャリア箔付銅箔及び銅張積層板
JP2018016886A (ja) 2016-07-15 2018-02-01 ナミックス株式会社 プリント配線板に用いる銅箔の製造方法
WO2019093494A1 (ja) 2017-11-10 2019-05-16 ナミックス株式会社 複合銅箔

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9345149B2 (en) * 2010-07-06 2016-05-17 Esionic Corp. Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards
JP6985745B2 (ja) * 2018-06-20 2021-12-22 ナミックス株式会社 粗化処理銅箔、銅張積層板及びプリント配線板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017048467A (ja) 2013-09-20 2017-03-09 三井金属鉱業株式会社 銅箔、キャリア箔付銅箔及び銅張積層板
JP2018016886A (ja) 2016-07-15 2018-02-01 ナミックス株式会社 プリント配線板に用いる銅箔の製造方法
WO2019093494A1 (ja) 2017-11-10 2019-05-16 ナミックス株式会社 複合銅箔

Also Published As

Publication number Publication date
TW202140855A (zh) 2021-11-01
JP2021175820A (ja) 2021-11-04
WO2021220524A1 (ja) 2021-11-04

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