JP7184758B2 - 導電材料、導電材料の保管方法、導電材料の製造方法及び接続構造体の製造方法 - Google Patents

導電材料、導電材料の保管方法、導電材料の製造方法及び接続構造体の製造方法 Download PDF

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JP7184758B2
JP7184758B2 JP2019515666A JP2019515666A JP7184758B2 JP 7184758 B2 JP7184758 B2 JP 7184758B2 JP 2019515666 A JP2019515666 A JP 2019515666A JP 2019515666 A JP2019515666 A JP 2019515666A JP 7184758 B2 JP7184758 B2 JP 7184758B2
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conductive material
solder
solder particles
electrode
less
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JPWO2019124513A1 (ja
Inventor
士輝 宋
周治郎 定永
将大 伊藤
諭 齋藤
英亮 石澤
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/226—Non-corrosive coatings; Primers applied before welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
JP2019515666A 2017-12-22 2018-12-20 導電材料、導電材料の保管方法、導電材料の製造方法及び接続構造体の製造方法 Active JP7184758B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017246177 2017-12-22
JP2017246177 2017-12-22
PCT/JP2018/047056 WO2019124513A1 (ja) 2017-12-22 2018-12-20 はんだ粒子、導電材料、はんだ粒子の保管方法、導電材料の保管方法、導電材料の製造方法、接続構造体及び接続構造体の製造方法

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JPWO2019124513A1 JPWO2019124513A1 (ja) 2020-11-19
JP7184758B2 true JP7184758B2 (ja) 2022-12-06

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JP (1) JP7184758B2 (zh)
KR (1) KR20200098486A (zh)
CN (1) CN111432980A (zh)
TW (1) TWI809022B (zh)
WO (1) WO2019124513A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7303675B2 (ja) * 2019-07-01 2023-07-05 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
JP2021057293A (ja) * 2019-10-01 2021-04-08 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
KR102612482B1 (ko) * 2021-11-16 2023-12-11 덕산네오룩스 주식회사 도전입자, 도전재료 및 접속 구조체

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000094179A (ja) 1998-09-22 2000-04-04 Harima Chem Inc ソルダペースト及びその製造方法並びにはんだプリコート方法
JP2013202632A (ja) 2012-03-27 2013-10-07 Nitto Denko Corp 接合シート、電子部品およびその製造方法
WO2015125778A1 (ja) 2014-02-24 2015-08-27 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法
WO2016031067A1 (ja) 2014-08-29 2016-03-03 千住金属工業株式会社 はんだ材料、はんだ継手及びはんだ材料の製造方法
WO2016140326A1 (ja) 2015-03-04 2016-09-09 デクセリアルズ株式会社 導電用粒子の製造方法、異方性導電接着剤、部品の搭載方法
JP2017100145A (ja) 2015-11-30 2017-06-08 三菱マテリアル株式会社 はんだ粉末の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06155070A (ja) * 1992-11-20 1994-06-03 Hitachi Ltd はんだペースト
JP4084657B2 (ja) * 2002-12-27 2008-04-30 三井金属鉱業株式会社 はんだペースト用はんだ粉
JP3769688B2 (ja) 2003-02-05 2006-04-26 独立行政法人科学技術振興機構 端子間の接続方法及び半導体装置の実装方法
JP2008214678A (ja) * 2007-03-01 2008-09-18 Mitsui Mining & Smelting Co Ltd 錫粉、錫ペースト及び錫粉の製造方法
JP5813917B2 (ja) * 2009-11-19 2015-11-17 Ｄｏｗａホールディングス株式会社 はんだ粉の製造方法
CN104439259B (zh) * 2014-11-25 2016-05-04 北京康普锡威科技有限公司 一种短流程球形钝化合金焊粉的制备方法
KR102456447B1 (ko) * 2014-12-26 2022-10-19 세키스이가가쿠 고교가부시키가이샤 도전 페이스트, 접속 구조체 및 접속 구조체의 제조 방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000094179A (ja) 1998-09-22 2000-04-04 Harima Chem Inc ソルダペースト及びその製造方法並びにはんだプリコート方法
JP2013202632A (ja) 2012-03-27 2013-10-07 Nitto Denko Corp 接合シート、電子部品およびその製造方法
WO2015125778A1 (ja) 2014-02-24 2015-08-27 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法
WO2016031067A1 (ja) 2014-08-29 2016-03-03 千住金属工業株式会社 はんだ材料、はんだ継手及びはんだ材料の製造方法
WO2016140326A1 (ja) 2015-03-04 2016-09-09 デクセリアルズ株式会社 導電用粒子の製造方法、異方性導電接着剤、部品の搭載方法
JP2017100145A (ja) 2015-11-30 2017-06-08 三菱マテリアル株式会社 はんだ粉末の製造方法

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TWI809022B (zh) 2023-07-21
CN111432980A (zh) 2020-07-17
JPWO2019124513A1 (ja) 2020-11-19
KR20200098486A (ko) 2020-08-20
WO2019124513A1 (ja) 2019-06-27
TW201934703A (zh) 2019-09-01

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