JP7180833B2 - プリント回路基板 - Google Patents

プリント回路基板 Download PDF

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Publication number
JP7180833B2
JP7180833B2 JP2018103654A JP2018103654A JP7180833B2 JP 7180833 B2 JP7180833 B2 JP 7180833B2 JP 2018103654 A JP2018103654 A JP 2018103654A JP 2018103654 A JP2018103654 A JP 2018103654A JP 7180833 B2 JP7180833 B2 JP 7180833B2
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JP
Japan
Prior art keywords
adhesive layer
layer
insulating layer
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018103654A
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English (en)
Japanese (ja)
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JP2019087725A (ja
Inventor
キム、キ－セオク
ヨー、ガ－ヨウン
パク、チャン－ファ
キム、ソン－イ
チョイ、ユ－リム
シム、ジ－ヒエ
Original Assignee
サムソン エレクトロ－メカニックス カンパニーリミテッド．
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JP2019087725A publication Critical patent/JP2019087725A/ja
Application granted granted Critical
Publication of JP7180833B2 publication Critical patent/JP7180833B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2018103654A 2017-11-08 2018-05-30 プリント回路基板 Active JP7180833B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020170148162A KR102494341B1 (ko) 2017-11-08 2017-11-08 인쇄회로기판
KR10-2017-0148162 2017-11-08

Publications (2)

Publication Number Publication Date
JP2019087725A JP2019087725A (ja) 2019-06-06
JP7180833B2 true JP7180833B2 (ja) 2022-11-30

Family

ID=66672052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018103654A Active JP7180833B2 (ja) 2017-11-08 2018-05-30 プリント回路基板

Country Status (3)

Country Link
JP (1) JP7180833B2 (zh)
KR (1) KR102494341B1 (zh)
TW (1) TWI826374B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102214641B1 (ko) * 2018-07-16 2021-02-10 삼성전기주식회사 인쇄회로기판
KR20210092547A (ko) * 2020-01-16 2021-07-26 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
CN112331621A (zh) * 2020-11-04 2021-02-05 日月光半导体制造股份有限公司 天线半导体封装装置及其制造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012182437A (ja) 2011-02-09 2012-09-20 Ngk Spark Plug Co Ltd 配線基板及びその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3155743B2 (ja) 1999-05-31 2001-04-16 松下電器産業株式会社 配線基板およびその製造方法並びに多層配線基板
JP4436946B2 (ja) 1999-06-25 2010-03-24 イビデン株式会社 片面回路基板の製造方法、および多層プリント配線板の製造方法
JP3431556B2 (ja) 1999-12-07 2003-07-28 松下電器産業株式会社 転写媒体及びその製造方法、転写媒体を用いた配線基板の製造方法
SG162619A1 (en) 2003-04-15 2010-07-29 Denki Kagaku Kogyo Kk Metal base circuit board and its production process
JP2005053966A (ja) 2003-08-05 2005-03-03 Shin Etsu Chem Co Ltd 熱硬化性オルガノポリシロキサン組成物および接着剤
KR101326999B1 (ko) 2012-03-07 2013-11-13 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
JP6309451B2 (ja) * 2012-09-20 2018-04-11 株式会社クラレ 回路基板およびその製造方法
JP6177639B2 (ja) 2013-09-20 2017-08-09 日本メクトロン株式会社 多層プリント配線板の製造方法、および多層プリント配線板
EP3140859B1 (en) 2014-05-06 2022-11-02 Intel Corporation Multi-layer package with integrated antenna
KR102333091B1 (ko) 2015-06-26 2021-12-01 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판의 제조 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012182437A (ja) 2011-02-09 2012-09-20 Ngk Spark Plug Co Ltd 配線基板及びその製造方法

Also Published As

Publication number Publication date
KR102494341B1 (ko) 2023-02-01
KR20190052458A (ko) 2019-05-16
JP2019087725A (ja) 2019-06-06
TWI826374B (zh) 2023-12-21
TW201919456A (zh) 2019-05-16

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