JP7178976B2 - 半導体製造装置および半導体装置の製造方法 - Google Patents

半導体製造装置および半導体装置の製造方法 Download PDF

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Publication number
JP7178976B2
JP7178976B2 JP2019174009A JP2019174009A JP7178976B2 JP 7178976 B2 JP7178976 B2 JP 7178976B2 JP 2019174009 A JP2019174009 A JP 2019174009A JP 2019174009 A JP2019174009 A JP 2019174009A JP 7178976 B2 JP7178976 B2 JP 7178976B2
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Japan
Prior art keywords
pin
mold
movable
movable pin
resin
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JP2019174009A
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English (en)
Japanese (ja)
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JP2021052091A (ja
Inventor
隆之 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2019174009A priority Critical patent/JP7178976B2/ja
Priority to CN202010987656.2A priority patent/CN112549427B/zh
Publication of JP2021052091A publication Critical patent/JP2021052091A/ja
Application granted granted Critical
Publication of JP7178976B2 publication Critical patent/JP7178976B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP2019174009A 2019-09-25 2019-09-25 半導体製造装置および半導体装置の製造方法 Active JP7178976B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019174009A JP7178976B2 (ja) 2019-09-25 2019-09-25 半導体製造装置および半導体装置の製造方法
CN202010987656.2A CN112549427B (zh) 2019-09-25 2020-09-18 半导体制造装置及半导体装置的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019174009A JP7178976B2 (ja) 2019-09-25 2019-09-25 半導体製造装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2021052091A JP2021052091A (ja) 2021-04-01
JP7178976B2 true JP7178976B2 (ja) 2022-11-28

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019174009A Active JP7178976B2 (ja) 2019-09-25 2019-09-25 半導体製造装置および半導体装置の製造方法

Country Status (2)

Country Link
JP (1) JP7178976B2 (zh)
CN (1) CN112549427B (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000082764A (ja) 1998-09-07 2000-03-21 Sanken Electric Co Ltd 樹脂封止形半導体装置用リードフレーム組立体及びその製造方法並びに樹脂封止形半導体装置の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0812877B2 (ja) * 1990-11-13 1996-02-07 新電元工業株式会社 樹脂封止型半導体装置の製造方法
JPH06120275A (ja) * 1992-10-02 1994-04-28 Sony Corp 半導体装置用リードフレームの加工方法及びその装置
JP2003324116A (ja) * 2002-04-26 2003-11-14 Sanken Electric Co Ltd 樹脂封止金型および樹脂封止装置
JP4534803B2 (ja) * 2005-03-09 2010-09-01 パナソニック株式会社 樹脂パッケージの製造方法
JP5165012B2 (ja) * 2010-02-22 2013-03-21 三菱電機株式会社 樹脂封止形電子制御装置及びその製造方法
JP5760555B2 (ja) * 2011-03-18 2015-08-12 セイコーエプソン株式会社 アパーチャアレイの製造装置及び製造方法
JP6662652B2 (ja) * 2016-02-02 2020-03-11 プライムアースＥｖエナジー株式会社 二次電池及び絶縁体の成形方法
JP6394634B2 (ja) * 2016-03-31 2018-09-26 日亜化学工業株式会社 リードフレーム、パッケージ及び発光装置、並びにこれらの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000082764A (ja) 1998-09-07 2000-03-21 Sanken Electric Co Ltd 樹脂封止形半導体装置用リードフレーム組立体及びその製造方法並びに樹脂封止形半導体装置の製造方法

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Publication number Publication date
CN112549427B (zh) 2022-12-27
CN112549427A (zh) 2021-03-26
JP2021052091A (ja) 2021-04-01

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