JP7173375B2 - 半導体モジュール - Google Patents

半導体モジュール Download PDF

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Publication number
JP7173375B2
JP7173375B2 JP2021560830A JP2021560830A JP7173375B2 JP 7173375 B2 JP7173375 B2 JP 7173375B2 JP 2021560830 A JP2021560830 A JP 2021560830A JP 2021560830 A JP2021560830 A JP 2021560830A JP 7173375 B2 JP7173375 B2 JP 7173375B2
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Japan
Prior art keywords
case
base plate
adhesive
semiconductor module
module according
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JP2021560830A
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English (en)
Japanese (ja)
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JPWO2021106114A1 (https=
Inventor
宏哉 山内
誠一郎 猪ノ口
裕児 井本
新 飯塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
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Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2021106114A1 publication Critical patent/JPWO2021106114A1/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2021560830A 2019-11-27 2019-11-27 半導体モジュール Active JP7173375B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/046445 WO2021106114A1 (ja) 2019-11-27 2019-11-27 半導体モジュール

Publications (2)

Publication Number Publication Date
JPWO2021106114A1 JPWO2021106114A1 (https=) 2021-06-03
JP7173375B2 true JP7173375B2 (ja) 2022-11-16

Family

ID=76128686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021560830A Active JP7173375B2 (ja) 2019-11-27 2019-11-27 半導体モジュール

Country Status (5)

Country Link
US (1) US12131969B2 (https=)
JP (1) JP7173375B2 (https=)
CN (1) CN114730745B (https=)
DE (1) DE112019007915T5 (https=)
WO (1) WO2021106114A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7258806B2 (ja) * 2020-03-23 2023-04-17 株式会社東芝 半導体装置
CN116711072A (zh) * 2021-01-22 2023-09-05 三菱电机株式会社 半导体装置及半导体装置的制造方法
JP7637852B2 (ja) * 2021-07-07 2025-03-03 三菱電機株式会社 半導体装置及びインバータ装置
TW202441733A (zh) * 2023-03-14 2024-10-16 日商新電元工業股份有限公司 半導體模組

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000323593A (ja) 1999-05-06 2000-11-24 Yazaki Corp 半導体装置
JP2004103846A (ja) 2002-09-10 2004-04-02 Mitsubishi Electric Corp 電力用半導体装置
JP2005322784A (ja) 2004-05-10 2005-11-17 Mitsubishi Electric Corp 電力用半導体装置
JP2012015349A (ja) 2010-07-01 2012-01-19 Fuji Electric Co Ltd 半導体装置
WO2017098593A1 (ja) 2015-12-09 2017-06-15 三菱電機株式会社 パワーモジュール
WO2018055667A1 (ja) 2016-09-20 2018-03-29 三菱電機株式会社 半導体装置
WO2019049400A1 (ja) 2017-09-05 2019-03-14 三菱電機株式会社 パワーモジュール及びその製造方法並びに電力変換装置
JP2019096797A (ja) 2017-11-27 2019-06-20 三菱電機株式会社 半導体装置および電力変換装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553617A (en) 1978-06-21 1980-01-11 Hitachi Ltd Metallic base for hybrid integrated circuit
JPS61139048A (ja) * 1984-12-11 1986-06-26 Toshiba Corp 半導体装置
JPS63100842U (https=) * 1986-12-19 1988-06-30
JPS6417455A (en) * 1987-07-10 1989-01-20 Mitsubishi Electric Corp Semiconductor device
JPH06268102A (ja) * 1993-01-13 1994-09-22 Fuji Electric Co Ltd 樹脂封止形半導体装置
JP4335263B2 (ja) * 2007-02-07 2009-09-30 ソニー株式会社 半導体装置および半導体装置の製造方法
JP5842929B2 (ja) * 2011-11-22 2016-01-13 富士通株式会社 電子部品およびその製造方法
JP5968611B2 (ja) * 2011-11-22 2016-08-10 新電元工業株式会社 パワーモジュールおよびその製造方法、並びに樹脂フレーム
JP6399272B1 (ja) 2017-09-05 2018-10-03 三菱電機株式会社 パワーモジュール及びその製造方法並びに電力変換装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000323593A (ja) 1999-05-06 2000-11-24 Yazaki Corp 半導体装置
JP2004103846A (ja) 2002-09-10 2004-04-02 Mitsubishi Electric Corp 電力用半導体装置
JP2005322784A (ja) 2004-05-10 2005-11-17 Mitsubishi Electric Corp 電力用半導体装置
JP2012015349A (ja) 2010-07-01 2012-01-19 Fuji Electric Co Ltd 半導体装置
WO2017098593A1 (ja) 2015-12-09 2017-06-15 三菱電機株式会社 パワーモジュール
WO2018055667A1 (ja) 2016-09-20 2018-03-29 三菱電機株式会社 半導体装置
WO2019049400A1 (ja) 2017-09-05 2019-03-14 三菱電機株式会社 パワーモジュール及びその製造方法並びに電力変換装置
JP2019096797A (ja) 2017-11-27 2019-06-20 三菱電機株式会社 半導体装置および電力変換装置

Also Published As

Publication number Publication date
US20220278004A1 (en) 2022-09-01
WO2021106114A1 (ja) 2021-06-03
JPWO2021106114A1 (https=) 2021-06-03
CN114730745A (zh) 2022-07-08
US12131969B2 (en) 2024-10-29
CN114730745B (zh) 2025-09-05
DE112019007915T5 (de) 2022-09-08

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