JPWO2021106114A1 - - Google Patents

Info

Publication number
JPWO2021106114A1
JPWO2021106114A1 JP2021560830A JP2021560830A JPWO2021106114A1 JP WO2021106114 A1 JPWO2021106114 A1 JP WO2021106114A1 JP 2021560830 A JP2021560830 A JP 2021560830A JP 2021560830 A JP2021560830 A JP 2021560830A JP WO2021106114 A1 JPWO2021106114 A1 JP WO2021106114A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021560830A
Other languages
Japanese (ja)
Other versions
JP7173375B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021106114A1 publication Critical patent/JPWO2021106114A1/ja
Application granted granted Critical
Publication of JP7173375B2 publication Critical patent/JP7173375B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
JP2021560830A 2019-11-27 2019-11-27 半導体モジュール Active JP7173375B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/046445 WO2021106114A1 (ja) 2019-11-27 2019-11-27 半導体モジュール

Publications (2)

Publication Number Publication Date
JPWO2021106114A1 true JPWO2021106114A1 (https=) 2021-06-03
JP7173375B2 JP7173375B2 (ja) 2022-11-16

Family

ID=76128686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021560830A Active JP7173375B2 (ja) 2019-11-27 2019-11-27 半導体モジュール

Country Status (5)

Country Link
US (1) US12131969B2 (https=)
JP (1) JP7173375B2 (https=)
CN (1) CN114730745B (https=)
DE (1) DE112019007915T5 (https=)
WO (1) WO2021106114A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7258806B2 (ja) * 2020-03-23 2023-04-17 株式会社東芝 半導体装置
CN116711072A (zh) * 2021-01-22 2023-09-05 三菱电机株式会社 半导体装置及半导体装置的制造方法
JP7637852B2 (ja) * 2021-07-07 2025-03-03 三菱電機株式会社 半導体装置及びインバータ装置
TW202441733A (zh) * 2023-03-14 2024-10-16 日商新電元工業股份有限公司 半導體模組

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553617A (en) * 1978-06-21 1980-01-11 Hitachi Ltd Metallic base for hybrid integrated circuit
JPS61139048A (ja) * 1984-12-11 1986-06-26 Toshiba Corp 半導体装置
JPS63100842U (https=) * 1986-12-19 1988-06-30
JPS6417455A (en) * 1987-07-10 1989-01-20 Mitsubishi Electric Corp Semiconductor device
JPH06268102A (ja) * 1993-01-13 1994-09-22 Fuji Electric Co Ltd 樹脂封止形半導体装置
JP2000323593A (ja) * 1999-05-06 2000-11-24 Yazaki Corp 半導体装置
JP2004103846A (ja) * 2002-09-10 2004-04-02 Mitsubishi Electric Corp 電力用半導体装置
JP2005322784A (ja) * 2004-05-10 2005-11-17 Mitsubishi Electric Corp 電力用半導体装置
JP2012015349A (ja) * 2010-07-01 2012-01-19 Fuji Electric Co Ltd 半導体装置
WO2017098593A1 (ja) * 2015-12-09 2017-06-15 三菱電機株式会社 パワーモジュール
WO2018055667A1 (ja) * 2016-09-20 2018-03-29 三菱電機株式会社 半導体装置
WO2019049400A1 (ja) * 2017-09-05 2019-03-14 三菱電機株式会社 パワーモジュール及びその製造方法並びに電力変換装置
JP2019096797A (ja) * 2017-11-27 2019-06-20 三菱電機株式会社 半導体装置および電力変換装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4335263B2 (ja) * 2007-02-07 2009-09-30 ソニー株式会社 半導体装置および半導体装置の製造方法
JP5842929B2 (ja) * 2011-11-22 2016-01-13 富士通株式会社 電子部品およびその製造方法
JP5968611B2 (ja) * 2011-11-22 2016-08-10 新電元工業株式会社 パワーモジュールおよびその製造方法、並びに樹脂フレーム
JP6399272B1 (ja) 2017-09-05 2018-10-03 三菱電機株式会社 パワーモジュール及びその製造方法並びに電力変換装置

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553617A (en) * 1978-06-21 1980-01-11 Hitachi Ltd Metallic base for hybrid integrated circuit
JPS61139048A (ja) * 1984-12-11 1986-06-26 Toshiba Corp 半導体装置
JPS63100842U (https=) * 1986-12-19 1988-06-30
JPS6417455A (en) * 1987-07-10 1989-01-20 Mitsubishi Electric Corp Semiconductor device
JPH06268102A (ja) * 1993-01-13 1994-09-22 Fuji Electric Co Ltd 樹脂封止形半導体装置
JP2000323593A (ja) * 1999-05-06 2000-11-24 Yazaki Corp 半導体装置
JP2004103846A (ja) * 2002-09-10 2004-04-02 Mitsubishi Electric Corp 電力用半導体装置
JP2005322784A (ja) * 2004-05-10 2005-11-17 Mitsubishi Electric Corp 電力用半導体装置
JP2012015349A (ja) * 2010-07-01 2012-01-19 Fuji Electric Co Ltd 半導体装置
WO2017098593A1 (ja) * 2015-12-09 2017-06-15 三菱電機株式会社 パワーモジュール
WO2018055667A1 (ja) * 2016-09-20 2018-03-29 三菱電機株式会社 半導体装置
WO2019049400A1 (ja) * 2017-09-05 2019-03-14 三菱電機株式会社 パワーモジュール及びその製造方法並びに電力変換装置
JP2019096797A (ja) * 2017-11-27 2019-06-20 三菱電機株式会社 半導体装置および電力変換装置

Also Published As

Publication number Publication date
US20220278004A1 (en) 2022-09-01
WO2021106114A1 (ja) 2021-06-03
JP7173375B2 (ja) 2022-11-16
CN114730745A (zh) 2022-07-08
US12131969B2 (en) 2024-10-29
CN114730745B (zh) 2025-09-05
DE112019007915T5 (de) 2022-09-08

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