DE112019007915T5 - Halbleitermodul - Google Patents

Halbleitermodul Download PDF

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Publication number
DE112019007915T5
DE112019007915T5 DE112019007915.8T DE112019007915T DE112019007915T5 DE 112019007915 T5 DE112019007915 T5 DE 112019007915T5 DE 112019007915 T DE112019007915 T DE 112019007915T DE 112019007915 T5 DE112019007915 T5 DE 112019007915T5
Authority
DE
Germany
Prior art keywords
base plate
recess
semiconductor module
adhesive
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112019007915.8T
Other languages
German (de)
English (en)
Inventor
Hiroya Sannai
Seiichiro Inokuchi
Yuji Imoto
Arata Iizuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE112019007915T5 publication Critical patent/DE112019007915T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE112019007915.8T 2019-11-27 2019-11-27 Halbleitermodul Pending DE112019007915T5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/046445 WO2021106114A1 (ja) 2019-11-27 2019-11-27 半導体モジュール

Publications (1)

Publication Number Publication Date
DE112019007915T5 true DE112019007915T5 (de) 2022-09-08

Family

ID=76128686

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112019007915.8T Pending DE112019007915T5 (de) 2019-11-27 2019-11-27 Halbleitermodul

Country Status (5)

Country Link
US (1) US12131969B2 (https=)
JP (1) JP7173375B2 (https=)
CN (1) CN114730745B (https=)
DE (1) DE112019007915T5 (https=)
WO (1) WO2021106114A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7258806B2 (ja) * 2020-03-23 2023-04-17 株式会社東芝 半導体装置
CN116711072A (zh) * 2021-01-22 2023-09-05 三菱电机株式会社 半导体装置及半导体装置的制造方法
JP7637852B2 (ja) * 2021-07-07 2025-03-03 三菱電機株式会社 半導体装置及びインバータ装置
TW202441733A (zh) * 2023-03-14 2024-10-16 日商新電元工業股份有限公司 半導體模組

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6399272B1 (ja) 2017-09-05 2018-10-03 三菱電機株式会社 パワーモジュール及びその製造方法並びに電力変換装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553617A (en) 1978-06-21 1980-01-11 Hitachi Ltd Metallic base for hybrid integrated circuit
JPS61139048A (ja) * 1984-12-11 1986-06-26 Toshiba Corp 半導体装置
JPS63100842U (https=) * 1986-12-19 1988-06-30
JPS6417455A (en) * 1987-07-10 1989-01-20 Mitsubishi Electric Corp Semiconductor device
JPH06268102A (ja) * 1993-01-13 1994-09-22 Fuji Electric Co Ltd 樹脂封止形半導体装置
JP2000323593A (ja) 1999-05-06 2000-11-24 Yazaki Corp 半導体装置
JP2004103846A (ja) 2002-09-10 2004-04-02 Mitsubishi Electric Corp 電力用半導体装置
JP4137840B2 (ja) * 2004-05-10 2008-08-20 三菱電機株式会社 電力用半導体装置
JP4335263B2 (ja) * 2007-02-07 2009-09-30 ソニー株式会社 半導体装置および半導体装置の製造方法
JP5310660B2 (ja) 2010-07-01 2013-10-09 富士電機株式会社 半導体装置
JP5842929B2 (ja) * 2011-11-22 2016-01-13 富士通株式会社 電子部品およびその製造方法
JP5968611B2 (ja) * 2011-11-22 2016-08-10 新電元工業株式会社 パワーモジュールおよびその製造方法、並びに樹脂フレーム
WO2017098593A1 (ja) * 2015-12-09 2017-06-15 三菱電機株式会社 パワーモジュール
DE112016007241B4 (de) * 2016-09-20 2021-08-19 Mitsubishi Electric Corporation Halbleitervorrichtung
DE112018004816T5 (de) 2017-09-05 2020-06-10 Mitsubishi Electric Corporation Leistungsmodul, verfahren zur herstellung desselben und leistungswandler
JP2019096797A (ja) * 2017-11-27 2019-06-20 三菱電機株式会社 半導体装置および電力変換装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6399272B1 (ja) 2017-09-05 2018-10-03 三菱電機株式会社 パワーモジュール及びその製造方法並びに電力変換装置

Also Published As

Publication number Publication date
US20220278004A1 (en) 2022-09-01
WO2021106114A1 (ja) 2021-06-03
JP7173375B2 (ja) 2022-11-16
JPWO2021106114A1 (https=) 2021-06-03
CN114730745A (zh) 2022-07-08
US12131969B2 (en) 2024-10-29
CN114730745B (zh) 2025-09-05

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R084 Declaration of willingness to licence
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023100000

Ipc: H10W0076600000

R016 Response to examination communication
R016 Response to examination communication