JP7136389B2 - 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法 - Google Patents

積層板、プリント配線板、半導体パッケージ及び積層板の製造方法 Download PDF

Info

Publication number
JP7136389B2
JP7136389B2 JP2022523252A JP2022523252A JP7136389B2 JP 7136389 B2 JP7136389 B2 JP 7136389B2 JP 2022523252 A JP2022523252 A JP 2022523252A JP 2022523252 A JP2022523252 A JP 2022523252A JP 7136389 B2 JP7136389 B2 JP 7136389B2
Authority
JP
Japan
Prior art keywords
laminate
composite layer
layers
glass
glass fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022523252A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021256516A1 (https=
Inventor
徳昭 村上
伸治 島岡
広明 藤田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2021256516A1 publication Critical patent/JPWO2021256516A1/ja
Priority to JP2022130410A priority Critical patent/JP7806636B2/ja
Application granted granted Critical
Publication of JP7136389B2 publication Critical patent/JP7136389B2/ja
Priority to JP2026002528A priority patent/JP2026050454A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/28—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
JP2022523252A 2020-06-17 2021-06-16 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法 Active JP7136389B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022130410A JP7806636B2 (ja) 2020-06-17 2022-08-18 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法
JP2026002528A JP2026050454A (ja) 2020-06-17 2026-01-09 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020104375 2020-06-17
JP2020104375 2020-06-17
PCT/JP2021/022910 WO2021256516A1 (ja) 2020-06-17 2021-06-16 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022130410A Division JP7806636B2 (ja) 2020-06-17 2022-08-18 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2021256516A1 JPWO2021256516A1 (https=) 2021-12-23
JP7136389B2 true JP7136389B2 (ja) 2022-09-13

Family

ID=79268020

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2022523252A Active JP7136389B2 (ja) 2020-06-17 2021-06-16 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法
JP2022130410A Active JP7806636B2 (ja) 2020-06-17 2022-08-18 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法
JP2026002528A Pending JP2026050454A (ja) 2020-06-17 2026-01-09 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2022130410A Active JP7806636B2 (ja) 2020-06-17 2022-08-18 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法
JP2026002528A Pending JP2026050454A (ja) 2020-06-17 2026-01-09 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法

Country Status (5)

Country Link
JP (3) JP7136389B2 (https=)
KR (1) KR20230025395A (https=)
CN (1) CN115835956A (https=)
TW (2) TWI891816B (https=)
WO (1) WO2021256516A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013140907A (ja) 2012-01-06 2013-07-18 Ibiden Co Ltd プリント配線板及びプリント配線板の製造方法
JP2015076589A (ja) 2013-10-11 2015-04-20 パナソニックＩｐマネジメント株式会社 積層板
WO2015079820A1 (ja) 2013-11-29 2015-06-04 日東紡績株式会社 ガラス繊維織物－樹脂組成物積層体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2740990B2 (ja) 1991-11-26 1998-04-15 株式会社日立製作所 低熱膨張性加圧成形用樹脂組成物
JPH05261861A (ja) * 1992-03-19 1993-10-12 Shin Kobe Electric Mach Co Ltd 積層板
JPWO2013042752A1 (ja) * 2011-09-22 2015-03-26 日立化成株式会社 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法
JP6844298B2 (ja) * 2017-02-17 2021-03-17 昭和電工マテリアルズ株式会社 プリプレグ、積層板、プリント配線板、コアレス基板、半導体パッケージ及びコアレス基板の製造方法
JP7056201B2 (ja) 2018-02-14 2022-04-19 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール
US11938688B2 (en) * 2018-12-18 2024-03-26 Resonac Corporation Laminate, printed wiring board, semiconductor package, and method for manufacturing laminate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013140907A (ja) 2012-01-06 2013-07-18 Ibiden Co Ltd プリント配線板及びプリント配線板の製造方法
JP2015076589A (ja) 2013-10-11 2015-04-20 パナソニックＩｐマネジメント株式会社 積層板
WO2015079820A1 (ja) 2013-11-29 2015-06-04 日東紡績株式会社 ガラス繊維織物－樹脂組成物積層体

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
南条尚志，日本複合材料学会誌，2007年，Vol.33, No.4，p.141-149

Also Published As

Publication number Publication date
TWI891816B (zh) 2025-08-01
JP2026050454A (ja) 2026-03-19
JP2022171670A (ja) 2022-11-11
JP7806636B2 (ja) 2026-01-27
CN115835956A (zh) 2023-03-21
TW202212119A (zh) 2022-04-01
WO2021256516A1 (ja) 2021-12-23
KR20230025395A (ko) 2023-02-21
JPWO2021256516A1 (https=) 2021-12-23
TW202533942A (zh) 2025-09-01

Similar Documents

Publication Publication Date Title
JP7136231B2 (ja) 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法
KR102561771B1 (ko) 열경화성 수지 조성물 및 이를 포함한 프리프레그, 금속박적층판 및 인쇄회로기판
CN112313281A (zh) 热固化性树脂组合物、预浸渍体、层叠板、印刷线路板、半导体封装体以及热固化性树脂组合物的制造方法
JP2012236920A (ja) 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及びプリント配線板
KR102463619B1 (ko) 코어리스 기판용 프리프레그, 코어리스 기판, 코어리스 기판의 제조 방법 및 반도체 패키지
CN110662793B (zh) 无芯基板用预浸渍体、无芯基板和半导体封装体
JP5633382B2 (ja) 熱硬化性樹脂組成物並びにこれを用いたプリプレグ、積層板及び多層プリント配線板
JP2003253018A (ja) プリプレグ及びそれを用いたプリント配線板
JP2017193614A (ja) プリプレグ、金属張積層板及びプリント配線板
JP2004277671A (ja) プリプレグおよびそれを用いたプリント配線板
JP7136389B2 (ja) 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法
WO2018151287A1 (ja) プリプレグ、積層板、プリント配線板、コアレス基板、半導体パッケージ及びコアレス基板の製造方法
JP7484422B2 (ja) プリプレグ、積層板、金属張積層板及び半導体パッケージ、並びに積層板及び金属張積層板の製造方法
JP7243077B2 (ja) プリプレグ、プリプレグの硬化物、積層板、プリント配線板及び半導体パッケージ
JP7120220B2 (ja) プリプレグ及びその製造方法、積層板、プリント配線板並びに半導体パッケージ
EP3744788B1 (en) Resin composition, prepreg, laminate, and metal foil-coated laminate
HK40016034B (en) Prepreg for coreless substrate, coreless substrate and semiconductor package
HK40016034A (en) Prepreg for coreless substrate, coreless substrate and semiconductor package
HK40016036A (en) Coreless substrate prepreg, coreless substrate, coreless substrate manufacturing method and semiconductor package
HK40016036B (en) Coreless substrate prepreg, coreless substrate, coreless substrate manufacturing method and semiconductor package

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220418

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20220418

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220524

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220701

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220802

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220815

R151 Written notification of patent or utility model registration

Ref document number: 7136389

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350