TWI891816B - 積層板、印刷線路板、半導體封裝體及積層板的製造方法 - Google Patents

積層板、印刷線路板、半導體封裝體及積層板的製造方法

Info

Publication number
TWI891816B
TWI891816B TW110122084A TW110122084A TWI891816B TW I891816 B TWI891816 B TW I891816B TW 110122084 A TW110122084 A TW 110122084A TW 110122084 A TW110122084 A TW 110122084A TW I891816 B TWI891816 B TW I891816B
Authority
TW
Taiwan
Prior art keywords
laminate
composite layer
layers
glass fiber
mass
Prior art date
Application number
TW110122084A
Other languages
English (en)
Chinese (zh)
Other versions
TW202212119A (zh
Inventor
村上德昭
島岡伸治
藤田廣明
Original Assignee
日商力森諾科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202212119A publication Critical patent/TW202212119A/zh
Application granted granted Critical
Publication of TWI891816B publication Critical patent/TWI891816B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/28—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
TW110122084A 2020-06-17 2021-06-17 積層板、印刷線路板、半導體封裝體及積層板的製造方法 TWI891816B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-104375 2020-06-17
JP2020104375 2020-06-17

Publications (2)

Publication Number Publication Date
TW202212119A TW202212119A (zh) 2022-04-01
TWI891816B true TWI891816B (zh) 2025-08-01

Family

ID=79268020

Family Applications (2)

Application Number Title Priority Date Filing Date
TW110122084A TWI891816B (zh) 2020-06-17 2021-06-17 積層板、印刷線路板、半導體封裝體及積層板的製造方法
TW114117505A TW202533942A (zh) 2020-06-17 2021-06-17 積層板、印刷線路板、半導體封裝體及積層板的製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW114117505A TW202533942A (zh) 2020-06-17 2021-06-17 積層板、印刷線路板、半導體封裝體及積層板的製造方法

Country Status (5)

Country Link
JP (3) JP7136389B2 (https=)
KR (1) KR20230025395A (https=)
CN (1) CN115835956A (https=)
TW (2) TWI891816B (https=)
WO (1) WO2021256516A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015076589A (ja) * 2013-10-11 2015-04-20 パナソニックＩｐマネジメント株式会社 積層板
TW201540495A (zh) * 2013-11-29 2015-11-01 Nitto Boseki Co Ltd 玻璃纖維織物－樹脂組成物層合物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2740990B2 (ja) 1991-11-26 1998-04-15 株式会社日立製作所 低熱膨張性加圧成形用樹脂組成物
JPH05261861A (ja) * 1992-03-19 1993-10-12 Shin Kobe Electric Mach Co Ltd 積層板
JPWO2013042752A1 (ja) * 2011-09-22 2015-03-26 日立化成株式会社 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法
JP5223973B1 (ja) * 2012-01-06 2013-06-26 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
JP6844298B2 (ja) * 2017-02-17 2021-03-17 昭和電工マテリアルズ株式会社 プリプレグ、積層板、プリント配線板、コアレス基板、半導体パッケージ及びコアレス基板の製造方法
JP7056201B2 (ja) 2018-02-14 2022-04-19 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール
US11938688B2 (en) * 2018-12-18 2024-03-26 Resonac Corporation Laminate, printed wiring board, semiconductor package, and method for manufacturing laminate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015076589A (ja) * 2013-10-11 2015-04-20 パナソニックＩｐマネジメント株式会社 積層板
TW201540495A (zh) * 2013-11-29 2015-11-01 Nitto Boseki Co Ltd 玻璃纖維織物－樹脂組成物層合物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
期刊 南条尚志 FRP構成素材入門第2章 構成素材と種類 ガラス繊維 日本複合材料学会誌 Vol.33，No.4 2007 p.141-149 *

Also Published As

Publication number Publication date
JP2026050454A (ja) 2026-03-19
JP2022171670A (ja) 2022-11-11
JP7806636B2 (ja) 2026-01-27
CN115835956A (zh) 2023-03-21
JP7136389B2 (ja) 2022-09-13
TW202212119A (zh) 2022-04-01
WO2021256516A1 (ja) 2021-12-23
KR20230025395A (ko) 2023-02-21
JPWO2021256516A1 (https=) 2021-12-23
TW202533942A (zh) 2025-09-01

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