JPWO2021256516A1 - - Google Patents

Info

Publication number
JPWO2021256516A1
JPWO2021256516A1 JP2022523252A JP2022523252A JPWO2021256516A1 JP WO2021256516 A1 JPWO2021256516 A1 JP WO2021256516A1 JP 2022523252 A JP2022523252 A JP 2022523252A JP 2022523252 A JP2022523252 A JP 2022523252A JP WO2021256516 A1 JPWO2021256516 A1 JP WO2021256516A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022523252A
Other languages
Japanese (ja)
Other versions
JP7136389B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021256516A1 publication Critical patent/JPWO2021256516A1/ja
Priority to JP2022130410A priority Critical patent/JP7806636B2/ja
Application granted granted Critical
Publication of JP7136389B2 publication Critical patent/JP7136389B2/ja
Priority to JP2026002528A priority patent/JP2026050454A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/28—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
JP2022523252A 2020-06-17 2021-06-16 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法 Active JP7136389B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022130410A JP7806636B2 (ja) 2020-06-17 2022-08-18 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法
JP2026002528A JP2026050454A (ja) 2020-06-17 2026-01-09 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020104375 2020-06-17
JP2020104375 2020-06-17
PCT/JP2021/022910 WO2021256516A1 (ja) 2020-06-17 2021-06-16 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022130410A Division JP7806636B2 (ja) 2020-06-17 2022-08-18 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2021256516A1 true JPWO2021256516A1 (https=) 2021-12-23
JP7136389B2 JP7136389B2 (ja) 2022-09-13

Family

ID=79268020

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2022523252A Active JP7136389B2 (ja) 2020-06-17 2021-06-16 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法
JP2022130410A Active JP7806636B2 (ja) 2020-06-17 2022-08-18 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法
JP2026002528A Pending JP2026050454A (ja) 2020-06-17 2026-01-09 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2022130410A Active JP7806636B2 (ja) 2020-06-17 2022-08-18 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法
JP2026002528A Pending JP2026050454A (ja) 2020-06-17 2026-01-09 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法

Country Status (5)

Country Link
JP (3) JP7136389B2 (https=)
KR (1) KR20230025395A (https=)
CN (1) CN115835956A (https=)
TW (2) TWI891816B (https=)
WO (1) WO2021256516A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05261861A (ja) * 1992-03-19 1993-10-12 Shin Kobe Electric Mach Co Ltd 積層板
JP2013140907A (ja) * 2012-01-06 2013-07-18 Ibiden Co Ltd プリント配線板及びプリント配線板の製造方法
JP2015076589A (ja) * 2013-10-11 2015-04-20 パナソニックＩｐマネジメント株式会社 積層板
WO2015079820A1 (ja) * 2013-11-29 2015-06-04 日東紡績株式会社 ガラス繊維織物－樹脂組成物積層体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2740990B2 (ja) 1991-11-26 1998-04-15 株式会社日立製作所 低熱膨張性加圧成形用樹脂組成物
JPWO2013042752A1 (ja) * 2011-09-22 2015-03-26 日立化成株式会社 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法
JP6844298B2 (ja) * 2017-02-17 2021-03-17 昭和電工マテリアルズ株式会社 プリプレグ、積層板、プリント配線板、コアレス基板、半導体パッケージ及びコアレス基板の製造方法
JP7056201B2 (ja) 2018-02-14 2022-04-19 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール
US11938688B2 (en) * 2018-12-18 2024-03-26 Resonac Corporation Laminate, printed wiring board, semiconductor package, and method for manufacturing laminate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05261861A (ja) * 1992-03-19 1993-10-12 Shin Kobe Electric Mach Co Ltd 積層板
JP2013140907A (ja) * 2012-01-06 2013-07-18 Ibiden Co Ltd プリント配線板及びプリント配線板の製造方法
JP2015076589A (ja) * 2013-10-11 2015-04-20 パナソニックＩｐマネジメント株式会社 積層板
WO2015079820A1 (ja) * 2013-11-29 2015-06-04 日東紡績株式会社 ガラス繊維織物－樹脂組成物積層体

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
南条尚志, 日本複合材料学会誌, vol. 33, no. 4, JPN6022019803, 2007, pages 141 - 149, ISSN: 0004780056 *

Also Published As

Publication number Publication date
TWI891816B (zh) 2025-08-01
JP2026050454A (ja) 2026-03-19
JP2022171670A (ja) 2022-11-11
JP7806636B2 (ja) 2026-01-27
CN115835956A (zh) 2023-03-21
JP7136389B2 (ja) 2022-09-13
TW202212119A (zh) 2022-04-01
WO2021256516A1 (ja) 2021-12-23
KR20230025395A (ko) 2023-02-21
TW202533942A (zh) 2025-09-01

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