KR20230025395A - 적층판, 프린트 배선판, 반도체 패키지 및 적층판의 제조 방법 - Google Patents

적층판, 프린트 배선판, 반도체 패키지 및 적층판의 제조 방법 Download PDF

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Publication number
KR20230025395A
KR20230025395A KR1020227043079A KR20227043079A KR20230025395A KR 20230025395 A KR20230025395 A KR 20230025395A KR 1020227043079 A KR1020227043079 A KR 1020227043079A KR 20227043079 A KR20227043079 A KR 20227043079A KR 20230025395 A KR20230025395 A KR 20230025395A
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KR
South Korea
Prior art keywords
layers
composite layer
glass
composite
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020227043079A
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English (en)
Korean (ko)
Inventor
노리아키 무라카미
신지 시마오카
히로아키 후지타
Original Assignee
레조낙 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 레조낙 가부시끼가이샤 filed Critical 레조낙 가부시끼가이샤
Publication of KR20230025395A publication Critical patent/KR20230025395A/ko
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/28—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
KR1020227043079A 2020-06-17 2021-06-16 적층판, 프린트 배선판, 반도체 패키지 및 적층판의 제조 방법 Pending KR20230025395A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-104375 2020-06-17
JP2020104375 2020-06-17
PCT/JP2021/022910 WO2021256516A1 (ja) 2020-06-17 2021-06-16 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法

Publications (1)

Publication Number Publication Date
KR20230025395A true KR20230025395A (ko) 2023-02-21

Family

ID=79268020

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227043079A Pending KR20230025395A (ko) 2020-06-17 2021-06-16 적층판, 프린트 배선판, 반도체 패키지 및 적층판의 제조 방법

Country Status (5)

Country Link
JP (3) JP7136389B2 (https=)
KR (1) KR20230025395A (https=)
CN (1) CN115835956A (https=)
TW (2) TWI891816B (https=)
WO (1) WO2021256516A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05148343A (ja) 1991-11-26 1993-06-15 Hitachi Ltd 低熱膨張性加圧成形用樹脂組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05261861A (ja) * 1992-03-19 1993-10-12 Shin Kobe Electric Mach Co Ltd 積層板
JPWO2013042752A1 (ja) * 2011-09-22 2015-03-26 日立化成株式会社 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法
JP5223973B1 (ja) * 2012-01-06 2013-06-26 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
JP2015076589A (ja) * 2013-10-11 2015-04-20 パナソニックＩｐマネジメント株式会社 積層板
CN105764684B (zh) * 2013-11-29 2017-03-01 日东纺绩株式会社 玻璃纤维织物‑树脂组合物叠层体
JP6844298B2 (ja) * 2017-02-17 2021-03-17 昭和電工マテリアルズ株式会社 プリプレグ、積層板、プリント配線板、コアレス基板、半導体パッケージ及びコアレス基板の製造方法
JP7056201B2 (ja) 2018-02-14 2022-04-19 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール
US11938688B2 (en) * 2018-12-18 2024-03-26 Resonac Corporation Laminate, printed wiring board, semiconductor package, and method for manufacturing laminate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05148343A (ja) 1991-11-26 1993-06-15 Hitachi Ltd 低熱膨張性加圧成形用樹脂組成物

Also Published As

Publication number Publication date
TWI891816B (zh) 2025-08-01
JP2026050454A (ja) 2026-03-19
JP2022171670A (ja) 2022-11-11
JP7806636B2 (ja) 2026-01-27
CN115835956A (zh) 2023-03-21
JP7136389B2 (ja) 2022-09-13
TW202212119A (zh) 2022-04-01
WO2021256516A1 (ja) 2021-12-23
JPWO2021256516A1 (https=) 2021-12-23
TW202533942A (zh) 2025-09-01

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