JP7128039B2 - 距離測定のためのイメージセンサ - Google Patents
距離測定のためのイメージセンサ Download PDFInfo
- Publication number
- JP7128039B2 JP7128039B2 JP2018113807A JP2018113807A JP7128039B2 JP 7128039 B2 JP7128039 B2 JP 7128039B2 JP 2018113807 A JP2018113807 A JP 2018113807A JP 2018113807 A JP2018113807 A JP 2018113807A JP 7128039 B2 JP7128039 B2 JP 7128039B2
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- JP
- Japan
- Prior art keywords
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- photoelectric conversion
- image sensor
- semiconductor substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
- H10F39/80373—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor characterised by the gate of the transistor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/08—Systems determining position data of a target for measuring distance only
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/08—Systems determining position data of a target for measuring distance only
- G01S17/32—Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated
- G01S17/36—Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated with phase comparison between the received signal and the contemporaneously transmitted signal
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/42—Simultaneous measurement of distance and other co-ordinates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
- G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
- G01S17/894—3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4816—Constructional features, e.g. arrangements of optical elements of receivers alone
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4817—Constructional features, e.g. arrangements of optical elements relating to scanning
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/491—Details of non-pulse systems
- G01S7/4912—Receivers
- G01S7/4913—Circuits for detection, sampling, integration or read-out
- G01S7/4914—Circuits for detection, sampling, integration or read-out of detector arrays, e.g. charge-transfer gates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/491—Details of non-pulse systems
- G01S7/4912—Receivers
- G01S7/4915—Time delay measurement, e.g. operational details for pixel components; Phase measurement
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/199—Back-illuminated image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8033—Photosensitive area
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/812—Arrangements for transferring the charges in the image sensor perpendicular to the imaging plane, e.g. buried regions used to transfer generated charges to circuitry under the photosensitive region
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Electromagnetism (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Optical Radar Systems And Details Thereof (AREA)
- Measurement Of Optical Distance (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Light Receiving Elements (AREA)
- Electrodes Of Semiconductors (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170075815A KR102432861B1 (ko) | 2017-06-15 | 2017-06-15 | 거리 측정을 위한 이미지 센서 |
| KR10-2017-0075815 | 2017-06-15 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019004149A JP2019004149A (ja) | 2019-01-10 |
| JP2019004149A5 JP2019004149A5 (enExample) | 2021-07-26 |
| JP7128039B2 true JP7128039B2 (ja) | 2022-08-30 |
Family
ID=64457674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018113807A Active JP7128039B2 (ja) | 2017-06-15 | 2018-06-14 | 距離測定のためのイメージセンサ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10388682B2 (enExample) |
| JP (1) | JP7128039B2 (enExample) |
| KR (1) | KR102432861B1 (enExample) |
| CN (1) | CN109148493B (enExample) |
| DE (1) | DE102018109752B4 (enExample) |
| SG (1) | SG10201803204RA (enExample) |
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| CN107924929B (zh) * | 2015-09-17 | 2022-10-18 | 索尼半导体解决方案公司 | 固体摄像器件、电子设备以及固体摄像器件的制造方法 |
| CN107422571B (zh) * | 2017-09-20 | 2020-08-21 | 京东方科技集团股份有限公司 | 显示面板、装置及其操控方法 |
| DE102017128369A1 (de) | 2017-11-30 | 2019-06-06 | Infineon Technologies Ag | Vorrichtung und verfahren zum lokalisieren eines ersten bauelements, lokalisierungsvorrichtung und verfahren zur lokalisierung |
| KR102651130B1 (ko) | 2018-12-06 | 2024-03-26 | 삼성전자주식회사 | 거리 측정을 위한 이미지 센서 |
| WO2020179290A1 (ja) | 2019-03-06 | 2020-09-10 | ソニーセミコンダクタソリューションズ株式会社 | センサおよび測距装置 |
| KR102749135B1 (ko) * | 2019-03-06 | 2025-01-03 | 삼성전자주식회사 | 이미지 센서 및 이미징 장치 |
| WO2020234644A1 (en) * | 2019-05-21 | 2020-11-26 | Sony Semiconductor Solutions Corporation | Simultaneous capture of multiple phases for imaging devices |
| EP3979627A4 (en) * | 2019-05-24 | 2022-07-20 | Sony Semiconductor Solutions Corporation | SOLID STATE IMAGING DEVICE AND DISTANCE IMAGE MEASUREMENT DEVICE |
| CN113875023B (zh) * | 2019-06-21 | 2025-03-25 | 索尼半导体解决方案公司 | 光电转换元件、光检测器、光检测系统、电子设备和移动体 |
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| TW202127637A (zh) * | 2019-11-19 | 2021-07-16 | 日商索尼半導體解決方案公司 | 受光元件、測距模組 |
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| KR102758786B1 (ko) * | 2019-11-26 | 2025-01-23 | 에스케이하이닉스 주식회사 | 이미지 센서 |
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| WO2021131651A1 (ja) * | 2019-12-26 | 2021-07-01 | 浜松ホトニクス株式会社 | 測距イメージセンサ及びその製造方法 |
| KR102857511B1 (ko) * | 2019-12-26 | 2025-09-09 | 하마마츠 포토닉스 가부시키가이샤 | 측거 이미지 센서 |
| TWI882059B (zh) * | 2020-01-29 | 2025-05-01 | 日商索尼半導體解決方案公司 | 攝像元件、攝像裝置及測距裝置 |
| JP7630488B2 (ja) * | 2020-02-10 | 2025-02-17 | ソニーセミコンダクタソリューションズ株式会社 | センサ装置、測距装置 |
| JP2021136416A (ja) * | 2020-02-28 | 2021-09-13 | ソニーセミコンダクタソリューションズ株式会社 | センサ素子およびセンサ装置 |
| JP7557172B2 (ja) * | 2020-03-06 | 2024-09-27 | Gpixel Japan株式会社 | 固体撮像装置用画素 |
| US11763472B1 (en) | 2020-04-02 | 2023-09-19 | Apple Inc. | Depth mapping with MPI mitigation using reference illumination pattern |
| JP6913793B1 (ja) * | 2020-05-08 | 2021-08-04 | 浜松ホトニクス株式会社 | 光センサ |
| JP2021193696A (ja) * | 2020-06-07 | 2021-12-23 | ソニーセミコンダクタソリューションズ株式会社 | センサ装置 |
| JP2021197388A (ja) | 2020-06-10 | 2021-12-27 | ソニーセミコンダクタソリューションズ株式会社 | 受光装置およびその製造方法、並びに、測距装置 |
| CN115552285A (zh) * | 2020-06-11 | 2022-12-30 | 苹果公司 | 具有飞行时间感测能力的全局快门图像传感器 |
| JP2023176046A (ja) * | 2020-10-19 | 2023-12-13 | ソニーセミコンダクタソリューションズ株式会社 | センサ |
| KR20220073404A (ko) * | 2020-11-26 | 2022-06-03 | 삼성전자주식회사 | 복수의 포토다이오드들을 포함하는 거리 픽셀 및 이를 포함하는 비행 거리 센서 |
| WO2022123954A1 (ja) * | 2020-12-10 | 2022-06-16 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置、電子機器及び固体撮像装置の製造方法 |
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| EP4579750A4 (en) * | 2022-08-24 | 2025-11-26 | Sony Semiconductor Solutions Corp | IMAGING ELEMENT AND DISTANCE MEASUREMENT DEVICE |
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| KR102432861B1 (ko) | 2022-08-16 |
| JP2019004149A (ja) | 2019-01-10 |
| CN109148493B (zh) | 2023-01-17 |
| CN109148493A (zh) | 2019-01-04 |
| US20180366504A1 (en) | 2018-12-20 |
| US10388682B2 (en) | 2019-08-20 |
| DE102018109752A1 (de) | 2018-12-20 |
| DE102018109752B4 (de) | 2023-12-07 |
| SG10201803204RA (en) | 2019-01-30 |
| KR20180136717A (ko) | 2018-12-26 |
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