JP7121572B2 - 研磨装置および研磨方法 - Google Patents

研磨装置および研磨方法 Download PDF

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Publication number
JP7121572B2
JP7121572B2 JP2018137067A JP2018137067A JP7121572B2 JP 7121572 B2 JP7121572 B2 JP 7121572B2 JP 2018137067 A JP2018137067 A JP 2018137067A JP 2018137067 A JP2018137067 A JP 2018137067A JP 7121572 B2 JP7121572 B2 JP 7121572B2
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JP
Japan
Prior art keywords
roller
tape
polishing
wafer
outer peripheral
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Active
Application number
JP2018137067A
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English (en)
Japanese (ja)
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JP2020011363A (ja
JP2020011363A5 (https=
Inventor
正也 関
正行 中西
誠 柏木
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Ebara Corp
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Ebara Corp
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Filing date
Publication date
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Priority to JP2018137067A priority Critical patent/JP7121572B2/ja
Priority to TW108124407A priority patent/TWI808215B/zh
Priority to KR1020190085568A priority patent/KR102764016B1/ko
Priority to US16/513,251 priority patent/US11511386B2/en
Priority to CN201910645186.9A priority patent/CN110732944B/zh
Priority to EP19186661.5A priority patent/EP3597363B1/en
Publication of JP2020011363A publication Critical patent/JP2020011363A/ja
Publication of JP2020011363A5 publication Critical patent/JP2020011363A5/ja
Application granted granted Critical
Publication of JP7121572B2 publication Critical patent/JP7121572B2/ja
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/002Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/06Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/06Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
    • B24B21/08Pressure shoes; Pressure members, e.g. backing belts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/12Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a contact wheel or roller pressing the belt against the work
    • B24B21/14Contact wheels; Contact rollers; Belt supporting rolls
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18Accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18Accessories
    • B24B21/20Accessories for controlling or adjusting the tracking or the tension of the grinding belt
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18Accessories
    • B24B21/22Accessories for producing a reciprocation of the grinding belt normal to its direction of movement
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • B24B9/102Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass for travelling sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • B24B9/107Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass for glass plates while they are turning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00Abrasive blasting machines or devices; Plants
    • B24C3/08Abrasive blasting machines or devices; Plants essentially adapted for abrasive blasting of travelling stock or travelling workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Disintegrating Or Milling (AREA)
JP2018137067A 2018-07-20 2018-07-20 研磨装置および研磨方法 Active JP7121572B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2018137067A JP7121572B2 (ja) 2018-07-20 2018-07-20 研磨装置および研磨方法
TW108124407A TWI808215B (zh) 2018-07-20 2019-07-11 研磨裝置及研磨方法
US16/513,251 US11511386B2 (en) 2018-07-20 2019-07-16 Polishing apparatus and polishing method
KR1020190085568A KR102764016B1 (ko) 2018-07-20 2019-07-16 연마 장치 및 연마 방법
CN201910645186.9A CN110732944B (zh) 2018-07-20 2019-07-17 研磨装置及研磨方法
EP19186661.5A EP3597363B1 (en) 2018-07-20 2019-07-17 Polishing apparatus and polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018137067A JP7121572B2 (ja) 2018-07-20 2018-07-20 研磨装置および研磨方法

Publications (3)

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JP2020011363A JP2020011363A (ja) 2020-01-23
JP2020011363A5 JP2020011363A5 (https=) 2021-07-26
JP7121572B2 true JP7121572B2 (ja) 2022-08-18

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JP2018137067A Active JP7121572B2 (ja) 2018-07-20 2018-07-20 研磨装置および研磨方法

Country Status (6)

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US (1) US11511386B2 (https=)
EP (1) EP3597363B1 (https=)
JP (1) JP7121572B2 (https=)
KR (1) KR102764016B1 (https=)
CN (1) CN110732944B (https=)
TW (1) TWI808215B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112025469B (zh) * 2020-09-10 2022-06-10 西安奕斯伟材料科技有限公司 一种用于角抛光硅片样品的装置、设备及方法
CN114346803A (zh) * 2021-12-31 2022-04-15 莱阳市启明机械有限公司 一种用于新能源汽车锂电池的极板加工装置
WO2024116731A1 (ja) * 2022-12-02 2024-06-06 株式会社荏原製作所 基板処理方法、処理ヘッド、および基板処理装置
JP7833438B2 (ja) * 2023-09-29 2026-03-19 株式会社ジェイテクトマシンシステム 両頭平面研削装置
CN118832504B (zh) * 2024-08-26 2025-03-28 广东瑞兴宏新型建材有限公司 一种人造石英石奢石及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016219850A (ja) 2012-09-24 2016-12-22 株式会社荏原製作所 研磨方法
JP2017209784A (ja) 2014-02-17 2017-11-30 株式会社荏原製作所 研磨装置
JP2018015841A (ja) 2016-07-28 2018-02-01 株式会社荏原製作所 研磨装置
JP2018020390A (ja) 2016-08-02 2018-02-08 株式会社荏原製作所 研磨装置および研磨方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4266255A (en) * 1978-04-26 1981-05-05 Iit Research Institute Capstan drive system for driving tape record media, and having internally mounted transducer head means
JPH08267347A (ja) * 1995-03-31 1996-10-15 Shin Etsu Handotai Co Ltd オリエンテーション・フラットを有するウエーハ面取り部の鏡面研磨方法とその装置
IT1287347B1 (it) * 1996-10-16 1998-08-04 Castelmec Sas Di Rosso Valerio Dispositivo per la sbordatura di lastre di vetro
JPH11203668A (ja) * 1998-01-06 1999-07-30 Hirata Corp ハードディスクのテキスチャ加工装置
JP2001205549A (ja) * 2000-01-25 2001-07-31 Speedfam Co Ltd 基板エッジ部の片面研磨方法およびその装置
JP2002025952A (ja) * 2000-07-07 2002-01-25 Disco Abrasive Syst Ltd 半導体ウエーハの処理方法
JP2002126981A (ja) 2000-10-25 2002-05-08 Sanshin:Kk 円板状部材周縁部研磨装置
CN2512751Y (zh) 2001-12-27 2002-09-25 匡忠云 物料输送皮带纠偏装置
JP4125148B2 (ja) * 2003-02-03 2008-07-30 株式会社荏原製作所 基板処理装置
JP2009518872A (ja) * 2005-12-09 2009-05-07 アプライド マテリアルズ インコーポレイテッド 基板を処理する方法及び装置
TW200908124A (en) * 2007-05-21 2009-02-16 Applied Materials Inc Methods and apparatus for using a bevel polishing head with an efficient tape routing arrangement
JP2009016759A (ja) * 2007-07-09 2009-01-22 Nihon Micro Coating Co Ltd 半導体ウェーハ端面研磨装置およびこれに用いる研磨ヘッド
JP5663295B2 (ja) 2010-01-15 2015-02-04 株式会社荏原製作所 研磨装置、研磨方法、研磨具を押圧する押圧部材
JP5886602B2 (ja) 2011-03-25 2016-03-16 株式会社荏原製作所 研磨装置および研磨方法
JP5889760B2 (ja) * 2012-09-24 2016-03-22 株式会社荏原製作所 基板の研磨異常検出方法および研磨装置
TWI590915B (zh) * 2012-09-24 2017-07-11 荏原製作所股份有限公司 Grinding method
JP6190108B2 (ja) * 2012-11-27 2017-08-30 Mipox株式会社 板ガラス等ワークの周縁部を研磨テープにより研磨する研磨装置及び研磨方法
JP6100541B2 (ja) * 2013-01-30 2017-03-22 株式会社荏原製作所 研磨方法
JP6130677B2 (ja) 2013-01-31 2017-05-17 株式会社荏原製作所 研磨装置および研磨方法
JP5700264B2 (ja) * 2013-10-28 2015-04-15 株式会社東京精密 ウエハエッジ加工装置及びそのエッジ加工方法
JP6568006B2 (ja) * 2016-04-08 2019-08-28 株式会社荏原製作所 研磨装置および研磨方法
JP6412217B2 (ja) * 2016-09-23 2018-10-24 株式会社荏原製作所 研磨装置
CN107627186A (zh) 2017-09-28 2018-01-26 佛山科学技术学院 一种平面抛光机

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016219850A (ja) 2012-09-24 2016-12-22 株式会社荏原製作所 研磨方法
JP2017209784A (ja) 2014-02-17 2017-11-30 株式会社荏原製作所 研磨装置
JP2018015841A (ja) 2016-07-28 2018-02-01 株式会社荏原製作所 研磨装置
JP2018020390A (ja) 2016-08-02 2018-02-08 株式会社荏原製作所 研磨装置および研磨方法

Also Published As

Publication number Publication date
KR20200010073A (ko) 2020-01-30
CN110732944B (zh) 2023-10-20
KR102764016B1 (ko) 2025-02-07
JP2020011363A (ja) 2020-01-23
TW202007474A (zh) 2020-02-16
TWI808215B (zh) 2023-07-11
US20200023486A1 (en) 2020-01-23
US11511386B2 (en) 2022-11-29
EP3597363B1 (en) 2020-09-16
EP3597363A1 (en) 2020-01-22
CN110732944A (zh) 2020-01-31

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