TWI808215B - 研磨裝置及研磨方法 - Google Patents
研磨裝置及研磨方法 Download PDFInfo
- Publication number
- TWI808215B TWI808215B TW108124407A TW108124407A TWI808215B TW I808215 B TWI808215 B TW I808215B TW 108124407 A TW108124407 A TW 108124407A TW 108124407 A TW108124407 A TW 108124407A TW I808215 B TWI808215 B TW I808215B
- Authority
- TW
- Taiwan
- Prior art keywords
- roller
- polishing
- belt
- grinding
- wafer
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 277
- 238000000034 method Methods 0.000 title claims abstract description 13
- 230000002093 peripheral effect Effects 0.000 claims abstract description 82
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000001514 detection method Methods 0.000 claims description 20
- 230000033001 locomotion Effects 0.000 claims description 17
- 238000003825 pressing Methods 0.000 claims description 16
- 230000004323 axial length Effects 0.000 claims description 5
- 238000005259 measurement Methods 0.000 description 19
- 238000010586 diagram Methods 0.000 description 16
- 239000007788 liquid Substances 0.000 description 14
- 238000012545 processing Methods 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 6
- 238000004891 communication Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 6
- 238000005192 partition Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000004696 Poly ether ether ketone Substances 0.000 description 4
- 239000013256 coordination polymer Substances 0.000 description 4
- 238000003708 edge detection Methods 0.000 description 4
- 229920002530 polyetherether ketone Polymers 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
- B24B21/06—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
- B24B21/06—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
- B24B21/08—Pressure shoes; Pressure members, e.g. backing belts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
- B24B21/12—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a contact wheel or roller pressing the belt against the work
- B24B21/14—Contact wheels; Contact rollers; Belt supporting rolls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/18—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/18—Accessories
- B24B21/20—Accessories for controlling or adjusting the tracking or the tension of the grinding belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/18—Accessories
- B24B21/22—Accessories for producing a reciprocation of the grinding belt normal to its direction of movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
- B24B9/102—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass for travelling sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
- B24B9/107—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass for glass plates while they are turning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
- B24C3/08—Abrasive blasting machines or devices; Plants essentially adapted for abrasive blasting of travelling stock or travelling workpieces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Disintegrating Or Milling (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018137067A JP7121572B2 (ja) | 2018-07-20 | 2018-07-20 | 研磨装置および研磨方法 |
| JP2018-137067 | 2018-07-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202007474A TW202007474A (zh) | 2020-02-16 |
| TWI808215B true TWI808215B (zh) | 2023-07-11 |
Family
ID=67314715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108124407A TWI808215B (zh) | 2018-07-20 | 2019-07-11 | 研磨裝置及研磨方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11511386B2 (https=) |
| EP (1) | EP3597363B1 (https=) |
| JP (1) | JP7121572B2 (https=) |
| KR (1) | KR102764016B1 (https=) |
| CN (1) | CN110732944B (https=) |
| TW (1) | TWI808215B (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112025469B (zh) * | 2020-09-10 | 2022-06-10 | 西安奕斯伟材料科技有限公司 | 一种用于角抛光硅片样品的装置、设备及方法 |
| CN114346803A (zh) * | 2021-12-31 | 2022-04-15 | 莱阳市启明机械有限公司 | 一种用于新能源汽车锂电池的极板加工装置 |
| WO2024116731A1 (ja) * | 2022-12-02 | 2024-06-06 | 株式会社荏原製作所 | 基板処理方法、処理ヘッド、および基板処理装置 |
| JP7833438B2 (ja) * | 2023-09-29 | 2026-03-19 | 株式会社ジェイテクトマシンシステム | 両頭平面研削装置 |
| CN118832504B (zh) * | 2024-08-26 | 2025-03-28 | 广东瑞兴宏新型建材有限公司 | 一种人造石英石奢石及其制备方法 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0846525A1 (fr) * | 1996-10-16 | 1998-06-10 | CASTELMEC S.a.s di ROSSO VALERIO & C. | Procédé pour le meulage des bords de feuilles de verre |
| US20020045348A1 (en) * | 2000-07-07 | 2002-04-18 | Kazuhisa Arai | Semiconductor wafer treating method and device for removing deposit on a semiconductor wafer |
| JP4125148B2 (ja) * | 2003-02-03 | 2008-07-30 | 株式会社荏原製作所 | 基板処理装置 |
| JP2009016759A (ja) * | 2007-07-09 | 2009-01-22 | Nihon Micro Coating Co Ltd | 半導体ウェーハ端面研磨装置およびこれに用いる研磨ヘッド |
| JP2014058038A (ja) * | 2013-10-28 | 2014-04-03 | Tokyo Seimitsu Co Ltd | ウエハエッジ加工装置及びそのエッジ加工方法 |
| TW201535503A (zh) * | 2014-02-17 | 2015-09-16 | 荏原製作所股份有限公司 | 研磨裝置及研磨方法 |
| TW201731630A (zh) * | 2012-09-24 | 2017-09-16 | 荏原製作所股份有限公司 | 研磨方法及研磨裝置 |
| JP2018015841A (ja) * | 2016-07-28 | 2018-02-01 | 株式会社荏原製作所 | 研磨装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4266255A (en) * | 1978-04-26 | 1981-05-05 | Iit Research Institute | Capstan drive system for driving tape record media, and having internally mounted transducer head means |
| JPH08267347A (ja) * | 1995-03-31 | 1996-10-15 | Shin Etsu Handotai Co Ltd | オリエンテーション・フラットを有するウエーハ面取り部の鏡面研磨方法とその装置 |
| JPH11203668A (ja) * | 1998-01-06 | 1999-07-30 | Hirata Corp | ハードディスクのテキスチャ加工装置 |
| JP2001205549A (ja) * | 2000-01-25 | 2001-07-31 | Speedfam Co Ltd | 基板エッジ部の片面研磨方法およびその装置 |
| JP2002126981A (ja) | 2000-10-25 | 2002-05-08 | Sanshin:Kk | 円板状部材周縁部研磨装置 |
| CN2512751Y (zh) | 2001-12-27 | 2002-09-25 | 匡忠云 | 物料输送皮带纠偏装置 |
| JP2009518872A (ja) * | 2005-12-09 | 2009-05-07 | アプライド マテリアルズ インコーポレイテッド | 基板を処理する方法及び装置 |
| TW200908124A (en) * | 2007-05-21 | 2009-02-16 | Applied Materials Inc | Methods and apparatus for using a bevel polishing head with an efficient tape routing arrangement |
| JP5663295B2 (ja) | 2010-01-15 | 2015-02-04 | 株式会社荏原製作所 | 研磨装置、研磨方法、研磨具を押圧する押圧部材 |
| JP5886602B2 (ja) | 2011-03-25 | 2016-03-16 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| JP5889760B2 (ja) * | 2012-09-24 | 2016-03-22 | 株式会社荏原製作所 | 基板の研磨異常検出方法および研磨装置 |
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| JP6130677B2 (ja) | 2013-01-31 | 2017-05-17 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| JP6568006B2 (ja) * | 2016-04-08 | 2019-08-28 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| JP6672104B2 (ja) * | 2016-08-02 | 2020-03-25 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| JP6412217B2 (ja) * | 2016-09-23 | 2018-10-24 | 株式会社荏原製作所 | 研磨装置 |
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-
2018
- 2018-07-20 JP JP2018137067A patent/JP7121572B2/ja active Active
-
2019
- 2019-07-11 TW TW108124407A patent/TWI808215B/zh active
- 2019-07-16 KR KR1020190085568A patent/KR102764016B1/ko active Active
- 2019-07-16 US US16/513,251 patent/US11511386B2/en active Active
- 2019-07-17 CN CN201910645186.9A patent/CN110732944B/zh active Active
- 2019-07-17 EP EP19186661.5A patent/EP3597363B1/en not_active Not-in-force
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0846525A1 (fr) * | 1996-10-16 | 1998-06-10 | CASTELMEC S.a.s di ROSSO VALERIO & C. | Procédé pour le meulage des bords de feuilles de verre |
| US20020045348A1 (en) * | 2000-07-07 | 2002-04-18 | Kazuhisa Arai | Semiconductor wafer treating method and device for removing deposit on a semiconductor wafer |
| JP4125148B2 (ja) * | 2003-02-03 | 2008-07-30 | 株式会社荏原製作所 | 基板処理装置 |
| JP2009016759A (ja) * | 2007-07-09 | 2009-01-22 | Nihon Micro Coating Co Ltd | 半導体ウェーハ端面研磨装置およびこれに用いる研磨ヘッド |
| TW201731630A (zh) * | 2012-09-24 | 2017-09-16 | 荏原製作所股份有限公司 | 研磨方法及研磨裝置 |
| JP2014058038A (ja) * | 2013-10-28 | 2014-04-03 | Tokyo Seimitsu Co Ltd | ウエハエッジ加工装置及びそのエッジ加工方法 |
| TW201535503A (zh) * | 2014-02-17 | 2015-09-16 | 荏原製作所股份有限公司 | 研磨裝置及研磨方法 |
| JP2018015841A (ja) * | 2016-07-28 | 2018-02-01 | 株式会社荏原製作所 | 研磨装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20200010073A (ko) | 2020-01-30 |
| JP7121572B2 (ja) | 2022-08-18 |
| CN110732944B (zh) | 2023-10-20 |
| KR102764016B1 (ko) | 2025-02-07 |
| JP2020011363A (ja) | 2020-01-23 |
| TW202007474A (zh) | 2020-02-16 |
| US20200023486A1 (en) | 2020-01-23 |
| US11511386B2 (en) | 2022-11-29 |
| EP3597363B1 (en) | 2020-09-16 |
| EP3597363A1 (en) | 2020-01-22 |
| CN110732944A (zh) | 2020-01-31 |
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