JP7120465B2 - 樹脂多層基板およびその製造方法 - Google Patents
樹脂多層基板およびその製造方法 Download PDFInfo
- Publication number
- JP7120465B2 JP7120465B2 JP2021533989A JP2021533989A JP7120465B2 JP 7120465 B2 JP7120465 B2 JP 7120465B2 JP 2021533989 A JP2021533989 A JP 2021533989A JP 2021533989 A JP2021533989 A JP 2021533989A JP 7120465 B2 JP7120465 B2 JP 7120465B2
- Authority
- JP
- Japan
- Prior art keywords
- coil conductor
- conductor pattern
- overlapping portion
- conductor patterns
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/003—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/323—Insulation between winding turns, between winding layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/042—Printed circuit coils by thin film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
- H01F41/122—Insulating between turns or between winding layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2871—Pancake coils
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019133245 | 2019-07-19 | ||
| JP2019133245 | 2019-07-19 | ||
| PCT/JP2020/027688 WO2021015096A1 (ja) | 2019-07-19 | 2020-07-16 | 樹脂多層基板およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021015096A1 JPWO2021015096A1 (https=) | 2021-01-28 |
| JPWO2021015096A5 JPWO2021015096A5 (https=) | 2022-02-10 |
| JP7120465B2 true JP7120465B2 (ja) | 2022-08-17 |
Family
ID=74192859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021533989A Active JP7120465B2 (ja) | 2019-07-19 | 2020-07-16 | 樹脂多層基板およびその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12288637B2 (https=) |
| JP (1) | JP7120465B2 (https=) |
| CN (1) | CN216721675U (https=) |
| WO (1) | WO2021015096A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7287216B2 (ja) * | 2019-09-24 | 2023-06-06 | Tdk株式会社 | コイル構造体 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008118059A (ja) | 2006-11-07 | 2008-05-22 | Tdk Corp | コモンモードチョークコイル |
| WO2018174133A1 (ja) | 2017-03-24 | 2018-09-27 | 株式会社村田製作所 | 多層基板、アクチュエータおよび多層基板の製造方法 |
| WO2020155161A1 (en) | 2019-02-02 | 2020-08-06 | Zte Corporation | Method and apparatus for performing data packet retransmission in wireless communication system |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02110907A (ja) * | 1988-10-19 | 1990-04-24 | Toko Inc | 積層インダクタとそのインダクタンス調整方法 |
| JP3573483B2 (ja) | 1994-03-25 | 2004-10-06 | Tdk株式会社 | 積層部品とそのインダクタンス調整方法 |
| JP2011082371A (ja) | 2009-10-08 | 2011-04-21 | Sony Corp | 積層インダクタ内蔵の多層配線板、チューナーモジュール、および、電子機器 |
| CN205303100U (zh) * | 2013-07-11 | 2016-06-08 | 株式会社村田制作所 | 电子元器件 |
| JP2015050422A (ja) * | 2013-09-04 | 2015-03-16 | 株式会社村田製作所 | 樹脂多層基板およびその製造方法 |
| WO2015079941A1 (ja) | 2013-11-28 | 2015-06-04 | 株式会社村田製作所 | 多層基板の製造方法、多層基板および電磁石 |
-
2020
- 2020-07-16 WO PCT/JP2020/027688 patent/WO2021015096A1/ja not_active Ceased
- 2020-07-16 CN CN202090000719.4U patent/CN216721675U/zh active Active
- 2020-07-16 JP JP2021533989A patent/JP7120465B2/ja active Active
-
2022
- 2022-01-06 US US17/569,557 patent/US12288637B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008118059A (ja) | 2006-11-07 | 2008-05-22 | Tdk Corp | コモンモードチョークコイル |
| WO2018174133A1 (ja) | 2017-03-24 | 2018-09-27 | 株式会社村田製作所 | 多層基板、アクチュエータおよび多層基板の製造方法 |
| WO2020155161A1 (en) | 2019-02-02 | 2020-08-06 | Zte Corporation | Method and apparatus for performing data packet retransmission in wireless communication system |
Also Published As
| Publication number | Publication date |
|---|---|
| US12288637B2 (en) | 2025-04-29 |
| WO2021015096A1 (ja) | 2021-01-28 |
| JPWO2021015096A1 (https=) | 2021-01-28 |
| CN216721675U (zh) | 2022-06-10 |
| US20220130593A1 (en) | 2022-04-28 |
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