US12288637B2 - Multilayer resin substrate and method of manufacturing multilayer resin substrate - Google Patents

Multilayer resin substrate and method of manufacturing multilayer resin substrate Download PDF

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US12288637B2
US12288637B2 US17/569,557 US202217569557A US12288637B2 US 12288637 B2 US12288637 B2 US 12288637B2 US 202217569557 A US202217569557 A US 202217569557A US 12288637 B2 US12288637 B2 US 12288637B2
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coil conductor
conductor pattern
conductor patterns
overlapping portion
coil
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US20220130593A1 (en
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Rintaro SUGI
Keisuke Araki
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/003—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H01F27/323—Insulation between winding turns, between winding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/042—Printed circuit coils by thin film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12—Insulating of windings
    • H01F41/122—Insulating between turns or between winding layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2871—Pancake coils

Definitions

  • the present invention relates to a multilayer resin substrate in which a plurality of resin layers each include a coil conductor pattern, and relates to a method of manufacturing such a multilayer resin substrate.
  • a multilayer resin substrate including a stacked body provided by stacking a plurality of resin layers, and a coil configured to include a plurality of coil conductor patterns provided in the stacked body and including a winding axis in a stacking direction, has been known.
  • International Publication No. 2018/174133 discloses a multilayer resin substrate including a coil conductor pattern including a wide portion of which a line width is larger than a line width of other coil conductor patterns.
  • the wide portion of the multilayer resin substrate includes a non-overlapping portion that does not overlap with the other coil conductor patterns when viewed in the stacking direction, and the non-overlapping portion is curved so as to be close to the other coil conductor patterns.
  • a flow of resin near the other coil conductor patterns at a time of thermocompression bonding may be significantly reduced or prevented by curved non-overlapping portion, so that displacement, deformation, or the like of the other coil conductor patterns with the flow of resin at the time of thermocompression bonding is significantly reduced or prevented. Therefore, a change in electrical characteristics due to the displacement or the like of the other coil conductor patterns is able to be significantly reduced or prevented.
  • a large number of coil conductor patterns may be overlapped with each other in a stacking direction to form a multi-turn coil in a stacked body.
  • a plurality of coil conductor patterns each including a wide portion are provided and non-overlapping portions of two adjacent wide portions in the stacking direction are overlapped with each other, unwanted capacitance is formed between the non-overlapping portions, and electrical characteristics of the coil may change.
  • Preferred embodiments of the present invention in a configuration including a coil provided with a plurality of non-overlapping portions, provide multilayer resin substrates that each significantly reduce or prevent a change in electrical characteristics of the coil by significantly reducing or preventing unwanted capacitance that may be generated between adjacent non-overlapping portions in a stacking direction, and methods of manufacturing such multilayer resin substrates.
  • a multilayer resin substrate includes a stacked body including a plurality of resin layers stacked on each other, and a coil including a plurality of coil conductor patterns, respectively, on three or more resin layers among the plurality of resin layers, and including a winding axis in a stacking direction of the plurality of resin layers, and the plurality of coil conductor patterns include a first coil conductor pattern, and a plurality of second coil conductor patterns disposed adjacent to the first coil conductor pattern in the stacking direction and including a wide portion with a line width larger than a line width of the first coil conductor pattern, the wide portion includes an overlapping portion that overlaps with an adjacent first coil conductor pattern, when viewed in the stacking direction, and a non-overlapping portion that does not overlap with the adjacent first coil conductor pattern, when viewed in the stacking direction, and the first coil conductor pattern is disposed on one side or each side in the stacking direction of at least one second coil conductor pattern among the plurality of second coil conductor
  • the non-overlapping portions of the two adjacent second coil conductor patterns in the stacking direction significantly protrude in opposite directions in the radial direction of the second coil conductor patterns, so that the non-overlapping portions of the two adjacent second coil conductor patterns in the stacking direction include little overlap. Therefore, unwanted capacitance that may be generated between the non-overlapping portions of the two adjacent second coil conductor patterns in the stacking direction is able to be significantly reduced or prevented.
  • a coil conductor pattern with a small line width is more prone to displacement, deformation, or the like with a flow of resin at a time of thermocompression bonding than a coil conductor pattern with a large line width.
  • the non-overlapping portion of at least one second coil conductor pattern is curved so as to be closer to the first coil conductor pattern than the overlapping portion.
  • a method of manufacturing a multilayer resin substrate includes a coil conductor forming step of forming a plurality of coil conductor patterns including a first coil conductor pattern, and a plurality of second coil conductor patterns including a wide portion with a line width larger than a line width of the first coil conductor pattern, respectively, on three or more resin layers among a plurality of resin layers, a stacking step of stacking, after the coil conductor forming step, the plurality of resin layers such that the wide portion of the plurality of second coil conductor patterns is divided into an overlapping portion that overlaps with the first coil conductor pattern and a non-overlapping portion that does not overlap with the first coil conductor pattern, when viewed in a stacking direction of the plurality of resin layers, and the non-overlapping portions of two adjacent second coil conductor patterns in the stacking direction, when viewed in the stacking direction, protrude in opposite directions to each other in a radial direction of the second coil conductor patterns, with respect to the first coil conductor
  • a multilayer resin substrate capable of significantly reducing or preventing a change in electrical characteristics of the coil due to capacitance to be generated between the non-overlapping portions is able to be easily obtained.
  • multilayer resin substrates that each significantly reduce or prevent a change in electrical characteristics of the coil by significantly reducing or preventing unwanted capacitance that may be generated between adjacent non-overlapping portions in a stacking direction are able to be achieved.
  • FIG. 1 is an external perspective view of a multilayer resin substrate 101 according to a first preferred embodiment of the present invention.
  • FIG. 2 is an exploded plan view of the multilayer resin substrate 101 .
  • FIG. 3 is an A-A cross-sectional view in FIG. 1 .
  • FIG. 4 is a cross-sectional view sequentially showing a process of manufacturing the multilayer resin substrate 101 according to a preferred embodiment of the present invention.
  • FIG. 5 is a cross-sectional view sequentially showing another process of manufacturing the multilayer resin substrate 101 .
  • FIG. 6 is a cross-sectional view sequentially showing another process of manufacturing the multilayer resin substrate 101 .
  • FIG. 7 is an external perspective view of a multilayer resin substrate 102 according to a second preferred embodiment of the present invention.
  • FIG. 8 is an exploded plan view of the multilayer resin substrate 102 .
  • FIG. 9 is a B-B cross-sectional view in FIG. 7 .
  • FIG. 10 is a cross-sectional view sequentially showing a process of manufacturing the multilayer resin substrate 102 according to a preferred embodiment of the present invention.
  • FIG. 11 is an external perspective view of a multilayer resin substrate 103 according to a third preferred embodiment of the present invention.
  • FIG. 12 is an exploded plan view of the multilayer resin substrate 103 .
  • FIG. 13 is a C-C cross-sectional view in FIG. 11 .
  • FIG. 14 is an external perspective view of a multilayer resin substrate 104 according to a fourth preferred embodiment of the present invention.
  • FIG. 15 is a D-D cross-sectional view in FIG. 14 .
  • FIG. 16 is a cross-sectional view of a multilayer resin substrate 105 according to a fifth preferred embodiment of the present invention.
  • FIG. 17 is a cross-sectional view of a multilayer resin substrate 106 according to a sixth preferred embodiment of the present invention.
  • FIG. 1 is an external perspective view of a multilayer resin substrate 101 according to a first preferred embodiment of the present invention.
  • FIG. 2 is an exploded plan view of the multilayer resin substrate 101 .
  • FIG. 3 is an A-A cross-sectional view in FIG. 1 . It is to be noted that, in FIG. 2 , in order to make the structure easy to understand, wide portions WP 1 and WP 2 of second coil conductor patterns CP 21 and CP 22 are indicated by hatching.
  • the multilayer resin substrate 101 includes a stacked body 10 , a coil L 1 , and external electrodes P 1 and P 2 .
  • the coil L 1 includes a plurality of coil conductor patterns (one or more first coil conductor patterns CP 11 and CP 12 , and two or more second coil conductor patterns CP 21 and CP 22 ), and includes a winding axis AX in a Z-axis direction.
  • the stacked body 10 has a rectangular or substantially rectangular parallelepiped shape with a longitudinal direction that coincides with an X-axis direction and includes a first main surface VS 1 and a second main surface VS 2 that face each other.
  • the coil L 1 is provided inside the stacked body 10 , and the external electrodes P 1 and P 2 are exposed (provided near the second main surface VS 2 ) to the second main surface VS 2 of the stacked body 10 .
  • the stacked body 10 is provided by sequentially stacking and thermally compressing resin layers 16 , 15 , 14 , 13 , 12 , and 11 .
  • the first main surface VS 1 and the second main surface VS 2 of the stacked body 10 are surfaces perpendicular or substantially perpendicular to a stacking direction (a Z-axis direction) of the plurality of resin layers 11 , 12 , 13 , 14 , 15 , and 16 .
  • Each of the resin layers 11 to 16 is a flat plate made of a thermoplastic resin and having a rectangular or substantially rectangular shape of which the longitudinal direction coincides with the X-axis direction, and each have flexibility.
  • the resin layers 11 to 16 are sheets made of a liquid crystal polymer (LCP) or a polyether ether ketone (PEEK), for example, as a main material.
  • LCP liquid crystal polymer
  • PEEK polyether ether ketone
  • a second coil conductor pattern CP 21 is provided on a back surface of the resin layer 11 .
  • the second coil conductor pattern CP 21 is a rectangular or substantially rectangular loop-shaped conductor pattern of about one turn wound along an outer periphery of the resin layer 11 .
  • the second coil conductor pattern CP 21 is preferably a conductor pattern such as Cu foil, for example.
  • a first coil conductor pattern CP 11 and a conductor pattern 23 are provided on a back surface of the resin layer 12 .
  • the first coil conductor pattern CP 11 is a rectangular or substantially rectangular loop-shaped conductor pattern of about one turn wound along an outer periphery of the resin layer 12 .
  • the conductor pattern 23 is a rectangular or substantially rectangular conductor pattern disposed in a vicinity of a first corner (a lower left corner of the resin layer 12 in FIG. 2 ) of the resin layer 12 .
  • the first coil conductor pattern CP 11 and the conductor pattern 23 are preferably conductor patterns such as Cu foil, for example.
  • interlayer connection conductors V 4 and V 5 are provided in the resin layer 12 .
  • a second coil conductor pattern CP 22 and a conductor pattern 22 are provided on a back surface of the resin layer 13 .
  • the second coil conductor pattern CP 22 is a rectangular or substantially rectangular loop-shaped conductor pattern of about one turn wound along an outer periphery of the resin layer 13 .
  • the conductor pattern 22 is a rectangular or substantially rectangular conductor pattern disposed in the vicinity of a first corner (a lower left corner of the resin layer 13 in FIG. 2 ) of the resin layer 13 .
  • the second coil conductor pattern CP 22 and the conductor pattern 22 are preferably conductor patterns such as Cu foil, for example.
  • interlayer connection conductors V 3 and V 6 are provided in the resin layer 13 .
  • a first coil conductor pattern CP 12 and a conductor pattern 21 are provided on a back surface of the resin layer 14 .
  • the first coil conductor pattern CP 12 is a rectangular or substantially rectangular loop-shaped conductor pattern of about one turn wound along an outer periphery of the resin layer 14 .
  • the conductor pattern 21 is a rectangular or substantially rectangular conductor pattern disposed in the vicinity of a first corner (a lower left corner of the resin layer 14 in FIG. 2 ) of the resin layer 14 .
  • the first coil conductor pattern CP 12 and the conductor pattern 21 are preferably conductor patterns such as Cu foil, for example.
  • interlayer connection conductors V 2 and V 7 are provided in the resin layer 14 .
  • External electrodes P 1 and P 2 are provided on a back surface of the resin layer 15 .
  • the external electrodes P 1 and P 2 are rectangular or substantially rectangular conductor patterns of which the longitudinal direction coincides with a Y-axis direction.
  • the external electrode P 1 is disposed in the vicinity of a first side (a left side of the resin layer 15 in FIG. 2 ) of the resin layer 15
  • the external electrode P 2 is disposed in the vicinity of a second side (a right side of the resin layer 15 in FIG. 2 ) of the resin layer 15 .
  • the external electrodes P 1 and P 2 may be conductor patterns such as Cu foil, for example.
  • interlayer connection conductors V 1 and V 8 are provided in the resin layer 15 .
  • Opening portions HP 1 and HP 2 are provided in the resin layer 16 .
  • the opening portion HP 1 is a rectangular or substantially rectangular through hole disposed in the vicinity of a first side (a left side of the resin layer 16 in FIG. 2 ) of the resin layer 16
  • the opening portion HP 2 is a rectangular or substantially rectangular through hole disposed in the vicinity of a second side (a right side of the resin layer 16 in FIG. 2 ) of the resin layer 16 .
  • the opening portion HP 1 is provided at a position corresponding to a position of the external electrode P 1
  • the opening portion HP 2 is provided at a position corresponding to a position of the external electrode P 2 . Therefore, even in a case in which the resin layer 16 is stacked on the back surface of the resin layer 15 , the external electrode P 1 is exposed from the opening portion HP 1 to outside, and the external electrode P 2 is exposed from the opening portion HP 2 to the outside.
  • one end of the second coil conductor pattern CP 21 is connected to one end of the first coil conductor pattern CP 11 through the interlayer connection conductor V 5
  • the other end of the first coil conductor pattern CP 11 is connected to one end of the second coil conductor pattern CP 22 through the interlayer connection conductor V 6
  • the other end of the second coil conductor pattern CP 22 is connected to one end of the first coil conductor pattern CP 12 through the interlayer connection conductor V 7 .
  • a plurality of coil conductor patterns (one or more first coil conductor patterns CP 11 and CP 12 , and two or more second coil conductor patterns CP 21 and CP 22 ) provided on the three or more resin layers 11 to 14 and the interlayer connection conductors V 5 , V 6 , and V 7 define the coil L 1 with a winding axis AX in the Z-axis direction.
  • a first end of the coil L 1 is connected to the external electrode P 1
  • a second end of the coil L 1 is connected to the external electrode P 2
  • the other end of the second coil conductor pattern CP 21 is connected to the external electrode P 1 through the conductor patterns 21 , 22 , and 23 and the interlayer connection conductors V 1 , V 2 , V 3 , and V 4
  • the other end of the first coil conductor pattern CP 12 is connected to the external electrode P 2 through the interlayer connection conductor V 8 .
  • the second coil conductor pattern CP 21 is disposed adjacent to the first coil conductor pattern CP 11 in the Z-axis direction.
  • the second coil conductor pattern CP 22 is disposed adjacent to the first coil conductor patterns CP 11 and CP 12 in the Z-axis direction.
  • the first coil conductor patterns CP 11 and CP 12 and the second coil conductor patterns CP 21 and CP 22 are alternately disposed in the Z-axis direction.
  • the second coil conductor pattern CP 21 includes a wide portion WP 1 with a line width larger than a line width of the first coil conductor patterns CP 11 and CP 12 .
  • the entirety or substantially the entirety of the second coil conductor pattern CP 21 according to the present preferred embodiment is the wide portion WP 1 .
  • the wide portion WP 1 includes an overlapping portion OP 1 that overlaps with an adjacent first coil conductor pattern CP 11 when viewed in the Z-axis direction, and a non-overlapping portion NOP 1 that does not overlap with the adjacent first coil conductor pattern CP 11 .
  • the non-overlapping portion NOP 1 according to the present preferred embodiment is curved so as to be closer to the first coil conductor pattern CP 11 than the overlapping portion OP 1 .
  • the second coil conductor pattern CP 21 is an “outermost layer-side coil conductor pattern” located closest to a main surface (the first main surface VS 1 or the second main surface VS 2 ) in the Z-axis direction, among the plurality of coil conductor patterns.
  • the second coil conductor pattern CP 22 includes a wide portion WP 2 with a line width larger than a line width of the first coil conductor patterns CP 11 and CP 12 .
  • the entirety or substantially the entirety of the second coil conductor pattern CP 22 according to the present preferred embodiment is the wide portion WP 2 .
  • the wide portion WP 2 includes an overlapping portion OP 2 that overlaps with adjacent first coil conductor patterns CP 11 and CP 12 when viewed in the Z-axis direction, and a non-overlapping portion NOP 2 that does not overlap with the adjacent first coil conductor patterns CP 11 and CP 12 .
  • the overlapping portion OP 2 also overlaps with the external electrodes P 1 and P 2 , when viewed in the Z-axis direction.
  • the non-overlapping portion NOP 2 does not overlap with the external electrodes P 1 and P 2 , when viewed in the Z-axis direction.
  • the non-overlapping portion NOP 2 according to the present preferred embodiment is curved so as to be closer to the first coil conductor pattern CP 12 and the external electrodes P 1 and P 2 than the overlapping portion OP 2 .
  • the second coil conductor pattern CP 22 is located (disposed closest to the external electrodes P 1 and P 2 in the Z-axis direction) closest to the external electrodes P 1 and P 2 in the Z-axis direction, among the second coil conductor patterns CP 21 and CP 22 .
  • the overlapping portion OP 2 corresponds to an “electrode overlapping portion”
  • the non-overlapping portion NOP 2 corresponds to an “electrode non-overlapping portion”.
  • the non-overlapping portions NOP 1 and NOP 2 of the two adjacent second coil conductor patterns CP 21 and CP 22 in the Z-axis direction protrude in opposite directions in the radial direction (a direction parallel or substantially parallel to an XY plane and a radiation direction around the winding axis AX, for example, the X-axis direction in FIG. 3 ) of the second coil conductor patterns CP 21 and CP 22 , with respect to the first coil conductor patterns CP 11 and CP 12 .
  • the non-overlapping portion NOP 1 of the second coil conductor pattern CP 21 protrudes more to an outer peripheral side than the first coil conductor pattern CP 11
  • the non-overlapping portion NOP 2 of the second coil conductor pattern CP 22 protrudes more to an inner peripheral side than the first coil conductor patterns CP 11 and CP 12 .
  • the non-overlapping portions NOP 1 and NOP 2 of the two adjacent second coil conductor patterns CP 21 and CP 22 in the Z-axis direction do not overlap with each other, when viewed in the Z-axis direction.
  • the wide portion WP 1 of the second coil conductor pattern CP 21 shown in FIG. 3 also protrudes to the inner peripheral side in the radial direction to a certain extent (or in a case in which the wide portion WP 2 of the second coil conductor pattern CP 22 also protrudes to the outer peripheral side in the radial direction to a certain extent)
  • the non-overlapping portions NOP 1 and NOP 2 may partially overlap with each other in the Z-axis direction to generate capacitance.
  • the non-overlapping portions NOP 1 and NOP 2 do not overlap with each other when viewed in the Z-axis direction, so that the unwanted capacitance that may be generated between the wide portions WP 1 and WP 2 is further significantly reduced or prevented.
  • the non-overlapping portion NOP 1 of the outermost layer-side coil conductor pattern (the second coil conductor pattern CP 21 ) is curved so as to be closer to the other coil conductor patterns (the first coil conductor patterns CP 11 and CP 12 , and the second coil conductor pattern CP 22 ) located on an inner layer side.
  • the non-overlapping portion NOP 1 of the outermost layer-side coil conductor pattern is curved so as to be close to the other coil conductor patterns located on the inner layer side, so that the displacement of all of the plurality of coil conductor patterns at the time of thermocompression bonding is significantly reduced or prevented.
  • the multilayer resin substrate of the present invention is not limited to such a configuration.
  • the internal and external shapes of the coil conductor pattern are able to be appropriately changed, and may be a circular or substantially circular shape, an elliptical or substantially elliptical shape, an L shape, or a suitable shape, for example.
  • the non-overlapping portion provided for one certain second coil conductor pattern is preferably located in at least two directions among four orthogonal or substantially orthogonal directions (a positive X direction, a positive Y direction, a negative X direction, and a negative Y direction, for example) when viewed in the Z-axis direction, with respect to the winding axis AX of the coil.
  • the non-overlapping portion is located in each of the two parallel or substantially parallel directions (the positive X direction and the negative X direction, for example) among the four orthogonal or substantially orthogonal directions when viewed in the Z-axis direction, with respect to the winding axis AX, the displacement of the coil with the flow of resin at the time of thermocompression bonding is effectively reduced or prevented.
  • the non-overlapping portion when viewed in the Z-axis direction, is preferably disposed (located in at least three directions among the four orthogonal or substantially orthogonal directions when viewed in the Z-axis direction) so as to surround the winding axis AX.
  • the advantageous effect of significantly reducing or preventing the displacement of a coil by the non-overlapping portion is further increased.
  • the present preferred embodiment shows the multilayer resin substrate 101 in which the non-overlapping portion is provided over an entire or substantially an entire length of one second coil conductor pattern
  • the multilayer resin substrate of the present invention is not limited to such a configuration.
  • the non-overlapping portion provided for one certain second coil conductor pattern is provided over about one-fifth or more of an entire length of the second coil conductor pattern, the advantageous functions and effects of the present invention are obtained.
  • the number of turns of each of the first coil conductor pattern and the second coil conductor pattern is not limited to one and may be different for each coil conductor pattern.
  • the multilayer resin substrate 101 according to the present preferred embodiment is manufactured by, for example, the following non-limiting manufacturing method.
  • FIG. 4 is a cross-sectional view sequentially showing a process of manufacturing the multilayer resin substrate 101 .
  • the “collective substrate” refers to a substrate including a plurality of multilayer resin substrates 101 . The same applies to each cross-sectional view showing the subsequent manufacturing steps of the multilayer resin substrate.
  • the resin layers 11 to 16 are sheets made of a material, such as a liquid crystal polymer (LCP) or a polyether ether ketone (PEEK), for example.
  • LCP liquid crystal polymer
  • PEEK polyether ether ketone
  • a plurality of coil conductor patterns (the first coil conductor patterns CP 11 and CP 12 , and the second coil conductor patterns CP 21 and CP 22 ), the external electrodes P 1 and P 2 , and the like are formed on the resin layers 11 to 15 .
  • metal foil (Cu foil, for example) is laminated on a back surface of the resin layers 11 to 15 , and is patterned by photolithography, for example.
  • the second coil conductor pattern CP 21 is formed on the back surface of the resin layer 11
  • the first coil conductor pattern CP 11 is formed on the back surface of the resin layer 12
  • the second coil conductor pattern CP 22 is formed on the back surface of the resin layer 13
  • the first coil conductor pattern CP 12 is formed on the back surface of the resin layer 14 .
  • the external electrodes P 1 and P 2 are formed on the back of the resin layer 15 .
  • the second coil conductor pattern CP 21 includes a wide portion WP 1 and the second coil conductor pattern CP 22 includes a wide portion WP 2 .
  • the wide portions WP 1 and WP 2 are portions having a line width larger than a line width of the first coil conductor patterns CP 11 and CP 12 .
  • this step of forming the plurality of coil conductor patterns (the first coil conductor patterns CP 11 and CP 12 , and the second coil conductor patterns CP 21 and CP 22 including the wide portions WP 1 and WP 2 ), respectively, on the three or more resin layers 11 to 14 is an example of the “coil conductor forming step”.
  • interlayer connection conductors are formed in the resin layers 11 to 15 .
  • the interlayer connection conductors are provided by forming a hole by laser irradiation, a drill, or the like, for example, and then providing (filling) the hole with conductive paste including, for example, metal powder including Cu and Sn or an alloy including Cu and Sn, and a resin material and solidifying the conductive paste by the subsequent thermocompression bonding.
  • opening portions HP 1 and HP 2 are formed in the resin layer 16 .
  • the opening portion HP 1 is a rectangular or substantially rectangular through hole disposed in the vicinity of a first side (a left side of the resin layer 16 in FIG. 4 ) of the resin layer 16
  • the opening portion HP 2 is a rectangular or substantially rectangular through hole disposed in the vicinity of a second side (a right side of the resin layer 16 in FIG. 4 ) of the resin layer 16 .
  • the opening portions HP 1 and HP 2 are formed by etching the resin layer 16 , for example, by a laser or the like.
  • the opening portions HP 1 and HP 2 may be formed by, for example, punching or the like.
  • the resin layers 16 , 15 , 14 , 13 , 12 , and 11 are sequentially disposed (placed) on each other.
  • the wide portion WP 1 of the second coil conductor pattern CP 21 when viewed in the stacking direction (the Z-axis direction), is divided into the overlapping portion OP 1 that overlaps with the first coil conductor patterns CP 11 and CP 12 , and the non-overlapping portion NOP 1 that does not overlap with the first coil conductor patterns CP 11 and CP 12 .
  • the wide portion WP 2 of the second coil conductor pattern CP 22 when viewed in the Z-axis direction, is divided into the overlapping portion OP 2 that overlaps with the first coil conductor patterns CP 11 and CP 12 , and the non-overlapping portion NOP 2 that does not overlap with the first coil conductor patterns CP 11 and CP 12 .
  • the non-overlapping portions NOP 1 and NOP 2 of the two adjacent second coil conductor patterns CP 21 and CP 22 in the Z-axis direction protrude in opposite directions in the radial direction (the X-axis direction in FIG. 4 , for example) of the second coil conductor patterns CP 21 and CP 22 , with respect to the first coil conductor patterns CP 11 and CP 12 .
  • This step of stacking the plurality of resin layers 11 to 16 after the “coil conductor forming step,” and thus causing the non-overlapping portions NOP 1 and NOP 2 of the two adjacent second coil conductor patterns CP 21 and CP 22 in the Z-axis direction to protrude in the opposite directions in the radial direction, with respect to the first coil conductor patterns CP 11 and CP 12 , is an example of the “stacking step”.
  • the plurality of resin layers 11 to 16 that have been stacked are thermally compressed (collectively pressed) to form the stacked body 10 (the multilayer resin substrate 101 ) shown in ( 3 ) in FIG. 4 .
  • the stacked resin layers 11 to 16 while being heated, are subjected to quasi-isostatic pressing (pressurization) from a direction of the white arrow shown in ( 2 ) in FIG. 4 .
  • the non-overlapping portions NOP 1 and NOP 2 of the second coil conductor patterns CP 21 and CP 22 overlap fewer conductor patterns when viewed in the Z-axis direction than the overlapping portions OP 1 and OP 2 . Therefore, in comparison with the resin near the overlapping portions OP 1 and OP 2 , the resin near the non-overlapping portions NOP 1 and NOP 2 at the time of thermocompression bonding is easy to deform. Accordingly, the non-overlapping portion NOP 1 of the second coil conductor pattern CP 21 is curved so as to be closer to the first coil conductor pattern CP 11 than the overlapping portion OP 1 . In addition, the non-overlapping portion NOP 2 of the second coil conductor pattern CP 22 is curved so as to be closer to the first coil conductor pattern CP 12 than the overlapping portion OP 2 .
  • This step of thermally compressing, after the “stacking step,” the stacked resin layers 11 to 16 to form the stacked body 10 , and causing the non-overlapping portion NOP 1 of at least one second coil conductor pattern CP 21 to be curved so as to be closer to the first coil conductor pattern CP 11 than the overlapping portion OP 1 is an example of the “stacked body forming step.”
  • the multilayer resin substrate 101 capable of significantly reducing or preventing a change in electrical characteristics of the coil due to unwanted capacitance that may be generated between the non-overlapping portions NOP 1 and NOP 2 is able to be easily obtained.
  • the multilayer resin substrate 101 may be manufactured by, for example, the following non-limiting manufacturing method.
  • FIG. 5 is a cross-sectional view sequentially showing another process of manufacturing the multilayer resin substrate 101 .
  • a plurality of resin layers 11 to 16 are prepared. Subsequently, a plurality of coil conductor patterns (the first coil conductor patterns CP 11 and CP 12 , and the second coil conductor patterns CP 21 and CP 22 ), the external electrodes P 1 and P 2 , and the like are formed on the resin layers 11 to 15 (the coil conductor forming step).
  • interlayer connection conductors (interlayer connection conductors V 1 to V 8 in FIG. 2 ) are formed in the resin layers 11 to 15 , and opening portions HP 1 and HP 2 are formed in the resin layer 16 .
  • an opening AP 1 with a predetermined shape is formed in the resin layer 13
  • an opening AP 2 with a predetermined shape is formed in the resin layer 15 .
  • the opening AP 1 is a through hole having the same or substantially the same shape as the non-overlapping portion NOP 1 of the second coil conductor pattern CP 21 .
  • the opening AP 2 is a through hole having the same or substantially the same shape as the non-overlapping portion NOP 2 of the second coil conductor pattern CP 22 .
  • This step of forming, before the “stacking step,” the openings AP 1 and AP 2 of a predetermined shape in the resin layers 13 and 15 (any of the plurality of resin layers 11 to 16 ) is an example of an “opening forming step”.
  • the resin layers 16 , 15 , 14 , 13 , 12 , and 11 are sequentially disposed on each other (the stacking step).
  • the plurality of resin layers 11 to 16 are stacked on each other so that, when viewed in the Z-axis direction, the opening AP 1 may overlap with the non-overlapping portion NOP 1 and the opening AP 2 may overlap with the non-overlapping portion NOP 2 .
  • the plurality of resin layers 11 to 16 are stacked, at least one resin layer 12 is interposed between the non-overlapping portion NOP 1 and the opening AP 1 , and at least one resin layer 14 is interposed between the non-overlapping portion NOP 2 and the opening AP 2 .
  • the plurality of resin layers 11 to 16 that have been stacked are thermally compressed (collectively pressed) to form the stacked body 10 (the multilayer resin substrate 101 ) shown in ( 3 ) in FIG. 5 (the stacked body forming step).
  • the openings (the through holes) AP 1 and AP 2 are provided at positions that overlap with the non-overlapping portions NOP 1 and NOP 2 of the second coil conductor patterns CP 21 and CP 22 , so that a direction in which the non-overlapping portion NOP 1 is curved at the time of thermocompression bonding is easily controlled.
  • an occurrence of a short circuit due to the curve of the non-overlapping portions NOP 1 and NOP 2 at the time of thermocompression bonding is able to be significantly reduced or prevented.
  • the non-overlapping portion NOP 1 may be curved at the time of thermocompression bonding, and thus may come into contact with the first coil conductor pattern CP 11 and cause a short circuit.
  • the present manufacturing method in a state in which the resin layer 12 is interposed between the non-overlapping portion NOP 1 and the opening AP 1 (the resin layer 14 is interposed between the non-overlapping portion NOP 2 and the opening AP 2 ), by thermally compressing the plurality of resin layers 11 to 16 , the short circuit due to the curve of the non-overlapping portions NOP 1 and NOP 2 at the time of thermocompression bonding is able to be significantly reduced or prevented.
  • the multilayer resin substrate 101 may be manufactured by, for example, the following non-limiting manufacturing method.
  • FIG. 6 is a cross-sectional view sequentially showing another process of manufacturing the multilayer resin substrate 101 .
  • a plurality of resin layers 11 to 16 are prepared. Subsequently, a plurality of coil conductor patterns (the first coil conductor patterns CP 11 and CP 12 , and the second coil conductor patterns CP 21 and CP 22 ), the external electrodes P 1 and P 2 , and the like are formed on the resin layers 11 to 15 (the coil conductor forming step).
  • interlayer connection conductors (interlayer connection conductors V 1 to V 8 in FIG. 2 ) are formed in the resin layers 11 to 15 , and opening portions HP 1 and HP 2 are formed in the resin layer 16 .
  • an opening APIA of a predetermined shape is formed in a front surface of the resin layer 12
  • an opening AP 2 A of a predetermined shape is formed in a front surface of the resin layer 14 (the opening forming step).
  • the opening APIA is a recessed portion (a groove) having the same or substantially the same shape as the non-overlapping portion NOP 1 of the second coil conductor pattern CP 21 .
  • the opening AP 2 A is a recessed portion (a groove) having the same or substantially the same shape as the non-overlapping portion NOP 2 of the second coil conductor pattern CP 22 .
  • the resin layers 16 , 15 , 14 , 13 , 12 , and 11 are sequentially disposed on each other (the stacking step).
  • the plurality of resin layers 11 to 16 are stacked on each other so that, when viewed in the Z-axis direction, the opening APIA may overlap with the non-overlapping portion NOP 1 and the opening AP 2 A may overlap with the non-overlapping portion NOP 2 .
  • the plurality of resin layers 11 to 16 that have been stacked are thermally compressed (collectively pressed) to form the stacked body 10 (the multilayer resin substrate 101 ) shown in ( 3 ) in FIG. 6 (the stacked body forming step).
  • the openings AP 1 A and AP 2 A being recessed portions (a groove) are provided at positions that overlap with the non-overlapping portions NOP 1 and NOP 2 .
  • a short circuit due to the non-overlapping portions NOP 1 and NOP 2 curved at the time of thermocompression bonding is able to be significantly reduced or prevented.
  • the curved shape or the like (such as a curvature relative to an overlapping portion) of the non-overlapping portion is able to be adjusted, depending on a shape, a depth, or the like of the openings APIA and AP 2 A being the recessed portions.
  • the multilayer resin substrate is not limited to such a manufacturing method.
  • the opening APIA may be formed, for example, in a back surface of the resin layer 12 or may be formed in both front and back surfaces of the resin layer 12 .
  • the opening APIA may be formed in both front and back surfaces of the resin layer 13 , for example.
  • a second preferred embodiment of the present invention shows an example of a multilayer resin substrate in which a coil (a plurality of coil conductor patterns) does not overlap with an external electrode, when viewed in a stacking direction.
  • FIG. 7 is an external perspective view of a multilayer resin substrate 102 according to the second preferred embodiment of the present invention.
  • FIG. 8 is an exploded plan view of the multilayer resin substrate 102 .
  • FIG. 9 is a B-B cross-sectional view in FIG. 7 .
  • wide portions WP 1 and WP 2 of second coil conductor patterns CP 21 A and CP 22 A are indicated by hatching.
  • the multilayer resin substrate 102 includes a stacked body 10 A, a coil L 2 , and external electrodes P 1 A and P 2 A.
  • the stacked body 10 A has a longer length in the longitudinal direction (the X-axis direction) than the stacked body 10 described in the first preferred embodiment.
  • Other configurations of the stacked body 10 A are the same or substantially the same as the configurations of the stacked body 10 .
  • the stacked body 10 A is provided by sequentially stacking and thermally compressing resin layers 16 a , 15 a , 14 a , 13 a , 12 a , and 11 a .
  • the resin layers 11 a to 16 a have a longer length in the longitudinal direction than the resin layers 11 to 16 described in the first preferred embodiment.
  • Other configurations of the resin layers 11 a to 16 a are the same or substantially the same as the configurations of the resin layers 11 to 16 .
  • the second coil conductor pattern CP 21 A is provided on a back surface of the resin layer 11 a .
  • the second coil conductor pattern CP 21 A has the same or substantially the same shape as the second coil conductor pattern CP 21 described in the first preferred embodiment, and is disposed near the center in the longitudinal direction (the X-axis direction) of the resin layer 11 a.
  • a first coil conductor pattern CP 11 A and a conductor pattern 23 are provided on a back surface of the resin layer 12 .
  • the first coil conductor pattern CP 11 A has the same or substantially the same shape as the first coil conductor pattern CP 11 described in the first preferred embodiment, and is disposed near the center in the longitudinal direction of the resin layer 12 a .
  • the conductor pattern 23 is the same or substantially the same as the conductor pattern described in the first preferred embodiment.
  • a first coil conductor pattern CP 12 A and a conductor pattern 22 are provided on a back surface of the resin layer 13 a .
  • the first coil conductor pattern CP 12 A is a rectangular or substantially rectangular loop-shaped conductor pattern of about one turn, and is disposed near the center in the longitudinal direction of the resin layer 13 a .
  • the conductor pattern 22 is the same or substantially the same as the conductor pattern described in the first preferred embodiment.
  • a second coil conductor pattern CP 22 A and a conductor pattern 21 are provided on a back surface of the resin layer 14 a .
  • the second coil conductor pattern CP 22 A is a rectangular or substantially rectangular loop-shaped conductor pattern of about one turn, and is disposed near the center in the longitudinal direction of the resin layer 14 a .
  • the conductor pattern 21 is the same or substantially the same as the conductor pattern described in the first preferred embodiment.
  • External electrodes P 1 A and P 2 A are provided on a back surface of the resin layer 15 a .
  • the external electrode P 1 A is the same or substantially the same as the external electrode P 1 described in the first preferred embodiment.
  • the external electrode P 2 A is an L-shaped conductor pattern disposed adjacent to or in the vicinity of a second end (a right end of the resin layer 15 a in FIG. 8 ) of the resin layer 15 a .
  • opening portions HP 1 and HP 2 are provided in the resin layer 16 a .
  • the opening portions HP 1 and HP 2 are the same or substantially the same as the opening portions described in the first preferred embodiment.
  • one end of the second coil conductor pattern CP 21 A is connected to one end of the first coil conductor pattern CP 11 A through the interlayer connection conductor V 5
  • the other end of the first coil conductor pattern CP 11 A is connected to one end of the first coil conductor pattern CP 12 A through the interlayer connection conductor V 6
  • the other end of the first coil conductor pattern CP 12 A is connected to one end of the second coil conductor pattern CP 22 A through the interlayer connection conductor V 7 .
  • a plurality of coil conductor patterns (one or more first coil conductor patterns CP 11 A and CP 12 A, and two or more second coil conductor patterns CP 21 A and CP 22 A) provided, respectively, on the three or more resin layers 11 a to 14 a and the interlayer connection conductors V 5 , V 6 , and V 7 define the coil L 2 having a winding axis AX in the Z-axis direction.
  • a first end of the coil L 2 is connected to the external electrode P 1 A, and a second end of the coil L 2 is connected to the external electrode P 2 A.
  • the other end of the second coil conductor pattern CP 21 A is connected to the external electrode P 1 A through the conductor patterns 21 , 22 , and 23 and the interlayer connection conductors V 1 , V 2 , V 3 , and V 4 .
  • the other end of the second coil conductor pattern CP 22 A is connected to the external electrode P 2 A through the interlayer connection conductor V 8 .
  • the second coil conductor pattern CP 21 A, the first coil conductor patterns CP 11 A and CP 12 A, and the second coil conductor pattern CP 22 A are sequentially disposed in a negative Z direction.
  • the second coil conductor pattern CP 21 A is disposed adjacent to the first coil conductor pattern CP 11 A in the Z-axis direction
  • the second coil conductor pattern CP 22 A is disposed adjacent to the first coil conductor pattern CP 12 A in the Z-axis direction.
  • the second coil conductor pattern CP 21 A corresponds to a “first main surface-side coil conductor pattern” located closest to the first main surface VS 1 in the Z-axis direction, among the plurality of coil conductor patterns. As shown in FIG. 9 , the non-overlapping portion NOP 1 of the second coil conductor pattern CP 21 A is curved so as to be close to the other coil conductor patterns (the first coil conductor patterns CP 11 A and CP 12 A) located on the inner layer side.
  • the second coil conductor pattern CP 22 A corresponds to a “second main surface-side coil conductor pattern” located closest to the second main surface VS 2 in the Z-axis direction, among the plurality of coil conductor patterns.
  • the non-overlapping portion NOP 2 of the second coil conductor pattern CP 22 A is curved so as to be close to the other coil conductor patterns (the first coil conductor patterns CP 11 A and CP 12 A) located on the inner layer side.
  • non-overlapping portions NOP 1 and NOP 2 of the two adjacent second coil conductor patterns CP 21 A and CP 22 A in the Z-axis direction protrude in opposite directions in a radial direction (the X-axis direction in FIG. 9 , for example), with respect to the first coil conductor patterns CP 11 A and CP 12 A.
  • the non-overlapping portion NOP 1 of the second coil conductor pattern CP 21 A (the first main surface-side coil conductor pattern) and the non-overlapping portion NOP 2 of the second coil conductor pattern CP 22 A (the second main surface side coil conductor pattern) are curved so as to be close to the first coil conductor patterns CP 11 A and CP 12 A (the other coil conductor patterns) located on the inner layer side.
  • the other coil conductor patterns located on the inner layer side are structured so as to be enclosed by the second coil conductor patterns (the first main surface-side coil conductor pattern and the second main surface-side coil conductor pattern), so that the displacement or the like of all of the plurality of coil conductor patterns at the time of thermocompression bonding is able to be further reduced or prevented.
  • the multilayer resin substrate is not limited to such a configuration.
  • either one of the first main surface-side coil conductor pattern and the second main surface-side coil conductor pattern may be the first coil conductor pattern, or both of the first main surface-side coil conductor pattern and the second main surface-side coil conductor pattern may be the first coil conductor pattern.
  • the multilayer resin substrate 102 may be manufactured by, for example, the following non-limiting manufacturing method.
  • FIG. 10 is a cross-sectional view sequentially showing a process of manufacturing the multilayer resin substrate 102 .
  • a plurality of resin layers 11 a to 16 a are prepared. Subsequently, a plurality of coil conductor patterns (the first coil conductor patterns CP 11 A and CP 12 A, and the second coil conductor patterns CP 21 A and CP 22 A), the external electrodes P 1 A and P 2 A, and the like are formed on the resin layers 11 a to 15 a (the coil conductor forming step).
  • interlayer connection conductors (interlayer connection conductors V 1 to V 8 in FIG. 8 ) are formed in the resin layers 11 a to 15 a , and opening portions HP 1 and HP 2 are formed in the resin layer 16 a.
  • an opening APIA of a predetermined shape is formed in the resin layer 13 a
  • an opening AP 2 A of a predetermined shape is formed in the resin layer 12 a (the opening forming step).
  • the opening AP 1 is a through hole having the same or substantially the same shape as the non-overlapping portion NOP 1 of the second coil conductor pattern CP 21 A shown in ( 2 ) in FIG. 10 .
  • the opening AP 2 is a through hole having substantially the same or substantially the same shape as the non-overlapping portion NOP 2 of the second coil conductor pattern CP 22 A shown in ( 2 ) in FIG. 10 .
  • the resin layers 16 a , 15 a , 14 a , 13 a , 12 a , and 11 a are sequentially stacked on each other (the stacking step).
  • the plurality of resin layers 11 a to 16 a are stacked on each other so that, when viewed in the Z-axis direction, the opening AP 1 may overlap with the non-overlapping portion NOP 1 and the opening AP 2 may overlap with the non-overlapping portion NOP 2 .
  • at least one resin layer 12 a is interposed between the non-overlapping portion NOP 1 and the opening AP 1 .
  • at least one resin layer 13 a is interposed between the non-overlapping portion NOP 2 and the opening AP 2 .
  • the plurality of resin layers 11 a to 16 a that have been stacked are thermally compressed (collectively pressed) to form the stacked body 10 A (the multilayer resin substrate 102 ) shown in ( 3 ) in FIG. 10 (the stacked body forming step).
  • a third preferred embodiment of the present invention shows an example of a multilayer resin substrate including a plurality of spiral-shaped coil conductor patterns.
  • FIG. 11 is an external perspective view of a multilayer resin substrate 103 according to the third preferred embodiment of the present invention.
  • FIG. 12 is an exploded plan view of the multilayer resin substrate 103 .
  • FIG. 13 is a C-C cross-sectional view in FIG. 11 .
  • wide portions WP 1 and WP 2 of second coil conductor patterns CP 21 B and CP 22 B are indicated by hatching.
  • the multilayer resin substrate 103 is different from the multilayer resin substrate 102 according to the second preferred embodiment in that a coil L 3 is provided.
  • the coil L 3 includes a plurality of coil conductor patterns (one or more first coil conductor patterns CP 11 B and CP 12 B, and two or more second coil conductor patterns CP 21 B and CP 22 B).
  • Other configurations of the multilayer resin substrate 103 are the same or substantially the same as the configurations of the multilayer resin substrate 102 .
  • a second coil conductor pattern CP 21 B is provided on a back surface of the resin layer 11 a .
  • the second coil conductor pattern CP 21 B is a rectangular or substantially rectangular spiral-shaped conductor pattern of about 2.75 turns, and is disposed near the center in the longitudinal direction of the resin layer 11 a .
  • the second coil conductor pattern CP 21 B includes a wide portion WP 1 in an outermost peripheral portion (about one turn portion located on an outermost peripheral side) in a radial direction.
  • a first coil conductor pattern CP 11 B and a conductor pattern 23 are provided on a back surface of the resin layer 12 a .
  • the first coil conductor pattern CP 11 B is a rectangular or substantially rectangular spiral-shaped conductor pattern of about three turns, and is disposed near the center in the longitudinal direction of the resin layer 12 a .
  • the conductor pattern 23 is the same or substantially the same as the conductor pattern described in the second preferred embodiment.
  • a first coil conductor pattern CP 12 B and a conductor pattern 22 are provided on a back surface of the resin layer 13 a .
  • the first coil conductor pattern CP 12 B is a rectangular or substantially rectangular spiral-shaped conductor pattern of about three turns, and is disposed near the center in the longitudinal direction of the resin layer 13 a .
  • the conductor pattern 22 is the same or substantially the same as the conductor pattern described in the second preferred embodiment.
  • a second coil conductor pattern CP 22 B and a conductor pattern 21 are provided on a back surface of the resin layer 14 a .
  • the second coil conductor pattern CP 22 B is a rectangular or substantially rectangular spiral-shaped conductor pattern of about three turns, and is disposed near the center in the longitudinal direction of the resin layer 14 a .
  • the second coil conductor pattern CP 22 B includes a wide portion WP 2 in an innermost peripheral portion (about one turn portion located on an innermost peripheral side) in a radial direction.
  • the conductor pattern 21 is the same or substantially the same as the conductor pattern described in the second preferred embodiment.
  • External electrodes P 1 A and P 2 A are provided on a back surface of the resin layer 15 a , and opening portions HP 1 and HP 2 are provided in the resin layer 16 a .
  • the external electrodes P 1 A and P 2 A, and the opening portions HP 1 and HP 2 are the same or substantially the same as the external electrodes and the opening portions described in the second preferred embodiment.
  • one end of the second coil conductor pattern CP 21 B is connected to one end of the first coil conductor pattern CP 11 B through the interlayer connection conductor V 5
  • the other end of the first coil conductor pattern CP 11 B is connected to one end of the first coil conductor pattern CP 12 B through the interlayer connection conductor V 6
  • the other end of the first coil conductor pattern CP 12 B is connected to one end of the second coil conductor pattern CP 22 B through the interlayer connection conductor V 7 .
  • a plurality of coil conductor patterns (the first coil conductor patterns CP 11 B and CP 12 B, and the second coil conductor patterns CP 21 B and CP 22 B) provided, respectively, on the three or more resin layers 11 a to 14 a and the interlayer connection conductors V 5 , V 6 , and V 7 define the coil L 3 having a winding axis AX in the Z-axis direction.
  • a first end of the coil L 3 is connected to the external electrode P 1 A, and a second end of the coil L 3 is connected to the external electrode P 2 A.
  • the other end of the second coil conductor pattern CP 21 B is connected to the external electrode P 1 A through the conductor patterns 21 , 22 , and 23 and the interlayer connection conductors V 1 , V 2 , V 3 , and V 4 .
  • the other end of the second coil conductor pattern CP 22 B is connected to the external electrode P 2 A through the interlayer connection conductor V 8 .
  • the wide portion WP 1 (the outermost peripheral portion) of the second coil conductor pattern CP 21 B when viewed in the Z-axis direction, includes an overlapping portion OP 1 that overlaps with an adjacent first coil conductor pattern CP 11 B in the Z-axis direction, and a non-overlapping portion NOP 1 that does not overlap with the adjacent first coil conductor pattern CP 11 B.
  • the non-overlapping portion NOP 1 of the second coil conductor pattern CP 21 B (the first main surface-side coil conductor pattern) is curved so as to be close to the other coil conductor patterns (the first coil conductor patterns CP 11 B and CP 12 B) located on the inner layer side.
  • the wide portion WP 2 (the innermost peripheral portion) of the second coil conductor pattern CP 22 B when viewed in the Z-axis direction, includes an overlapping portion OP 2 that overlaps with an adjacent first coil conductor pattern CP 12 B in the Z-axis direction, and a non-overlapping portion NOP 2 that does not overlap with the adjacent first coil conductor pattern CP 12 B.
  • the non-overlapping portion NOP 2 of the second coil conductor pattern CP 22 B (the second main surface-side coil conductor pattern) is curved so as to be close to the other coil conductor patterns (the first coil conductor patterns CP 11 B and CP 12 B) located on the inner layer side.
  • the non-overlapping portions NOP 1 and NOP 2 of the two adjacent second coil conductor patterns CP 21 B and CP 22 B in the Z-axis direction protrude in opposite directions in a radial direction, with respect to the first coil conductor patterns CP 11 B and CP 12 B.
  • each of the plurality of coil conductor patterns may have a spiral shape with two or more turns, for example.
  • the plurality of coil conductor patterns are not limited to a configuration in which the plurality of coil conductor patterns each have the same or substantially the same number of turns. In other words, the plurality of coil conductor patterns each may have a different number of turns.
  • both of the first main surface-side coil conductor pattern and the second main surface-side coil conductor pattern are the second coil conductor patterns including a wide portion
  • one of the non-overlapping portions is located at least in the outermost peripheral portion in the radial direction
  • the other of the non-overlapping portions is located at least in the innermost peripheral portion
  • all of the non-overlapping portions are preferably curved so as to close to the other coil conductor patterns located on the inner layer side.
  • the other coil conductor patterns located on the inner layer side are structured so as to be enclosed by the second coil conductor patterns (the first main surface-side coil conductor pattern and the second main surface-side coil conductor pattern), so that the displacement of all of the plurality of coil conductor patterns at the time of thermocompression bonding is able to be further reduced or prevented.
  • the multilayer resin substrate is not limited to such a configuration.
  • the wide portions WP 1 and WP 2 may be provided in portions other than the outermost peripheral portion or the innermost peripheral portion of the spiral-shaped second coil conductor pattern, or the entirety or substantially the entirety of the spiral-shaped second coil conductor pattern may be a wide portion.
  • a fourth preferred embodiment of the present invention shows an example of a multilayer resin substrate including three or more second coil conductor patterns.
  • FIG. 14 is an external perspective view of a multilayer resin substrate 104 according to the fourth preferred embodiment of the present invention.
  • FIG. 15 is a D-D cross-sectional view in FIG. 14 .
  • the multilayer resin substrate 104 includes a stacked body 10 B, a coil L 3 , and external electrodes P 1 A and P 2 A.
  • the external electrodes P 1 A and P 2 A are the same or substantially the same as the external electrodes described in the second preferred embodiment.
  • the stacked body 10 B includes a larger number of layers of the resin layers than the stacked body 10 A described in the second preferred embodiment.
  • Other configurations of the stacked body 10 B are the same or substantially the same as the configurations of the stacked body 10 A.
  • the coil L 3 includes a plurality of coil conductor patterns (three first coil conductor patterns CP 11 B, CP 12 B, and CP 13 B, and three second coil conductor patterns CP 21 B, CP 22 B, and CP 23 B) provided on three or more resin layers, respectively. Although not shown, a first end of the coil L 3 is connected to the external electrode P 1 A, and a second end of the coil L 3 is connected to the external electrode P 2 A.
  • Each of the first coil conductor patterns CP 11 B, CP 12 B, and CP 13 B, and the second coil conductor patterns CP 21 B, CP 22 B, and CP 23 B is a rectangular or substantially rectangular loop-shaped conductor pattern of about one turn. As shown in FIG. 15 , in the present preferred embodiment, the first coil conductor patterns CP 11 B, CP 12 B, and CP 13 B, and the second coil conductor patterns CP 21 B, CP 22 B, and CP 23 B are alternately disposed in the Z-axis direction.
  • the second coil conductor pattern CP 21 B, the first coil conductor pattern CP 11 B, the second coil conductor pattern CP 22 B, and the first coil conductor pattern CP 12 B, the second coil conductor pattern CP 23 B, and the first coil conductor pattern CP 13 B are sequentially disposed in the negative Z direction.
  • the non-overlapping portion NOP 1 of the second coil conductor pattern CP 21 B is curved so as to be closer to the first coil conductor pattern CP 11 B than the overlapping portion OP 1 .
  • the non-overlapping portion NOP 2 of the second coil conductor pattern CP 22 B is curved so as to be closer to the first coil conductor pattern CP 12 B than the overlapping portion OP 2 .
  • the non-overlapping portion NOP 3 of the second coil conductor pattern CP 23 B is curved so as to be closer to the first coil conductor pattern CP 13 B than the overlapping portion OP 3 .
  • non-overlapping portions NOP 1 and NOP 2 of the two adjacent second coil conductor patterns CP 21 B and CP 22 B in the Z-axis direction protrude in opposite directions in a radial direction, with respect to the first coil conductor patterns CP 11 B and CP 12 B.
  • the non-overlapping portions NOP 2 and NOP 3 of the two adjacent second coil conductor patterns CP 22 B and CP 23 B in the Z-axis direction protrude in opposite directions in a radial direction, with respect to the first coil conductor patterns CP 12 B and CP 13 B.
  • the non-overlapping portions NOP 1 and NOP 3 protrude more to the outer peripheral side than the first coil conductor patterns CP 11 B, CP 12 B, and CP 13 B
  • the non-overlapping portion NOP 2 protrudes more to the inner peripheral side than the first coil conductor patterns CP 11 B and CP 12 B.
  • the number of first coil conductor patterns may be three or more, and the number of second coil conductor patterns may be three or more.
  • the number of first coil conductor patterns may be one.
  • the multilayer resin substrate 104 includes a second coil conductor pattern CP 22 B located on the inner layer side, in addition to the first main surface-side coil conductor pattern (the second coil conductor pattern CP 21 B located closest to the first main surface VS 1 in the Z-axis direction, among the second coil conductor patterns) and the second main surface-side coil conductor pattern (the second coil conductor pattern CP 23 B located closest to the second main surface VS 2 in the Z-axis direction, among the second coil conductor patterns).
  • the flow of resin at the time of thermocompression bonding is significantly reduced or prevented not only by the non-overlapping portions NOP 1 and NOP 3 provided for the first main-surface side coil conductor pattern and the second main surface-side coil conductor pattern but by the non-overlapping portion NOP 2 provided for the second coil conductor pattern CP 22 B on the inner layer side. Therefore, the displacement of the entire coil is significantly reduced or prevented in comparison with a case in which the non-overlapping portion is only provided for the first main surface-side coil conductor pattern and the second main surface-side coil conductor pattern.
  • a fifth preferred embodiment of the present invention shows an example of a multilayer resin substrate in which a second coil conductor pattern includes a first portion and a second portion that are located in opposite directions (on opposite sides) with respect to a winding axis, and the first portion and the second portion include non-overlapping portions that protrude in the same direction.
  • FIG. 16 is a cross-sectional view of a multilayer resin substrate 105 according to the fifth preferred embodiment of the present invention.
  • the multilayer resin substrate 105 has the same or substantially the same appearance as the multilayer resin substrate 101 (see FIG. 1 ) according to the first preferred embodiment.
  • FIG. 16 shows an A-A cross-sectional view (see FIG. 1 ) of the multilayer resin substrate 105 .
  • the multilayer resin substrate 105 is different from the multilayer resin substrate 101 in that a coil L 4 is provided.
  • Other configurations of the multilayer resin substrate 105 are the same or substantially the same as the configurations of the multilayer resin substrate 101 .
  • the coil L 4 includes a plurality of coil conductor patterns (first coil conductor patterns CP 11 C and CP 12 C, and second coil conductor patterns CP 21 C and CP 22 C). A first end of the coil L 4 is connected to the external electrode P 1 , and a second end of the coil L 4 is connected to the external electrode P 2 .
  • Each of the first coil conductor patterns CP 11 C and CP 12 C and the second coil conductor patterns CP 21 C and CP 22 C is a rectangular or substantially rectangular loop-shaped conductor pattern of about one turn.
  • the second coil conductor pattern CP 21 C, the first coil conductor pattern CP 11 C, the first coil conductor pattern CP 12 C, and the second coil conductor pattern CP 22 C are disposed in this order in the negative Z direction.
  • the second coil conductor pattern CP 21 C includes a first portion CP 21 C 1 and a second portion CP 21 C 2 .
  • the first portion CP 21 C 1 and the second portion CP 21 C 2 when viewed in the Z-axis direction, are located in opposite directions to each other with respect to a winding axis AX.
  • the first portion CP 21 C 1 includes an overlapping portion OP 11 and a non-overlapping portion NOP 11 .
  • the second portion CP 22 C 2 includes an overlapping portion OP 12 and a non-overlapping portion NOP 12 .
  • the non-overlapping portion NOP 11 and the non-overlapping portion NOP 12 when viewed in the Z-axis direction, protrude in the same direction as each other with respect to the first coil conductor patterns CP 11 C and CP 12 C.
  • the second coil conductor pattern CP 22 C includes a first portion CP 22 C 1 and a second portion CP 22 C 2 .
  • the first portion CP 22 C 1 and the second portion CP 22 C 2 when viewed in the Z-axis direction, are located in opposite directions to each other with respect to the winding axis AX.
  • the first portion CP 22 C 1 includes an overlapping portion OP 21 and a non-overlapping portion NOP 21 .
  • the second portion CP 22 C 2 includes an overlapping portion OP 22 and a non-overlapping portion NOP 22 .
  • the non-overlapping portion NOP 21 and the non-overlapping portion NOP 22 when viewed in the Z-axis direction, protrude in the same direction as each other with respect to the first coil conductor patterns CP 11 C and CP 12 C.
  • the first portion and the second portion of the second coil conductor pattern may face each other, and the non-overlapping portions of the first portion and the second portion may protrude in the same direction in a direction in which the first portion and the second portion face each other, with respect to the first coil conductor pattern.
  • the first portion CP 21 C 1 of the second coil conductor pattern CP 21 C and the first portion CP 22 C 1 of the second coil conductor pattern CP 22 C when viewed in the Z-axis direction, are located in the same direction as each other to the winding axis AX.
  • the non-overlapping portion NOP 11 and the non-overlapping portion NOP 21 when viewed in the Z-axis direction, protrude in the opposite directions to each other with respect to the first coil conductor patterns CP 11 C and CP 12 C.
  • the second portion CP 21 C 2 of the second coil conductor pattern CP 21 C and the second portion CP 22 C 2 of the second coil conductor pattern CP 22 C when viewed in the Z-axis direction, are located in the same direction as each other with respect to the winding axis AX.
  • the non-overlapping portion NOP 12 and the non-overlapping portion NOP 22 when viewed in the Z-axis direction, protrude in the opposite directions to each other with respect to the first coil conductor patterns CP 11 C and CP 12 C.
  • the non-overlapping portion NOP 11 is curved so as to be closer in the Z-axis direction to the first coil conductor patterns CP 11 C and CP 12 C than the overlapping portion OP 11 .
  • the non-overlapping portion NOP 21 is curved so as to be closer in the Z-axis direction to the first coil conductor patterns CP 11 C and CP 12 C than the overlapping portion OP 21 .
  • the non-overlapping portion NOP 11 and the non-overlapping portion NOP 21 protrude in the opposite directions to each other in the Z-axis direction.
  • the non-overlapping portion NOP 12 is curved so as to be closer in the Z-axis direction to the first coil conductor patterns CP 11 C and CP 12 C than the overlapping portion OP 12 .
  • the non-overlapping portion NOP 22 is curved so as to be closer in the Z-axis direction to the first coil conductor patterns CP 11 C and CP 12 C than the overlapping portion OP 22 .
  • the non-overlapping portion NOP 12 and the non-overlapping portion NOP 22 protrude in the opposite directions to each other in the Z-axis direction.
  • the second coil conductor pattern CP 22 includes the first portion and the second portion that are located in the opposite directions with respect to the winding axis AX, and the non-overlapping portions NOP 2 of the first portion and the second portion face each other (see FIG. 3 ).
  • the non-overlapping portion NOP 21 and the non-overlapping portion NOP 22 when viewed in the Z-axis direction, protrude in the same direction as each other with respect to the first coil conductor patterns CP 11 C and CP 12 C. Therefore, the non-overlapping portion NOP 21 and the non-overlapping portion NOP 22 do not face each other. Therefore, according to the fifth preferred embodiment, in comparison with the first preferred embodiment, the unwanted capacitance that may be generated between the non-overlapping portions is able to be significantly reduced or prevented.
  • the non-overlapping portion NOP 11 and the non-overlapping portion NOP 21 when viewed in the Z-axis direction, protrude in the opposite directions to each other, and protrude in the opposite directions to each other also in the Z-axis direction.
  • the non-overlapping portion NOP 12 and the non-overlapping portion NOP 22 Therefore, the first coil conductor patterns CP 11 C and CP 12 C are interposed between and surrounded by the second coil conductor patterns CP 21 C and CP 22 C. As a result, displacement or deformation of the first coil conductor patterns CP 11 C and CP 12 C with the flow of resin at the time of thermocompression bonding is further reduced or prevented.
  • the multilayer resin substrate according to the first to the fifth preferred embodiments includes at least one first coil conductor pattern between the second coil conductor patterns.
  • a sixth preferred embodiment of the present invention shows an example of a multilayer resin substrate including no first coil conductor pattern provided between second coil conductor patterns.
  • FIG. 17 is a cross-sectional view of a multilayer resin substrate 106 according to the sixth preferred embodiment of the present invention.
  • the multilayer resin substrate 106 has the same or substantially the same appearance as the multilayer resin substrate 101 (see FIG. 1 ) according to the first preferred embodiment.
  • FIG. 17 shows an A-A cross-sectional view (see FIG. 1 ) of the multilayer resin substrate 106 .
  • the multilayer resin substrate 106 is different from the multilayer resin substrate 101 in that a coil L 5 is provided.
  • Other configurations of the multilayer resin substrate 106 are the same or substantially the same as the configurations of the multilayer resin substrate 101 .
  • the coil L 5 includes a plurality of coil conductor patterns (first coil conductor patterns CP 11 D and CP 12 D, and second coil conductor patterns CP 21 D and CP 22 D).
  • the second coil conductor pattern CP 21 D, the second coil conductor pattern CP 22 D, the first coil conductor pattern CP 11 D, and the first coil conductor pattern CP 12 D are disposed in this order in the negative Z direction.
  • the first coil conductor pattern is not provided between the adjacent second coil conductor patterns CP 21 D and CP 22 D.
  • the non-overlapping portion NOP 1 of the second coil conductor pattern CP 21 D is curved so as to be closer in the Z-axis direction to the first coil conductor patterns CP 11 D and CP 12 D than the overlapping portion OP 1 of the second coil conductor pattern CP 21 D.
  • the non-overlapping portion NOP 2 of the second coil conductor pattern CP 22 D is curved so as to be closer in the Z-axis direction to the first coil conductor patterns CP 11 D and CP 12 D than the overlapping portion OP 2 of the second coil conductor pattern CP 22 D.
  • unwanted capacitance that may be generated between the non-overlapping portions is able to be significantly reduced or prevented.
  • the second coil conductor patterns are preferably disposed dispersedly, as with the first preferred embodiment.
  • the shape of the stacked body is not limited to such a configuration.
  • the shape of the stacked body is able to be appropriately changed within the scope of producing the functions and advantageous effects of the present invention.
  • the planar shape of the stacked body may be a polygonal or substantially polygonal shape, a circular or substantially circular shape, an elliptical or substantially elliptical shape, an L shape, a U shape, a crank shape, a T shape, a Y-shape, or a suitable shape, for example.
  • each of the above described preferred embodiments provides an example of the stacked body provided by thermally compressing six resin layers
  • the stacked bodies according to preferred embodiments of the present invention are not limited to such a configuration.
  • the number of layers of the resin layers that define the stacked body is able to be appropriately changed.
  • a protective film such as a coverlay film and a resist film, for example, may be provided on a surface of the stacked body.
  • each of the above preferred embodiments of the present invention shows an example of the coil L 1 , the coil L 2 , and the coil L 3 of which the winding axis AX coincides with the Z-axis direction
  • the winding axis AX of the coil and the Z-axis direction are not required to strictly coincide with each other.
  • “including the winding axis in the stacking direction of the plurality of resin layers” includes an example in which the winding axis AX of the coil extending in a range from about minus 30 degrees to about plus 30 degrees with respect to the Z-axis direction, for example.
  • the coil may be partially exposed to the surface of the stacked body.
  • a circuit configuration provided on the multilayer resin substrate is not limited to the configuration described in each of the above preferred embodiments, and is able to be appropriately changed within the scope of producing the functions and advantageous effects of the preferred embodiments of the present invention.
  • a capacitor defined by the conductor pattern or a frequency filter such as various filters (a low-pass filter, a high-pass filter, a band-pass filter, a band-elimination filter), for example, may be provided.
  • various transmission lines (a strip line, a microstrip line, a coplanar line, and the like, for example) may be provided on the multilayer resin substrate.
  • various electronic components such as chip components, for example, may be mounted on or embedded in the multilayer resin substrate.
  • first coil conductor patterns, second coil conductor patterns, and external electrodes are not limited to the configuration described in each of the above preferred embodiments and are able to be appropriately changed within the scope of producing the functions and advantageous effects of the preferred embodiments of the present invention.
  • the external shape of the first coil conductor pattern and the second coil conductor pattern is not be limited to a rectangular or substantially rectangular, and may be a polygonal or substantially polygonal shape, a circular or substantially circular shape, an elliptical or substantially elliptical shape, or a suitable shape, for example.
  • the planar shape of the external electrode may be a polygonal or substantially polygonal shape, a circular or substantially circular shape, an elliptical or substantially elliptical shape, an arc shape, a ring shape, an L shape, a U shape, a T shape, a Y shape, a crank shape, or a suitable shape, for example.
  • the external electrode may be provided on the second main surface VS 2 or may be provided both near the first main surface VS 1 (or on the first main surface VS 1 ) and near the second main surface VS 2 (or on the second main surface VS 2 ).
  • the multilayer resin substrate may include a dummy electrode that is not connected to a circuit.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
US17/569,557 2019-07-19 2022-01-06 Multilayer resin substrate and method of manufacturing multilayer resin substrate Active 2042-06-27 US12288637B2 (en)

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JP2019-133245 2019-07-19
PCT/JP2020/027688 WO2021015096A1 (ja) 2019-07-19 2020-07-16 樹脂多層基板およびその製造方法

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02110907A (ja) 1988-10-19 1990-04-24 Toko Inc 積層インダクタとそのインダクタンス調整方法
JPH07263231A (ja) 1994-03-25 1995-10-13 Tdk Corp 積層部品
JP2008118059A (ja) 2006-11-07 2008-05-22 Tdk Corp コモンモードチョークコイル
JP2011082371A (ja) 2009-10-08 2011-04-21 Sony Corp 積層インダクタ内蔵の多層配線板、チューナーモジュール、および、電子機器
WO2015005161A1 (ja) 2013-07-11 2015-01-15 株式会社村田製作所 電子部品
JP2015050422A (ja) 2013-09-04 2015-03-16 株式会社村田製作所 樹脂多層基板およびその製造方法
WO2015079941A1 (ja) * 2013-11-28 2015-06-04 株式会社村田製作所 多層基板の製造方法、多層基板および電磁石
WO2018174133A1 (ja) * 2017-03-24 2018-09-27 株式会社村田製作所 多層基板、アクチュエータおよび多層基板の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114008951B (zh) 2019-02-02 2023-11-03 中兴通讯股份有限公司 用于在无线通信系统中执行数据包重传的方法和装置

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02110907A (ja) 1988-10-19 1990-04-24 Toko Inc 積層インダクタとそのインダクタンス調整方法
JPH07263231A (ja) 1994-03-25 1995-10-13 Tdk Corp 積層部品
JP2008118059A (ja) 2006-11-07 2008-05-22 Tdk Corp コモンモードチョークコイル
JP2011082371A (ja) 2009-10-08 2011-04-21 Sony Corp 積層インダクタ内蔵の多層配線板、チューナーモジュール、および、電子機器
WO2015005161A1 (ja) 2013-07-11 2015-01-15 株式会社村田製作所 電子部品
US20160049237A1 (en) 2013-07-11 2016-02-18 Murata Manufacturing Co., Ltd. Electronic component
JP2015050422A (ja) 2013-09-04 2015-03-16 株式会社村田製作所 樹脂多層基板およびその製造方法
WO2015079941A1 (ja) * 2013-11-28 2015-06-04 株式会社村田製作所 多層基板の製造方法、多層基板および電磁石
US20160027578A1 (en) 2013-11-28 2016-01-28 Murata Manufacturing Co., Ltd. Method of manufacturing multilayer board, multilayer board, and electromagnet
WO2018174133A1 (ja) * 2017-03-24 2018-09-27 株式会社村田製作所 多層基板、アクチュエータおよび多層基板の製造方法
US20190341180A1 (en) 2017-03-24 2019-11-07 Murata Manufacturing Co., Ltd. Multilayer substrate, actuator, and method of manufacturing multilayer substrate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Official Communication issued in International Patent Application No. PCT/JP2020/027688, mailed on Sep. 24, 2020.

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US20220130593A1 (en) 2022-04-28

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