JP7112205B2 - 分割装置 - Google Patents

分割装置 Download PDF

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Publication number
JP7112205B2
JP7112205B2 JP2018022866A JP2018022866A JP7112205B2 JP 7112205 B2 JP7112205 B2 JP 7112205B2 JP 2018022866 A JP2018022866 A JP 2018022866A JP 2018022866 A JP2018022866 A JP 2018022866A JP 7112205 B2 JP7112205 B2 JP 7112205B2
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JP
Japan
Prior art keywords
tape
pin
heater
ring
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018022866A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019140267A (ja
Inventor
篤 植木
孝行 政田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2018022866A priority Critical patent/JP7112205B2/ja
Priority to TW108103552A priority patent/TWI777030B/zh
Priority to KR1020190014896A priority patent/KR102698668B1/ko
Priority to CN201910112611.8A priority patent/CN110148572B/zh
Publication of JP2019140267A publication Critical patent/JP2019140267A/ja
Application granted granted Critical
Publication of JP7112205B2 publication Critical patent/JP7112205B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Seal Device For Vehicle (AREA)
JP2018022866A 2018-02-13 2018-02-13 分割装置 Active JP7112205B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018022866A JP7112205B2 (ja) 2018-02-13 2018-02-13 分割装置
TW108103552A TWI777030B (zh) 2018-02-13 2019-01-30 分割裝置
KR1020190014896A KR102698668B1 (ko) 2018-02-13 2019-02-08 분할 장치
CN201910112611.8A CN110148572B (zh) 2018-02-13 2019-02-13 分割装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018022866A JP7112205B2 (ja) 2018-02-13 2018-02-13 分割装置

Publications (2)

Publication Number Publication Date
JP2019140267A JP2019140267A (ja) 2019-08-22
JP7112205B2 true JP7112205B2 (ja) 2022-08-03

Family

ID=67588185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018022866A Active JP7112205B2 (ja) 2018-02-13 2018-02-13 分割装置

Country Status (4)

Country Link
JP (1) JP7112205B2 (zh)
KR (1) KR102698668B1 (zh)
CN (1) CN110148572B (zh)
TW (1) TWI777030B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112908922A (zh) * 2021-01-28 2021-06-04 蔡德昌 一种重复使用的透明硬质载具与待减薄晶圆片之贴合及剥离工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013062414A (ja) 2011-09-14 2013-04-04 Tokyo Seimitsu Co Ltd ダイボンダ
JP2013239557A (ja) 2012-05-15 2013-11-28 Disco Abrasive Syst Ltd チップ間隔維持装置
JP2014027079A (ja) 2012-07-26 2014-02-06 Azbil Corp ピックアップ方法およびピックアップ装置
JP2015216151A (ja) 2014-05-08 2015-12-03 株式会社ディスコ チップ間隔維持装置及びチップ間隔維持方法
US20170352572A1 (en) 2016-06-07 2017-12-07 Infineon Technologies Ag Wafer expander

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI225279B (en) * 2002-03-11 2004-12-11 Hitachi Ltd Semiconductor device and its manufacturing method
JP4574251B2 (ja) * 2003-09-17 2010-11-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5294358B2 (ja) * 2012-01-06 2013-09-18 古河電気工業株式会社 ウエハ加工用テープ及びこれを使用した半導体装置の製造方法
JP2014107292A (ja) * 2012-11-22 2014-06-09 Disco Abrasive Syst Ltd チップ間隔維持装置
JP6570942B2 (ja) * 2015-09-18 2019-09-04 株式会社ディスコ 分割装置及びウエーハの分割方法
SG11201800287UA (en) * 2016-03-31 2018-02-27 Furukawa Electric Co Ltd Removable adhesive sheet for semiconductor processing

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013062414A (ja) 2011-09-14 2013-04-04 Tokyo Seimitsu Co Ltd ダイボンダ
JP2013239557A (ja) 2012-05-15 2013-11-28 Disco Abrasive Syst Ltd チップ間隔維持装置
JP2014027079A (ja) 2012-07-26 2014-02-06 Azbil Corp ピックアップ方法およびピックアップ装置
JP2015216151A (ja) 2014-05-08 2015-12-03 株式会社ディスコ チップ間隔維持装置及びチップ間隔維持方法
US20170352572A1 (en) 2016-06-07 2017-12-07 Infineon Technologies Ag Wafer expander

Also Published As

Publication number Publication date
KR102698668B1 (ko) 2024-08-23
CN110148572B (zh) 2024-03-15
KR20190098059A (ko) 2019-08-21
JP2019140267A (ja) 2019-08-22
TWI777030B (zh) 2022-09-11
CN110148572A (zh) 2019-08-20
TW201935538A (zh) 2019-09-01

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