JP7080766B2 - 液面検出センサと組み合わせて使用されるセンサターゲットカバー、および湿式処理装置 - Google Patents

液面検出センサと組み合わせて使用されるセンサターゲットカバー、および湿式処理装置 Download PDF

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Publication number
JP7080766B2
JP7080766B2 JP2018148638A JP2018148638A JP7080766B2 JP 7080766 B2 JP7080766 B2 JP 7080766B2 JP 2018148638 A JP2018148638 A JP 2018148638A JP 2018148638 A JP2018148638 A JP 2018148638A JP 7080766 B2 JP7080766 B2 JP 7080766B2
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Japan
Prior art keywords
substrate
wall structure
wall
liquid level
target cover
Prior art date
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JP2018148638A
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English (en)
Japanese (ja)
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JP2020024137A5 (https=
JP2020024137A (ja
Inventor
直樹 豊村
充 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2018148638A priority Critical patent/JP7080766B2/ja
Priority to SG10201907189RA priority patent/SG10201907189RA/en
Priority to US16/532,493 priority patent/US11846536B2/en
Publication of JP2020024137A publication Critical patent/JP2020024137A/ja
Publication of JP2020024137A5 publication Critical patent/JP2020024137A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
    • G01F23/28—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring the variations of parameters of electromagnetic or acoustic waves applied directly to the liquid or fluent solid material
    • G01F23/284—Electromagnetic waves
    • G01F23/292—Light, e.g. infrared or ultraviolet
    • G01F23/2921—Light, e.g. infrared or ultraviolet for discrete levels

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Measurement Of Levels Of Liquids Or Fluent Solid Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2018148638A 2018-08-07 2018-08-07 液面検出センサと組み合わせて使用されるセンサターゲットカバー、および湿式処理装置 Active JP7080766B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018148638A JP7080766B2 (ja) 2018-08-07 2018-08-07 液面検出センサと組み合わせて使用されるセンサターゲットカバー、および湿式処理装置
SG10201907189RA SG10201907189RA (en) 2018-08-07 2019-08-05 Sensor target cover used in combination with liquid level detection sensor, wet processing device, substrate processing device, and sensor assembly
US16/532,493 US11846536B2 (en) 2018-08-07 2019-08-06 Sensor target cover used in combination with liquid level detection sensor, wet processing device, substrate processing device, and sensor assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018148638A JP7080766B2 (ja) 2018-08-07 2018-08-07 液面検出センサと組み合わせて使用されるセンサターゲットカバー、および湿式処理装置

Publications (3)

Publication Number Publication Date
JP2020024137A JP2020024137A (ja) 2020-02-13
JP2020024137A5 JP2020024137A5 (https=) 2021-05-20
JP7080766B2 true JP7080766B2 (ja) 2022-06-06

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Family Applications (1)

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JP2018148638A Active JP7080766B2 (ja) 2018-08-07 2018-08-07 液面検出センサと組み合わせて使用されるセンサターゲットカバー、および湿式処理装置

Country Status (3)

Country Link
US (1) US11846536B2 (https=)
JP (1) JP7080766B2 (https=)
SG (1) SG10201907189RA (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112303883A (zh) * 2020-09-23 2021-02-02 温州水琳黛贸易有限公司 一种利用积蓄冷凝水节能环保的空调
JP7597472B2 (ja) * 2020-09-25 2024-12-10 東京エレクトロン株式会社 研削装置
US12198944B2 (en) * 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers
JP6892176B1 (ja) * 2020-11-19 2021-06-23 不二越機械工業株式会社 ワーク洗浄装置
JP2024529124A (ja) * 2021-08-09 2024-08-01 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 超臨界流体に基づく乾燥装置および方法
CN115771817B (zh) * 2022-11-23 2026-03-17 安徽启电自动化科技有限公司 一种投入式液位变送器收放结构

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080011970A1 (en) 2006-07-13 2008-01-17 Dataonline, L.L.C. Non-contact sensor for detecting material level in a container

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Publication number Priority date Publication date Assignee Title
JPH0669177B2 (ja) 1983-02-23 1994-08-31 住友電気工業株式会社 伝送制御方式
JPH0329707Y2 (https=) * 1984-08-22 1991-06-25
US4946242A (en) * 1987-08-28 1990-08-07 Hitachi, Ltd. Optical part including integral combination of optical fiber and light emitting or receiving element and method of manufacturing the same
JPH1092781A (ja) * 1996-06-04 1998-04-10 Ebara Corp 基板の搬送方法及び装置
US5804831A (en) * 1997-05-15 1998-09-08 Casco Products Corporation Liquid level sensor for use in a hot, pressurized liquid
KR100354456B1 (ko) 1999-10-27 2002-09-30 주식회사 기가트론 습식세정 및 건조장치와 그 방법
WO2004008086A1 (en) * 2002-07-16 2004-01-22 Strube, Inc. Liquid level sensor using fluorescence in an optical waveguide
JP3673254B2 (ja) * 2002-11-14 2005-07-20 株式会社プレテック 液面検出センサ及び液面の検出方法
IT1398785B1 (it) * 2009-08-04 2013-03-18 Illinois Tool Works Sensore ottico per rilevare il livello di liquido in un contenitore, in particolare per un contenitore asportabile per un elettrodomestico e lente e metodo associati
JP6295107B2 (ja) * 2014-03-07 2018-03-14 株式会社荏原製作所 基板処理システムおよび基板処理方法
JP2015230940A (ja) 2014-06-04 2015-12-21 株式会社荏原製作所 基板処理モジュール
TWI653701B (zh) * 2014-06-09 2019-03-11 日商荏原製作所股份有限公司 Substrate attaching and detaching portion for substrate holder, wet substrate processing device including the substrate attaching and detaching portion, substrate processing device, and substrate transfer method
US10246348B2 (en) * 2015-06-08 2019-04-02 Rayvio Corporation Ultraviolet disinfection system
KR102522960B1 (ko) 2015-12-14 2023-04-20 세메스 주식회사 기판 처리 장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080011970A1 (en) 2006-07-13 2008-01-17 Dataonline, L.L.C. Non-contact sensor for detecting material level in a container

Also Published As

Publication number Publication date
JP2020024137A (ja) 2020-02-13
SG10201907189RA (en) 2020-03-30
US20200049546A1 (en) 2020-02-13
US11846536B2 (en) 2023-12-19

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