JP7065381B2 - 光反射体、ベース体、発光装置及びベース体の製造方法 - Google Patents

光反射体、ベース体、発光装置及びベース体の製造方法 Download PDF

Info

Publication number
JP7065381B2
JP7065381B2 JP2017123600A JP2017123600A JP7065381B2 JP 7065381 B2 JP7065381 B2 JP 7065381B2 JP 2017123600 A JP2017123600 A JP 2017123600A JP 2017123600 A JP2017123600 A JP 2017123600A JP 7065381 B2 JP7065381 B2 JP 7065381B2
Authority
JP
Japan
Prior art keywords
light reflector
light
less
molding material
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017123600A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018160654A (ja
Inventor
太輔 山下
靖詔 棚橋
貴英 鈴木
大輔 下田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of JP2018160654A publication Critical patent/JP2018160654A/ja
Application granted granted Critical
Publication of JP7065381B2 publication Critical patent/JP7065381B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C08J3/126—Polymer particles coated by polymer, e.g. core shell structures
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/10—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/06—Unsaturated polyesters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Physics & Mathematics (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
JP2017123600A 2016-07-19 2017-06-23 光反射体、ベース体、発光装置及びベース体の製造方法 Active JP7065381B2 (ja)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2016141592 2016-07-19
JP2016141592 2016-07-19
JP2016144758 2016-07-22
JP2016144758 2016-07-22
JP2016196004 2016-10-03
JP2016196004 2016-10-03
JP2017072700 2017-03-31
JP2017072687 2017-03-31
JP2017072700 2017-03-31
JP2017072687 2017-03-31

Publications (2)

Publication Number Publication Date
JP2018160654A JP2018160654A (ja) 2018-10-11
JP7065381B2 true JP7065381B2 (ja) 2022-05-12

Family

ID=61028268

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017123601A Active JP7065382B2 (ja) 2016-07-19 2017-06-23 光反射体用成形材料及びその製造方法、光反射体、ベース体及びその製造方法、並びに発光装置
JP2017123600A Active JP7065381B2 (ja) 2016-07-19 2017-06-23 光反射体、ベース体、発光装置及びベース体の製造方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2017123601A Active JP7065382B2 (ja) 2016-07-19 2017-06-23 光反射体用成形材料及びその製造方法、光反射体、ベース体及びその製造方法、並びに発光装置

Country Status (3)

Country Link
JP (2) JP7065382B2 (zh)
KR (2) KR20180009720A (zh)
TW (2) TWI723193B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102624113B1 (ko) * 2018-06-08 2024-01-12 서울바이오시스 주식회사 발광 소자 패키지 및 이의 제조 방법
JP7291507B2 (ja) * 2019-03-22 2023-06-15 日本特殊陶業株式会社 圧粉磁心
EP4011981A4 (en) * 2019-08-08 2023-08-30 Sumitomo Bakelite Co.Ltd. THERMOSETTING RESIN COMPOSITION
JP7547882B2 (ja) * 2020-09-11 2024-09-10 味の素株式会社 樹脂組成物
JPWO2022064986A1 (zh) * 2020-09-25 2022-03-31

Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002294070A (ja) 2001-03-30 2002-10-09 Otsuka Chem Co Ltd 反射板用樹脂組成物
JP2007059335A (ja) 2005-08-26 2007-03-08 Toshiba Corp 電気絶縁材料および注型品
JP2007161830A (ja) 2005-12-13 2007-06-28 Sekisui Chem Co Ltd エポキシ系樹脂組成物
WO2009098967A1 (ja) 2008-02-08 2009-08-13 Nichia Corporation 発光装置
JP2009256420A (ja) 2008-04-14 2009-11-05 Idemitsu Kosan Co Ltd 反射体用シンジオタクチックポリスチレン樹脂組成物及びそれを用いた反射体
JP2010059241A (ja) 2008-09-01 2010-03-18 Shin-Etsu Chemical Co Ltd 半導体装置封止用組成物
JP2010138347A (ja) 2008-12-15 2010-06-24 Nichia Corp 熱硬化性エポキシ樹脂組成物及び半導体装置
JP2011049246A (ja) 2009-08-25 2011-03-10 Toyoda Gosei Co Ltd 発光装置の製造方法
JP2012082394A (ja) 2010-09-17 2012-04-26 Toray Ind Inc 炭素繊維織物プリプレグおよび炭素繊維強化複合材料
WO2013008680A1 (ja) 2011-07-13 2013-01-17 株式会社ダイセル 硬化性エポキシ樹脂組成物
JP2013067786A (ja) 2011-09-08 2013-04-18 Unitika Ltd ポリアミド樹脂組成物およびそれからなる成形体
JP2013221075A (ja) 2012-04-16 2013-10-28 Shin-Etsu Chemical Co Ltd Ｌｅｄのリフレクター用熱硬化性シリコーン樹脂組成物並びにこれを用いたｌｅｄ用リフレクター及び光半導体装置
JP2013221077A (ja) 2012-04-16 2013-10-28 Shin-Etsu Chemical Co Ltd Ｌｅｄのリフレクター用熱硬化性シリコーン樹脂組成物並びにこれを用いたｌｅｄ用リフレクター及び光半導体装置
JP2014037461A (ja) 2012-08-14 2014-02-27 Nippon Carbide Ind Co Inc 光反射用樹脂組成物
WO2014196378A1 (ja) 2013-06-03 2014-12-11 東洋紡株式会社 ポリエステル樹脂、及びそれを使用した表面実装型ｌｅｄ反射板用ポリエステル樹脂組成物
WO2015004927A1 (ja) 2013-07-12 2015-01-15 パナソニックＩｐマネジメント株式会社 光反射体用樹脂成形材料、光反射体及び照明器具
JP2015086290A (ja) 2013-10-30 2015-05-07 株式会社カネカ 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ
WO2015091478A1 (en) 2013-12-20 2015-06-25 Solvay Specialty Polymers Usa, Llc Polyamide compositions with improved whiteness retention after heat aging
WO2016002192A1 (ja) 2014-06-30 2016-01-07 三井化学株式会社 反射材用樹脂組成物およびそれを含む反射板
WO2016017818A1 (ja) 2014-08-01 2016-02-04 大日本印刷株式会社 リフレクター及び樹脂組成物
JP2016054251A (ja) 2014-09-04 2016-04-14 日亜化学工業株式会社 パッケージ及びそれを用いた発光装置
JP2016100350A (ja) 2014-11-18 2016-05-30 日亜化学工業株式会社 複合基板並びに発光装置及びその製造方法
JP2016122677A (ja) 2014-12-24 2016-07-07 日亜化学工業株式会社 パッケージ及び発光装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005050072A1 (de) * 2005-10-19 2007-04-26 Bayer Materialscience Ag Lichtstreuende Folien sowie deren Verwendung in Flachbildschirmen
WO2011118109A1 (ja) * 2010-03-23 2011-09-29 株式会社朝日ラバー 可撓性反射基材、その製造方法及びその反射基材に用いる原材料組成物
CN103068917A (zh) * 2010-12-20 2013-04-24 株式会社大赛璐 固化性环氧树脂组合物及使用其的光半导体装置
US9184355B2 (en) * 2011-06-27 2015-11-10 Daicel Corporation Curable resin composition for reflection of light, and optical semiconductor device
JP5682497B2 (ja) * 2011-07-29 2015-03-11 信越化学工業株式会社 表面実装型発光装置の製造方法及びリフレクター基板
CN106575696B (zh) * 2014-08-04 2019-01-18 松下知识产权经营株式会社 光反射体用成形材料
US20170254936A1 (en) * 2014-08-22 2017-09-07 Konica Minolta, Inc. Light reflecting film, production method for light reflecting film, decorative molding method for light reflecting film, laminated glass, and curved surface body

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002294070A (ja) 2001-03-30 2002-10-09 Otsuka Chem Co Ltd 反射板用樹脂組成物
JP2007059335A (ja) 2005-08-26 2007-03-08 Toshiba Corp 電気絶縁材料および注型品
JP2007161830A (ja) 2005-12-13 2007-06-28 Sekisui Chem Co Ltd エポキシ系樹脂組成物
WO2009098967A1 (ja) 2008-02-08 2009-08-13 Nichia Corporation 発光装置
JP2009256420A (ja) 2008-04-14 2009-11-05 Idemitsu Kosan Co Ltd 反射体用シンジオタクチックポリスチレン樹脂組成物及びそれを用いた反射体
JP2010059241A (ja) 2008-09-01 2010-03-18 Shin-Etsu Chemical Co Ltd 半導体装置封止用組成物
JP2010138347A (ja) 2008-12-15 2010-06-24 Nichia Corp 熱硬化性エポキシ樹脂組成物及び半導体装置
JP2011049246A (ja) 2009-08-25 2011-03-10 Toyoda Gosei Co Ltd 発光装置の製造方法
JP2012082394A (ja) 2010-09-17 2012-04-26 Toray Ind Inc 炭素繊維織物プリプレグおよび炭素繊維強化複合材料
WO2013008680A1 (ja) 2011-07-13 2013-01-17 株式会社ダイセル 硬化性エポキシ樹脂組成物
JP2013067786A (ja) 2011-09-08 2013-04-18 Unitika Ltd ポリアミド樹脂組成物およびそれからなる成形体
JP2013221075A (ja) 2012-04-16 2013-10-28 Shin-Etsu Chemical Co Ltd Ｌｅｄのリフレクター用熱硬化性シリコーン樹脂組成物並びにこれを用いたｌｅｄ用リフレクター及び光半導体装置
JP2013221077A (ja) 2012-04-16 2013-10-28 Shin-Etsu Chemical Co Ltd Ｌｅｄのリフレクター用熱硬化性シリコーン樹脂組成物並びにこれを用いたｌｅｄ用リフレクター及び光半導体装置
JP2014037461A (ja) 2012-08-14 2014-02-27 Nippon Carbide Ind Co Inc 光反射用樹脂組成物
WO2014196378A1 (ja) 2013-06-03 2014-12-11 東洋紡株式会社 ポリエステル樹脂、及びそれを使用した表面実装型ｌｅｄ反射板用ポリエステル樹脂組成物
WO2015004927A1 (ja) 2013-07-12 2015-01-15 パナソニックＩｐマネジメント株式会社 光反射体用樹脂成形材料、光反射体及び照明器具
JP2015086290A (ja) 2013-10-30 2015-05-07 株式会社カネカ 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ
WO2015091478A1 (en) 2013-12-20 2015-06-25 Solvay Specialty Polymers Usa, Llc Polyamide compositions with improved whiteness retention after heat aging
WO2016002192A1 (ja) 2014-06-30 2016-01-07 三井化学株式会社 反射材用樹脂組成物およびそれを含む反射板
WO2016017818A1 (ja) 2014-08-01 2016-02-04 大日本印刷株式会社 リフレクター及び樹脂組成物
JP2016054251A (ja) 2014-09-04 2016-04-14 日亜化学工業株式会社 パッケージ及びそれを用いた発光装置
JP2016100350A (ja) 2014-11-18 2016-05-30 日亜化学工業株式会社 複合基板並びに発光装置及びその製造方法
JP2016122677A (ja) 2014-12-24 2016-07-07 日亜化学工業株式会社 パッケージ及び発光装置の製造方法

Also Published As

Publication number Publication date
JP2018160654A (ja) 2018-10-11
JP7065382B2 (ja) 2022-05-12
KR20180009721A (ko) 2018-01-29
KR20180009720A (ko) 2018-01-29
TWI737758B (zh) 2021-09-01
JP2018160655A (ja) 2018-10-11
TW201829587A (zh) 2018-08-16
TW201829593A (zh) 2018-08-16
TWI723193B (zh) 2021-04-01

Similar Documents

Publication Publication Date Title
JP7065381B2 (ja) 光反射体、ベース体、発光装置及びベース体の製造方法
JP6145953B2 (ja) リフレクターの製造に用いられる乾式不飽和ポリエステル樹脂組成物、粒状物、ペレット、粉砕加工物、及びリフレクター
WO2012053260A1 (ja) 表面実装型発光装置
JP5308601B1 (ja) Ｌｅｄリフレクター用不飽和ポリエステル樹脂組成物とそれを用いた粒状物、タブレット、ｌｅｄリフレクター、表面実装型ｌｅｄ発光装置、ｌｅｄ照明
JP2020067603A (ja) 光反射体用成形材料、光反射体及び発光装置
JP2013153144A (ja) Ｌｅｄリフレクター用不飽和ポリエステル樹脂組成物とそれを用いた粒状物、タブレット、ｌｅｄリフレクター、表面実装型ｌｅｄ発光装置、ｌｅｄ照明器具
KR102655975B1 (ko) 열전도성 필러 입자 및 이를 포함하는 고분자 조성물
JP2019104786A (ja) 光反射体用成形材料、光反射体、ベース体及びその製造方法、並びに発光装置
JP5946592B2 (ja) 光反射体材料、光反射体、及び照明器具
WO2020075615A1 (ja) 光反射体材料、光反射体の製造方法、光反射体及び照明器具
JP2015019011A (ja) Ｌｅｄリフレクター用不飽和ポリエステル樹脂組成物とそれを用いた粒状物、タブレット、ｌｅｄリフレクター、表面実装型ｌｅｄ発光装置、ｌｅｄ照明
JP5921789B1 (ja) 光反射体材料、光反射体、及び照明器具
JP2020154101A (ja) 光反射体用成形材料、光反射体及び発光装置
JP2021009907A (ja) 光反射体用成形材料、光反射体及び発光装置
JP2015003997A (ja) Ｌｅｄリフレクター構成材料、ｌｅｄリフレクター、及びｌｅｄ照明器具
WO2014109068A1 (ja) Ｌｅｄリフレクター用不飽和ポリエステル樹脂組成物とそれを用いた粒状物、タブレット、ｌｅｄリフレクター、表面実装型ｌｅｄ発光装置、ｌｅｄ照明
JP2015012032A (ja) 表面実装型発光装置凹状樹脂体構成材料、表面実装型発光装置凹状樹脂体、及び表面実装型発光装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200310

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20210225

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210316

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210517

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210907

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211108

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220308

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220331

R151 Written notification of patent or utility model registration

Ref document number: 7065381

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151