WO2015091478A1 - Polyamide compositions with improved whiteness retention after heat aging - Google Patents
Polyamide compositions with improved whiteness retention after heat aging Download PDFInfo
- Publication number
- WO2015091478A1 WO2015091478A1 PCT/EP2014/077958 EP2014077958W WO2015091478A1 WO 2015091478 A1 WO2015091478 A1 WO 2015091478A1 EP 2014077958 W EP2014077958 W EP 2014077958W WO 2015091478 A1 WO2015091478 A1 WO 2015091478A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polymer composition
- acid
- polymer
- diamino
- polyamide
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 96
- 229920002647 polyamide Polymers 0.000 title claims abstract description 56
- 239000004952 Polyamide Substances 0.000 title claims abstract description 55
- 230000014759 maintenance of location Effects 0.000 title abstract description 13
- 230000032683 aging Effects 0.000 title description 8
- 229920000642 polymer Polymers 0.000 claims abstract description 90
- 229920000728 polyester Polymers 0.000 claims abstract description 32
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 54
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 27
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 claims description 19
- 238000006068 polycondensation reaction Methods 0.000 claims description 14
- 239000012763 reinforcing filler Substances 0.000 claims description 12
- 239000012463 white pigment Substances 0.000 claims description 11
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 claims description 10
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 claims description 10
- GAGWMWLBYJPFDD-UHFFFAOYSA-N 2-methyloctane-1,8-diamine Chemical compound NCC(C)CCCCCCN GAGWMWLBYJPFDD-UHFFFAOYSA-N 0.000 claims description 8
- 239000003365 glass fiber Substances 0.000 claims description 8
- 239000010456 wollastonite Substances 0.000 claims description 5
- 229910052882 wollastonite Inorganic materials 0.000 claims description 5
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Inorganic materials [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 3
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims description 3
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000010438 heat treatment Methods 0.000 abstract description 3
- -1 aliphatic diamine Chemical class 0.000 description 20
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 18
- 229920001577 copolymer Polymers 0.000 description 18
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 17
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 16
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 15
- 125000001931 aliphatic group Chemical group 0.000 description 15
- 239000000178 monomer Substances 0.000 description 15
- 239000004615 ingredient Substances 0.000 description 12
- 125000003118 aryl group Chemical group 0.000 description 11
- 239000004609 Impact Modifier Substances 0.000 description 10
- 239000000835 fiber Substances 0.000 description 9
- 239000004408 titanium dioxide Substances 0.000 description 9
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 8
- 239000002253 acid Substances 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 6
- 239000005060 rubber Substances 0.000 description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 5
- 150000002148 esters Chemical group 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 5
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 5
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 4
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- HQHCYKULIHKCEB-UHFFFAOYSA-N tetradecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCC(O)=O HQHCYKULIHKCEB-UHFFFAOYSA-N 0.000 description 4
- LWBHHRRTOZQPDM-UHFFFAOYSA-N undecanedioic acid Chemical compound OC(=O)CCCCCCCCCC(O)=O LWBHHRRTOZQPDM-UHFFFAOYSA-N 0.000 description 4
- DRNGLYHKYPNTEA-UHFFFAOYSA-N 4-azaniumylcyclohexane-1-carboxylate Chemical compound NC1CCC(C(O)=O)CC1 DRNGLYHKYPNTEA-UHFFFAOYSA-N 0.000 description 3
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 3
- 150000004984 aromatic diamines Chemical class 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- 150000001991 dicarboxylic acids Chemical class 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- CRTFIUQMLDPORS-UHFFFAOYSA-N 2,2-dimethyloctane-1,8-diamine Chemical compound NCC(C)(C)CCCCCCN CRTFIUQMLDPORS-UHFFFAOYSA-N 0.000 description 2
- KEEWXLYVPARTPY-UHFFFAOYSA-N 2,3-dimethylheptane-1,7-diamine Chemical compound NCC(C)C(C)CCCCN KEEWXLYVPARTPY-UHFFFAOYSA-N 0.000 description 2
- AHBYWKWAVAMOMN-UHFFFAOYSA-N 2,4-diethylhexane-1,6-diamine Chemical compound CCC(CN)CC(CC)CCN AHBYWKWAVAMOMN-UHFFFAOYSA-N 0.000 description 2
- NEIQVECNZQYVDC-UHFFFAOYSA-N 3,4-dimethyloctane-1,8-diamine Chemical compound NCCC(C)C(C)CCCCN NEIQVECNZQYVDC-UHFFFAOYSA-N 0.000 description 2
- CPWPLIIHQWYLLH-UHFFFAOYSA-N 4,5-dimethyloctane-1,8-diamine Chemical compound NCCCC(C)C(C)CCCN CPWPLIIHQWYLLH-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- 239000004953 Aliphatic polyamide Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- GYDJEQRTZSCIOI-UHFFFAOYSA-N Tranexamic acid Chemical compound NCC1CCC(C(O)=O)CC1 GYDJEQRTZSCIOI-UHFFFAOYSA-N 0.000 description 2
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 2
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 229920003231 aliphatic polyamide Polymers 0.000 description 2
- QCTBMLYLENLHLA-UHFFFAOYSA-N aminomethylbenzoic acid Chemical compound NCC1=CC=C(C(O)=O)C=C1 QCTBMLYLENLHLA-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 125000002843 carboxylic acid group Chemical group 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 239000012765 fibrous filler Substances 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052950 sphalerite Inorganic materials 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical class OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- QBIAZVPERXOGAL-OWOJBTEDSA-N (e)-prop-1-ene-1,3-diamine Chemical compound NC\C=C\N QBIAZVPERXOGAL-OWOJBTEDSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- UAFHRUBCOQPFFM-UHFFFAOYSA-N 1-(aminomethyl)cyclohexane-1-carboxylic acid Chemical compound NCC1(C(O)=O)CCCCC1 UAFHRUBCOQPFFM-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- JCUZDQXWVYNXHD-UHFFFAOYSA-N 2,2,4-trimethylhexane-1,6-diamine Chemical compound NCCC(C)CC(C)(C)CN JCUZDQXWVYNXHD-UHFFFAOYSA-N 0.000 description 1
- JCTXKRPTIMZBJT-UHFFFAOYSA-N 2,2,4-trimethylpentane-1,3-diol Chemical compound CC(C)C(O)C(C)(C)CO JCTXKRPTIMZBJT-UHFFFAOYSA-N 0.000 description 1
- BTUDGPVTCYNYLK-UHFFFAOYSA-N 2,2-dimethylglutaric acid Chemical compound OC(=O)C(C)(C)CCC(O)=O BTUDGPVTCYNYLK-UHFFFAOYSA-N 0.000 description 1
- VECYFPCPMVHUEN-UHFFFAOYSA-N 2,2-dimethylheptane-1,7-diamine Chemical compound NCC(C)(C)CCCCCN VECYFPCPMVHUEN-UHFFFAOYSA-N 0.000 description 1
- RMIUJCRSUIITNG-UHFFFAOYSA-N 2,3-dimethylbutane-1,4-diamine Chemical compound NCC(C)C(C)CN RMIUJCRSUIITNG-UHFFFAOYSA-N 0.000 description 1
- DPQHRXRAZHNGRU-UHFFFAOYSA-N 2,4,4-trimethylhexane-1,6-diamine Chemical compound NCC(C)CC(C)(C)CCN DPQHRXRAZHNGRU-UHFFFAOYSA-N 0.000 description 1
- RLEQVGMLDNITBW-UHFFFAOYSA-N 2,4,4-trimethylhexanedioic acid Chemical compound OC(=O)C(C)CC(C)(C)CC(O)=O RLEQVGMLDNITBW-UHFFFAOYSA-N 0.000 description 1
- SQAPJTNHAUBTOP-UHFFFAOYSA-N 2,4-dimethyloctane-1,8-diamine Chemical compound NCC(C)CC(C)CCCCN SQAPJTNHAUBTOP-UHFFFAOYSA-N 0.000 description 1
- XGKKWUNSNDTGDS-UHFFFAOYSA-N 2,5-dimethylheptane-1,7-diamine Chemical compound NCC(C)CCC(C)CCN XGKKWUNSNDTGDS-UHFFFAOYSA-N 0.000 description 1
- ACEKLXGWCBIDGA-UHFFFAOYSA-N 2-methylpentane-1,4-diamine Chemical compound CC(N)CC(C)CN ACEKLXGWCBIDGA-UHFFFAOYSA-N 0.000 description 1
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 1
- OWRGRHKXXGTEHA-UHFFFAOYSA-N 3,3-dimethylhexane-1,6-diamine Chemical compound NCCC(C)(C)CCCN OWRGRHKXXGTEHA-UHFFFAOYSA-N 0.000 description 1
- WTXAAHKEBFFHIC-UHFFFAOYSA-N 3,3-dimethyloctane-1,8-diamine Chemical compound NCCC(C)(C)CCCCCN WTXAAHKEBFFHIC-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- RBQRPOWGQURLEU-UHFFFAOYSA-N 3-[(3-carboxyphenyl)methyl]benzoic acid Chemical compound OC(=O)C1=CC=CC(CC=2C=C(C=CC=2)C(O)=O)=C1 RBQRPOWGQURLEU-UHFFFAOYSA-N 0.000 description 1
- LJPXCZADJYRIMX-UHFFFAOYSA-N 3-[2-(3-carboxyphenoxy)phenoxy]benzoic acid Chemical compound OC(=O)C1=CC=CC(OC=2C(=CC=CC=2)OC=2C=C(C=CC=2)C(O)=O)=C1 LJPXCZADJYRIMX-UHFFFAOYSA-N 0.000 description 1
- CVPWXYQTHJVBDP-UHFFFAOYSA-N 3-[2-(3-carboxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]benzoic acid Chemical compound OC(=O)C1=CC=CC(C(C=2C=C(C=CC=2)C(O)=O)(C(F)(F)F)C(F)(F)F)=C1 CVPWXYQTHJVBDP-UHFFFAOYSA-N 0.000 description 1
- BZVMGPSXJDFUPI-UHFFFAOYSA-N 3-[2-(3-carboxyphenyl)propan-2-yl]benzoic acid Chemical compound C=1C=CC(C(O)=O)=CC=1C(C)(C)C1=CC=CC(C(O)=O)=C1 BZVMGPSXJDFUPI-UHFFFAOYSA-N 0.000 description 1
- OLTBRQIRRDQOTO-UHFFFAOYSA-N 3-methylpentane-1,4-diamine Chemical compound CC(N)C(C)CCN OLTBRQIRRDQOTO-UHFFFAOYSA-N 0.000 description 1
- ULLJDGWZKSOING-UHFFFAOYSA-N 4,4-dimethyloctane-1,8-diamine Chemical compound NCCCC(C)(C)CCCCN ULLJDGWZKSOING-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- VTDMBRAUHKUOON-UHFFFAOYSA-N 4-[(4-carboxyphenyl)methyl]benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1CC1=CC=C(C(O)=O)C=C1 VTDMBRAUHKUOON-UHFFFAOYSA-N 0.000 description 1
- PHQYMDAUTAXXFZ-UHFFFAOYSA-N 4-[2-(4-carboxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(C(O)=O)C=C1 PHQYMDAUTAXXFZ-UHFFFAOYSA-N 0.000 description 1
- XKACUVXWRVMXOE-UHFFFAOYSA-N 4-[2-(4-carboxyphenyl)propan-2-yl]benzoic acid Chemical compound C=1C=C(C(O)=O)C=CC=1C(C)(C)C1=CC=C(C(O)=O)C=C1 XKACUVXWRVMXOE-UHFFFAOYSA-N 0.000 description 1
- ALYNCZNDIQEVRV-PZFLKRBQSA-N 4-amino-3,5-ditritiobenzoic acid Chemical compound [3H]c1cc(cc([3H])c1N)C(O)=O ALYNCZNDIQEVRV-PZFLKRBQSA-N 0.000 description 1
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 1
- WHLFXPIYRPOHGB-UHFFFAOYSA-N 4-methylpentane-1,4-diamine Chemical compound CC(C)(N)CCCN WHLFXPIYRPOHGB-UHFFFAOYSA-N 0.000 description 1
- UVJGPFKXFTVLIZ-UHFFFAOYSA-N 5-methylnonane-1,8-diamine Chemical compound CC(N)CCC(C)CCCCN UVJGPFKXFTVLIZ-UHFFFAOYSA-N 0.000 description 1
- MBRGOFWKNLPACT-UHFFFAOYSA-N 5-methylnonane-1,9-diamine Chemical compound NCCCCC(C)CCCCN MBRGOFWKNLPACT-UHFFFAOYSA-N 0.000 description 1
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- XNQIUBJCXWNVIA-UHFFFAOYSA-N 6-methylnonane-1,8-diamine Chemical compound CC(N)CC(C)CCCCCN XNQIUBJCXWNVIA-UHFFFAOYSA-N 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 229920001634 Copolyester Polymers 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004954 Polyphthalamide Substances 0.000 description 1
- QOSMNYMQXIVWKY-UHFFFAOYSA-N Propyl levulinate Chemical compound CCCOC(=O)CCC(C)=O QOSMNYMQXIVWKY-UHFFFAOYSA-N 0.000 description 1
- 239000005700 Putrescine Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QLBRROYTTDFLDX-UHFFFAOYSA-N [3-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCCC(CN)C1 QLBRROYTTDFLDX-UHFFFAOYSA-N 0.000 description 1
- OXIKYYJDTWKERT-UHFFFAOYSA-N [4-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCC(CN)CC1 OXIKYYJDTWKERT-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 150000001558 benzoic acid derivatives Chemical class 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- RGTXVXDNHPWPHH-UHFFFAOYSA-N butane-1,3-diamine Chemical compound CC(N)CCN RGTXVXDNHPWPHH-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229920003244 diene elastomer Polymers 0.000 description 1
- MPFLRYZEEAQMLQ-UHFFFAOYSA-N dinicotinic acid Chemical compound OC(=O)C1=CN=CC(C(O)=O)=C1 MPFLRYZEEAQMLQ-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- ILUCPNVXZDZFIT-UHFFFAOYSA-N ethyl 2-methylidenehexanoate Chemical compound CCCCC(=C)C(=O)OCC ILUCPNVXZDZFIT-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 229960004275 glycolic acid Drugs 0.000 description 1
- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 description 1
- JVQUBHIPPUVHCN-UHFFFAOYSA-N hexane-1,2-diamine Chemical compound CCCCC(N)CN JVQUBHIPPUVHCN-UHFFFAOYSA-N 0.000 description 1
- HYQBVSXBLGKEDT-UHFFFAOYSA-N hexane-1,4-diamine Chemical compound CCC(N)CCCN HYQBVSXBLGKEDT-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- BBPXVYVXKAYBSS-UHFFFAOYSA-N hexane-2,5-diamine Chemical compound CC(N)CCC(C)N BBPXVYVXKAYBSS-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- LVPMIMZXDYBCDF-UHFFFAOYSA-N isocinchomeronic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)N=C1 LVPMIMZXDYBCDF-UHFFFAOYSA-N 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- JJTUDXZGHPGLLC-UHFFFAOYSA-N lactide Chemical compound CC1OC(=O)C(C)OC1=O JJTUDXZGHPGLLC-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- MJIVRKPEXXHNJT-UHFFFAOYSA-N lutidinic acid Chemical compound OC(=O)C1=CC=NC(C(O)=O)=C1 MJIVRKPEXXHNJT-UHFFFAOYSA-N 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000010128 melt processing Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000011490 mineral wool Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 1
- 125000005487 naphthalate group Chemical group 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- VAWFFNJAPKXVPH-UHFFFAOYSA-N naphthalene-1,6-dicarboxylic acid Chemical compound OC(=O)C1=CC=CC2=CC(C(=O)O)=CC=C21 VAWFFNJAPKXVPH-UHFFFAOYSA-N 0.000 description 1
- HRRDCWDFRIJIQZ-UHFFFAOYSA-N naphthalene-1,8-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=C2C(C(=O)O)=CC=CC2=C1 HRRDCWDFRIJIQZ-UHFFFAOYSA-N 0.000 description 1
- KHARCSTZAGNHOT-UHFFFAOYSA-N naphthalene-2,3-dicarboxylic acid Chemical compound C1=CC=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 KHARCSTZAGNHOT-UHFFFAOYSA-N 0.000 description 1
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 150000003022 phthalic acids Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920006375 polyphtalamide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 235000013772 propylene glycol Nutrition 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- MEBONNVPKOBPEA-UHFFFAOYSA-N trimethyl cyclohexane Natural products CC1CCCCC1(C)C MEBONNVPKOBPEA-UHFFFAOYSA-N 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Definitions
- the present invention relates to polymeric compositions comprising at least one polyamide and at least one polyester with excellent retention of light reflectance after heat aging.
- the present invention further provides an article comprising the
- composition of the invention such as a part of a light emitting diode (LED) device.
- LED light emitting diode
- LEDs are increasingly being used as light sources in numerous applications due to the high number of benefits they provide over traditional light sources. LEDs generally consume significantly less power than other light sources, require a low voltage to operate, and are resistant to mechanical shock. As a result, they are displacing incandescent and other light sources in many uses and have found applications in such disparate areas as traffic signals, interior and exterior lighting, cellular telephone displays, automotive displays, and flashlights.
- LED components such as reflectors
- Ceramics may be advantageously used in those applications, but are still extremely costly and require demanding processing technologies. Therefore, polymers have been extensively studied and developed to replace ceramics as a lower cost material.
- thermoplastic polymers A great benefit of thermoplastic polymers is that they may be injection molded and therefore offer considerable design flexibility.
- One problem noted with the polymer compositions used for the manufacture of LED components is that they tend to yellow when exposed to light and elevated temperatures. For example, during manufacturing, the LED components are heated to about 160°C to cure an epoxy or silicon encapsulant. The LED components are also exposed to temperatures above 260°C while soldering operations are performed. In addition, while in use, LED components are routinely subjected to light and temperatures above 80°C. Moreover, the recent development of higher voltage LEDs leads to even higher working temperatures, generally above 100°C. This concurrent exposure to light and high temperatures causes yellowing of polymer
- compositions used for forming LED components are identical to compositions used for forming LED components.
- reflectors of LEDs and, in fine, the polymer compositions from which they are made should comply with a wide set of requirements, including, notably, high reflectance of light, high whiteness, high dimensional stability, high mechanical strength, high heat deflection temperature, and high heat resistance (low discoloration and low loss of refiectance when exposed to a high temperature) while being easily processed into the desired shapes.
- Polyamides are currently used for the manufacture of LED' s because of their great overall properties. However, in spite of these positive characteristics, there is still a need in the market to improve the whiteness retention of LED reflectors made of polyamides.
- polyesters such as poly(cyclohexylenedimethylene
- PCT terephthalate
- WO 2013/026778 discloses compositions for LED comprising certain polyamides, and in particular polyphthalamides. Those compositions suffer from low reflectivity retention after heat treatment.
- US 2012/0262927 relates to compositions suitable for molding LED reflectors comprising PCT, a white pigment and a reactive viscosity stabilizer such as a phenoxy resin or a non-aromatic epoxy resin.
- a reactive viscosity stabilizer such as a phenoxy resin or a non-aromatic epoxy resin.
- US '927 discloses in its examples PCT compositions comprising titanium dioxide, chopped glass fibers, 2 wt. % of talc and 8 other additives. Those compositions only achieve a maximum of about 84 % of whiteness index retention after 4 hours at 200°C.
- compositions according to the present invention satisfy thus the above- mentioned requirements and will be described in detail hereafter.
- the present invention relates to a polymer composition (C) comprising :
- PA polyamide
- polyester (P) from 0.5 to 25 wt. % of at least one polyester (P) comprising at
- the present invention relates to articles comprising at least one part comprising the invented polymer composition (C) and, in particular, to parts of LED devices made from such polymer composition (C).
- the polymer composition (C) according to the present invention comprises two essential ingredients that are described in detail here below :
- the polyamide (PA) is the polyamide (PA)
- the polymer composition (C) comprises from 20 to 60 wt. % of at least one polyamide (PA), based on the total weight of the polymer composition (C).
- polyamide is intended to denote any polymer which comprises at least 50 mol % of recurring units ((R PA ), which are typically derived from the polycondensation of at least one dicarboxylic acid component (or derivative thereof) and at least one diamine component, and/or from the polycondensation of aminocarboxylic acids and/or lactams.
- amide-forming derivatives include a mono- or di-alkyl ester, such as a mono- or di-methyl, ethyl or propyl ester, of such carboxylic acid; a mono- or di-aryl ester thereof; a mono- or di-acid halide thereof; and a mono-or di-acid amide thereof, a mono- or di-carboxylate salt.
- the polyamide (PA) of the polymer composition (C) comprises preferably at least 70 mol %, more preferably at least 80 mol %, still more preferably at least 90 mol % and most preferably at least 95 mol % of recurring units (R PA ).
- excellent results were obtained when the polyamide (PA) of the polymer composition (C) consisted of recurring units (RPA).
- the polyamide (PA) of the polymer composition (C) may be an aliphatic polyamide polymer or an aromatic polyamide polymer.
- aromatic polyamide polymer is intended to denote a polyamide which comprises more than 35 mol %, preferably more than 45 mol %, more preferably more than 55 mol %, still more preferably more than 65 mol % and most preferably more than 75 mol % of recurring units (R PA ) which are aromatic recurring units.
- aromatic recurring unit is intended to denote any recurring unit that comprises at least one aromatic group.
- the aromatic recurring units may be formed by the polycondensation of at least one aromatic dicarboxylic acid with an aliphatic diamine or by the polycondensation of at least one aliphatic dicarboxylic acid with an aromatic diamine, or by the polycondensation of aromatic
- a dicarboxylic acid or a diamine is considered as "aromatic" when it comprises at least one aromatic group.
- Non limitative examples of aromatic dicarboxylic acids are notably phthalic acids, including isophthalic acid (IA), terephthalic acid (TA) and orthophthalic acid (OA), 2,5-pyridinedicarboxylic acid, 2,4-pyridinedicarboxylic acid, 3,5-pyridinedicarboxylic acid, 2,2-bis(4-carboxyphenyl)propane, bis(4-carboxyphenyl)methane, 2,2-bis(4-carboxyphenyl)hexafluoropropane, 2,2-bis(4-carboxyphenyl)ketone, 4,4'-bis(4-carboxyphenyl)sulfone,
- IA isophthalic acid
- TA terephthalic acid
- OA orthophthalic acid
- 2,5-pyridinedicarboxylic acid 2,4-pyridinedicarboxylic acid
- 3,5-pyridinedicarboxylic acid 3,5-pyridinedicarboxylic acid
- aromatic diamines mention can be notably made of meta- phenylene diamine (MPD), para-phenylene diamine (PPD),
- the dicarboxylic acid is aromatic and comprises advantageously at least one phthalic acid selected from the group consisting of isophthalic acid (IA), and terephthalic acid (TA). Isophthalic acid and terephthalic acid can be used alone or in combination.
- the phthalic acid is preferably terephthalic acid, optionally in combination with isophthalic acid.
- aliphatic polyamide polymer is intended to denote a polyamide that comprises aliphatic recurring units exclusively and said aliphatic recurring units are derived from at least one aliphatic dicarboxylic acid, as mentioned above, and at least one aliphatic diamine, and/or said aliphatic recurring units are derived from aliphatic aminocarboxylic acids and/or aliphatic lactams.
- oxalic acid [HOOC-COOH, malonic acid (HOOC-CH 2 -COOH), adipic acid [HOOC-(CH 2 ) 4 -COOH], succinic acid [HOOC-(CH 2 ) 2 -COOH], glutaric acid [HOOC-(CH 2 ) 3 -COOH], 2,2-dimethyl-glutaric acid
- the aliphatic dicarboxylic acid is trans-cyclohexane-l,4-dicarboxylic acid.
- Non limitative examples of aliphatic diamines are typically aliphatic alkylene diamines having 2 to 18 carbon atoms, which are advantageously selected from the group consisting of 1 ,2-diaminoethane, 1 ,2-diaminopropane, propylene- 1,3-diamine, 1,3-diamino butane, 1 ,4-diamino butane,
- the aliphatic diamine may be chosen from cycloaliphatic diamines such as isophorone diamine (also known as 5-amino-(l-aminomethyl)-l,3,3- trimethylcyclohexane), 1 ,3-cyclohexanebis(methylamine) (1 ,3-BAMC),
- isophorone diamine also known as 5-amino-(l-aminomethyl)-l,3,3- trimethylcyclohexane
- 1 ,3-cyclohexanebis(methylamine) (1 ,3-BAMC)
- aromatic aminocarboxylic acids or derivatives thereof may also be used for the manufacture of the polyamide of the polymer composition (C), which is generally selected from the group consisting of
- 4-(aminomethyl)benzoic acid and 4-aminobenzoic acid 6-aminohexanoic acid, l-aza-2-cyclononanone, l-aza-2-cyclododecanone, 11-aminoundecanoic acid, 12-aminododecanoic acid, 4-(aminomethyl)benzoic acid, cis-4- (aminomethyl)cyclohexanecarboxylic acid, trans-4-
- Non limitative examples of aliphatic lactams are notably selected from the group consisting of caprolactam and lauryl lactam.
- the polyamide (PA) of the polymer composition (C) comprises preferably at least 50 mol % of recurring units comprising an aliphatic moiety comprising at least 9 carbon atoms.
- the recurring units comprising an aliphatic moiety comprising at least 9 carbon atoms may be formed by the polycondensation of at least one aliphatic dicarboxylic acid with at least one aliphatic diamine or by the polycondensation of at least one aliphatic dicarboxylic acid with at least one aromatic diamine, or by the polycondensation of at least one aromatic dicarboxylic acid with at least one aliphatic diamine or by the polycondensation of aminocarboxylic acids.
- the aliphatic moiety comprising at least 9 carbon atoms present in the recurring units of the polyamide (PA) may be derived from aliphatic
- dicarboxylic acids and/or aliphatic diamines detailed hereafter.
- aliphatic dicarboxylic acids comprising an aliphatic moiety comprising at least 9 carbon atoms are azelaic
- dodecanedioic acid [HOOC-(CH 2 )i 0 -COOH] are preferred.
- aliphatic diamines comprising an aliphatic moiety comprising at least 9 carbon atoms are 1,9-diaminononane, l,6-diamino-2,2,4- trimethylhexane, 1 ,6-diamino-2,4,4-trimethylhexane, 1 ,7-diamino-2,3- dimethylheptane, l ,7-diamino-2,4-dimethylheptane, l,7-diamino-2,5- dimethylheptane, l ,7-diamino-2,2-dimethylheptane, 2 -methyl- 1,8- diaminooctane, 1,10-diaminodecane, l,8-diamino-l,3-dimethyloctane, 1,8- diamino- 1 ,4-dimethyloctane, 1 ,8-d
- composition (C) are : the polymer of terephthalic acid with 1 ,9-diaminononane and/or 2-methyl- 1,8-diaminooctane, the polymer of 1,4-cyclohexanedicarboxylic acid with 1,9-diaminononane and/or 2-methyl- 1,8-diaminooctane, the polymer of terephthalic acid with 1,10-decamethylene diamine, the polymer of terephthalic acid with dodecamethylene diamine, the copolymer of terephthalic acid with hexamethylene diamine and decamethylene diamine; the copolymer of terephthalic acid and isophthalic acid with hexamethylene diamine and decamethylene diamine; the copolymer of terephthalic acid with decamethylene diamine and 11-amino-undecanoic acid, the copolymer of terephthalic acid with hexamethylene diamine and 11
- decamethylene diamine with 1,4-cyclohexanedicarboxylic acid the copolymer of hexamethylene diamine with 11-amino-undecanoic acid and
- 2,6-napthalenedicarboxylic acid the copolymer of terephthalic acid with decamethylene diamine and 2-methylpentamethylene diamine; the copolymer of 1,4-cyclohexanedicarboxylic acid with decamethylene diamine.
- the polyamide (PA) is preferably selected from the group consisting of the polymer of terephthalic acid with 1 ,9-diaminononane and/or 2 -methyl- 1,8- diaminooctane, the polymer of 1 ,4-cyclohexanedicarboxylic acid with 1 ,9- diaminononane and/or 2-methyl-l,8-diaminooctane, the polymer of terephthalic acid with 1,10-decamethylene diamine, and the polymer of
- the polyamide (PA) has a melting point, as measured by DSC according to ISO-11357-3, of advantageously at least 250°C, preferably at least 260°C, more preferably at least 270°C and most preferably at least 280°C. Besides, its melting point is advantageously of at most 350°C, preferably at most 340°C, more preferably at most 330°C and most preferably at most 320°C. Excellent results were obtained with a polyamide (PA) having a melting point ranging from 280°C to 320°C.
- the polyamide (PA) is preferably present in an amount of at least 25 wt. %, more preferably at least 30 wt. %, still more preferably at least 35 wt. %, and most preferably at least 40 wt. %, based on the total weight of the polymer composition (C).
- the polyamide (PA) is also present in an amount of advantageously at most 58 wt.%, preferably at most 56 wt. %, more preferably at most 54 wt. %, still more preferably at most 52 wt. %, and most preferably at most 50 wt. %, based on the total weight of the polymer composition (C).
- Excellent results were obtained when the polyamide (PA) was present in the polymer composition (C) in an amount from about 35 to about 55 wt. %, preferably from about 30 to about 50 wt. %, based on the total weight of the polymer composition (C).
- the polymer composition (C) may comprise more than one polyamide
- the polymer composition (C) comprises from 0.5 to 25 wt. % of at least one polyester (P) comprising at least 50 mol % of recurring units comprising at least one cycloaliphatic group.
- polyester is intended to include “copolyesters” and is understood to denote a polymer comprising at least 50 mol %, preferably at least 85 mol % of recurring units comprising at least one ester moiety
- Polyesters may be obtained by ring opening polymerization of a cyclic monomer (M A ) comprising at least one ester moiety ; by poly condensation of a monomer (M B ) comprising at least one hydroxyl group and at least one carboxylic acid group, or by
- dicarboxylic acid is intended to include dicarboxylic acids and any derivative of dicarboxylic acids, including their associated acid halides, esters, half-esters, salts, half-salts, anhydrides, mixed anhydrides, or mixtures thereof.
- the polyester (P) comprises at least 50 mol %, preferably at least 60 mol %, more preferably at least 70 mol %, still more preferably at least 80 mol % and most preferably at least 90 mol % of recurring units comprising, in addition to the at least one ester moiety, at least one cycloaliphatic group.
- Excellent results were obtained when the polyester (P) was essentially composed of recurring units comprising at least one ester moiety and at least one cycloaliphatic group.
- the cycloaliphatic group may derive from monomers (M A ), monomers (M B ), monomers (Mc) or monomers (M D ) comprising at least one group which is both aliphatic and cyclic.
- Non limitative examples of monomers (M A ) include lactide and
- Non limitative examples of monomers (M B ) include gly colic acid,
- Non limitative examples of monomers (Mc) include
- 1,4-cyclohexanedimethanol ethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol, 1,10-decanediol, 2,2,4-trimethyl 1,3-pentanediol, 2,2,4,4-tetramethyl-l,3-cyclobutanediol, and neopentyl glycol, while 1,4-cyclohexanedimethanol and neopentyl glycol are preferred.
- Non limitative examples of monomers (M D ) include terephthalic acid, isophthalic acid, naphthalene dicarboxylic acids, 1,4-cyclohexane dicarboxylic acid, succinic acid, sebacic acid, and adipic acid, while terephthalic acid and 1 ,4-cyclohexane dicarboxylic acid are preferred.
- polyester (P) is a copolymer
- monomers (Mc) and (M D ) are preferably used.
- monomer (M c ) is preferably
- 1,4-cyclohexanedimethanol and monomer (M D ) is preferably a mixture of terephthalic acid and 1 ,6-naphthalene dicarboxylic acid.
- polyester (P) when the polyester (P) is a homopolymer, it may be selected from poly(cyclohexylenedimethylene terephthalate) ("PCT”) and
- PCN poly(cyclohexylenedimethylene naphthalate)
- PCT poly(cyclohexylenedimethylene naphthalate)
- PCT i.e. a homopolymer obtained through the polycondensation of terephthalic acid with 1,4-cyclohexylenedimethanol.
- the polyester (P) has advantageously an intrinsic viscosity of from about 0.4 to about 2.0 dl/g as measured in a 60:40 phenol/tetrachloroethane mixture or similar solvent at about 30°C.
- Particularly suitable polyester (P) for this invention has an intrinsic viscosity of 0.5 to 1.4 dl/g.
- the polyester (P) has a melting point, as measured by DSC according to ISO-11357-3, of advantageously at least 250°C, preferably at least 260°C, more preferably at least 270°C and most preferably at least 280°C. Besides, its melting point is advantageously of at most 350°C, preferably at most 340°C, more preferably at most 330°C and most preferably at most 320°C. Excellent results were obtained with a polyester (P) having a melting point ranging from 280°C to 320°C.
- the polyester (P) is preferably present in an amount of at least 1 wt. %, more preferably at least 2 wt. %, still more preferably at least 3 wt. %, and most preferably at least 4 wt. %, based on the total weight of the polymer
- the polyester (P) is also present in an amount of advantageously at most 20 wt. %, preferably at most 18 wt. %, more preferably at most 16 wt. %, still more preferably at most 14 wt. %, and most preferably at most 12 wt. %, based on the total weight of the polymer composition (C).
- polyester (P) was present in the polymer composition (C) in an amount from about 1 to about 20 wt. %, preferably from about 2 to about 15 wt. %, based on the total weight of the polymer composition (C).
- the polymer composition (C) may comprise more than one polyester (P).
- the white pigment may comprise more than one polyester (P).
- the polymer composition (C) may also comprise at least one white pigment selected from the group consisting of Ti0 2 , ZnS, ZnO, Ce0 2 and BaS0 4 .
- the white pigment is preferably titanium dioxide (Ti0 2 ).
- the form of titanium dioxide is not particularly limited and a variety of crystalline forms such as the anatase form, the rutile form, and the monoclinic type can be used.
- Titanium dioxide may or may not be treated with a surface treatment agent.
- the surface of the titanium dioxide particles will preferably be coated.
- the titanium dioxide will preferably be first coated with an inorganic coating and then with an organic coating.
- the titanium dioxide particles may be coated using any method known in the art.
- Preferred inorganic coatings include metal oxides.
- Organic coatings may include one or more of carboxylic acids, polyols, alkanolamines, and/or silicon compounds.
- the white pigment is preferably present in an amount of at least 5 wt. %, preferably of at least 10 wt. %, more preferably of at
- the white pigment is also preferably present in an amount of at most 60 wt. %, preferably of at most 50 wt. %, more preferably of at
- the reinforcing filler may also further comprise at least one reinforcing filler.
- Reinforcing fillers are preferably fibrous. More preferably, the reinforcing filler is selected from glass fiber, carbon fiber, synthetic polymeric fiber, aramid fiber, aluminum fiber, titanium fiber, magnesium fiber, boron carbide fibers, rock wool fiber, steel fiber, wollastonite, etc. Still more preferably, it is selected from glass fiber, carbon fiber and wollastonite.
- a particular class of fibrous fillers consists of whiskers, i.e. single crystal fibers made from various raw materials such as A1 2 0 3 , SiC, BC, Fe and Ni.
- glass fibers are preferred ; they include chopped strand A-, E-, C-, D-, S- T- and R-glass fibers, as described in chapter 5.2.3, p. 43-48 of Additives for Plastics Handbook, 2nd ed., John Murphy.
- the reinforcing filler is chosen from wollastonite and glass fiber.
- Glass fibers may have a round cross- section or an elliptic cross-section (also called flat fibers).
- the reinforcing filler is preferably present in an amount of at least 2 wt. %, more preferably at least 4 wt. %, still more preferably at least 5 wt. %, and most preferably at least 10 wt. %, based on the total weight of the polymer composition (C).
- the reinforcing filler is also preferably present in an amount of at most 40 wt. %, more preferably at most 30 wt. %, still more preferably at most 25 wt. %, and most preferably at most 20 wt. %, based on the total weight of the polymer composition (C).
- the polymer composition (C) can further contain one or more impact modifiers.
- the impact modifiers can be reactive with the polyester (P) and/or the polyamide (PA) or non-reactive.
- the polymer composition (C) contains at least one reactive impact modifier and at least one non-reactive impact modifier.
- Reactive impact modifiers that may be used include ethylene-maleic anhydride copolymers, ethylene-alkyl (meth)acrylate-maleic anhydride copolymers, ethylene-alkyl (meth)acrylate-glycidyl (meth)acrylate copolymers, and the like.
- An example of such reactive impact modifier is a random terpolymer of ethylene, methylacrylate and glycidyl methacrylate.
- Non-reactive impact modifiers that may be blended into the polymer composition (C) generally include various rubber materials, such as acrylic rubbers, ASA rubbers, diene rubbers, organosiloxane rubbers, EPDM rubbers, SBS or SEBS rubbers, ABS rubbers, NBS rubbers and the like.
- Particular examples of non-reactive impact modifiers include ethyl butylacrylate, ethyl (methyl)acrylate or 2 ethyl hexyl acrylate copolymers.
- the impact modifier is preferably present in an amount of at least 0.5 wt. %, more preferably at least 0.7 wt. %, still more preferably at least 0.9 wt. %, and most preferably at least 1 wt. %, based on the total weight of the polymer composition (C).
- the impact modifier is also preferably present in an amount of at most 5 wt. %, more preferably at most 4 wt.%, still more preferably at most 3 wt. %, and most preferably at most 2 wt.%, based on the total weight of the polymer composition (C).
- the polymer composition (C) may optionally further contain up to about 3 wt. % of ultraviolet light stabilizers or UV blockers.
- ultraviolet light stabilizers include hindered amines, triazoles and triazines, oxanilides, hydroxybenzophenones, benzoates, and a-cyanoacrylates.
- the ultraviolet light stabilizers are preferably present in an amount of about 0.1 to about 3 wt. %, or preferably about 0.1 to about 1 wt. %, or more preferably about 0.1 to about 0.6 wt. %, of the total weight of the polymer composition (C).
- the polymer composition (C) may also comprise other optional ingredients such as mold release agents, lubricants, fillers, optical brighteners and other stabilizers, different from the ones described above.
- the polymer composition (C) has excellent reflectance properties.
- the polymer composition (C) can have an initial reflectance at 460 nm of greater than about 85 %, preferably greater than about 86 %, more preferably greater than about 88 %, still more preferably greater than about 90 %, as measured according to ASTM E- 1331-09 using a D65 illuminant with a 10° observer.
- melt-mixing method may be used to combine the polymeric components and non-polymeric ingredients to prepare the polymer
- composition (C) the polymeric components and non-polymeric ingredients may be added to a melt mixer, such as, for example, a single or twin- screw extruder, a blender or a Branbury mixer, either all at once through a single step addition, or in a stepwise fashion, and then melt-mixed.
- a melt mixer such as, for example, a single or twin- screw extruder, a blender or a Branbury mixer, either all at once through a single step addition, or in a stepwise fashion, and then melt-mixed.
- a melt mixer such as, for example, a single or twin- screw extruder, a blender or a Branbury mixer, either all at once through a single step addition, or in a stepwise fashion, and then melt-mixed.
- a further aspect of the present invention relates thus to a process for the manufacture of the polymer composition (C).
- An aspect of the present invention also provides an article comprising at least one part comprising the polymer composition (C), which provides various advantages over prior art parts and articles, in particular increased whiteness retention after exposure to heat and/or light while maintaining all their other properties at a high level.
- the article is a light emission apparatus.
- Non limitative examples of light emission apparatuses are keyless entry systems of an automobile, lightings in a refrigerator, liquid crystal display apparatuses, automobile front panel lighting apparatuses, desk lamps, headlights, household electrical appliance indicators and outdoor display apparatuses such as traffic signs, and optoelectronic devices comprising at least one semi-conductor chip that emits and/or transmits electromagnetic radiation commonly known as Light Emitting Diodes devices (LEDs).
- LEDs Light Emitting Diodes devices
- the light emission apparatus is a LED device.
- the terms "light emitting diode device” and “LED device” intend to denote a device comprising at least one light emitting diode, an electrical connection capable of connecting the diode to an electrical circuit, and a housing partially surrounding the diode.
- the LED device may optionally have a lens that fully or partially covers the LED.
- LEDs are preferably chosen from the group of top view LEDs, side view LEDs and power LEDs.
- the top view LEDs are notably used in automotive lighting applications such as panel displays, stop lights and turn signals.
- the side view LEDs are notably used for mobile appliance applications such as, for example, cell phones and PDAs.
- the power LEDs are notably used in flashlights, automotive day light running lights, signs and as backlight for LCD displays and TVs.
- the articles of the present invention may be incorporated into LED devices used in applications such as traffic signals, large area displays, video screens, interior and exterior lighting, cellular telephone display backlights, automotive displays, vehicle brake lights, vehicle head lamps, laptop computer display backlights, pedestrian floor illumination and flashlights.
- the articles of the present invention are preferably parts of a LED device such as housings, reflectors and heatsinks.
- the articles prepared from the polymer composition (C) may be manufactured by any suitable melt-processing method known to those skilled in the art, such as injection molding or the like.
- the articles may be overmolded over a metal (such as copper or silver- coated copper) lead frame that can be used to make an electrical connection to an LED inserted into the housing.
- the article preferably has a cavity in the portion of the housing that surrounds the LED, which serves to reflect the LED light in the outward direction and towards a lens, if one is present.
- the cavity may be in a cylindrical, conical, parabolic or other curved form, and preferably has a smooth surface.
- the walls of the cavity may be parallel or substantially parallel to the diode.
- a lens may be formed over the diode cavity and may comprise an epoxy or silicone material.
- At least 50 wt. % and more preferably more than 80 wt. % of the part comprises the polymer composition (C) (the part can possibly further contain notably a metal ; for example, for certain end uses, the surface of the part acting as reflector may be metal plated). More preferably, more than 90 wt. % of the part comprises the polymer composition (C). Still more preferably, the part consists essentially of the polymer composition (C). The most preferably, the part consists of the polymer composition (C).
- Poly amide PA 9T (GC51010) from Kuraray Co., LTD.
- Polyester PCT Polyester from EastmanTM Chemical Products.
- Wollastonite SH-1250 commercially available from Kinsei Matec Co., LTD. Titanium Dioxide : TIPAQUE PF691 available from Ishihara Sangyo Kaisha, LTD.
- polyester and polyamide resins described above were fed to the first barrel of a ZSK-26 twin screw extruder comprising 12 zones via a loss in weight feeder.
- the barrel set-point temperatures were in the range of 150-340°C and the resins were melted before zone 5.
- the other solid ingredients were fed at zone 5 through a side stuffer via a loss in weight feeder.
- the screw rate was in the range of 150-250 rpm.
- the extrudates were cooled and pelletized using conventional equipment.
- CE1 exhibited good reflectance as molded and very high reflectance retention after heat aging.
- CE2 presented higher reflectance as molded and unsatisfactory reflectance retention after heat aging.
- Rf (E) (Rf (CE1) * (1-Rp)) + (Rf (CE2) * Rp)
- Rf is the reflectance (as molded or after heat aging)
- Rp is the ratio of the weight of the polyamide over the total weight amount of resin in the composition.
- compositions according to the present invention featured somewhat higher reflectance as molded than the expected calculated values based on the weight average of the polyester and the polyamide in the composition.
- the reflectance after heat aging (10 minutes at 260°C) was significantly higher than the calculated values for those compositions.
- the compositions according to the present invention present thus high reflectance of light, high whiteness, high dimensional stability, high mechanical strength, high heat deflection temperature, and high heat resistance (low discoloration and low loss of reflectance when exposed to a high temperature) and are therefore very well suited for the manufacture of LED' s.
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Abstract
The present invention relates to a polymer composition including at least one polyamide and at least one polyester, the polyester comprising at least 50 mol% of recurring units comprising at least one cycloaliphatic group, featuring very high whiteness and whiteness retention after heat treatment suitable for the manufacture of light emitting diode (LED) components.
Description
Polyaroide compositions with improved whiteness retention after heat aging
This application claims priority to U.S. provisional application No.
61/919232 filed on December 20, 2013, the whole content of this application being incorporated herein by reference for all purposes.
Field of the Invention
The present invention relates to polymeric compositions comprising at least one polyamide and at least one polyester with excellent retention of light reflectance after heat aging.
The present invention further provides an article comprising the
composition of the invention, such as a part of a light emitting diode (LED) device.
Background of the Invention
LEDs are increasingly being used as light sources in numerous applications due to the high number of benefits they provide over traditional light sources. LEDs generally consume significantly less power than other light sources, require a low voltage to operate, and are resistant to mechanical shock. As a result, they are displacing incandescent and other light sources in many uses and have found applications in such disparate areas as traffic signals, interior and exterior lighting, cellular telephone displays, automotive displays, and flashlights.
LED components, such as reflectors, require an especially demanding combination of excellent color and improved physical properties. Ceramics may be advantageously used in those applications, but are still extremely costly and require demanding processing technologies. Therefore, polymers have been extensively studied and developed to replace ceramics as a lower cost material. A great benefit of thermoplastic polymers is that they may be injection molded and therefore offer considerable design flexibility. One problem noted with the polymer compositions used for the manufacture of LED components is that they tend to yellow when exposed to light and elevated temperatures. For example, during manufacturing, the LED components are heated to about 160°C to cure an epoxy or silicon encapsulant. The LED components are also exposed to temperatures above 260°C while soldering operations are performed. In addition, while in use, LED components are routinely subjected to light and temperatures above 80°C. Moreover, the recent development of higher voltage LEDs leads to
even higher working temperatures, generally above 100°C. This concurrent exposure to light and high temperatures causes yellowing of polymer
compositions used for forming LED components.
Desirably, reflectors of LEDs and, in fine, the polymer compositions from which they are made, should comply with a wide set of requirements, including, notably, high reflectance of light, high whiteness, high dimensional stability, high mechanical strength, high heat deflection temperature, and high heat resistance (low discoloration and low loss of refiectance when exposed to a high temperature) while being easily processed into the desired shapes.
Polyamides are currently used for the manufacture of LED' s because of their great overall properties. However, in spite of these positive characteristics, there is still a need in the market to improve the whiteness retention of LED reflectors made of polyamides.
Certain polyesters such as poly(cyclohexylenedimethylene
terephthalate) ("PCT") are also used in the manufacture of LED reflector where their good properties are valued. However, those polyesters suffer from lower initial whiteness when compared to polyamide-based compositions. The molding of polyesters and PCT in particular is also more challenging.
One of ordinary skill in the art will recognize that further improvements in heat stability and refiectance are advantageous for the development of LED devices.
WO 2013/026778 discloses compositions for LED comprising certain polyamides, and in particular polyphthalamides. Those compositions suffer from low reflectivity retention after heat treatment.
US 2012/0262927 relates to compositions suitable for molding LED reflectors comprising PCT, a white pigment and a reactive viscosity stabilizer such as a phenoxy resin or a non-aromatic epoxy resin. US '927 discloses in its examples PCT compositions comprising titanium dioxide, chopped glass fibers, 2 wt. % of talc and 8 other additives. Those compositions only achieve a maximum of about 84 % of whiteness index retention after 4 hours at 200°C.
Thus, there exists a need in the art for a polymer composition featuring all the benefits of polyamides while presenting higher whiteness retention after heat and/or light treatment.
The inventors have discovered that the blending of low amounts of specific polyesters into polyamide compositions greatly enhances their behavior in terms of whiteness retention after heat and/or light exposure.
The compositions according to the present invention satisfy thus the above- mentioned requirements and will be described in detail hereafter.
Summary of the Invention
In a first aspect, the present invention relates to a polymer composition (C) comprising :
- from 20 to 60 wt. % of at least one polyamide (PA);
- from 0.5 to 25 wt. % of at least one polyester (P) comprising at
least 50 mol % of recurring units comprising at least one cycloaliphatic group;
- from 0 to 60 wt. % of at least one white pigment selected from the group consisting of Ti02, ZnS, ZnO, Ce02 and BaS04,
- from 0 to 60 wt. % of at least one reinforcing filler,
based on the total weight of the polymer composition (C).
In a second aspect, the present invention relates to articles comprising at least one part comprising the invented polymer composition (C) and, in particular, to parts of LED devices made from such polymer composition (C). Detailed Description of the Invention
The polymer composition (C) according to the present invention comprises two essential ingredients that are described in detail here below :
The polyamide (PA)
The polymer composition (C) comprises from 20 to 60 wt. % of at least one polyamide (PA), based on the total weight of the polymer composition (C).
The expression "polyamide" is intended to denote any polymer which comprises at least 50 mol % of recurring units ((RPA), which are typically derived from the polycondensation of at least one dicarboxylic acid component (or derivative thereof) and at least one diamine component, and/or from the polycondensation of aminocarboxylic acids and/or lactams.
The expression 'derivative thereof when used in combination with the expression 'carboxylic acid' is intended to denote whichever derivative which is susceptible of reacting in polycondensation conditions to yield an amide bond. Examples of amide-forming derivatives include a mono- or di-alkyl ester, such as a mono- or di-methyl, ethyl or propyl ester, of such carboxylic acid; a mono- or di-aryl ester thereof; a mono- or di-acid halide thereof; and a mono-or di-acid amide thereof, a mono- or di-carboxylate salt.
In certain preferred embodiment, the polyamide (PA) of the polymer composition (C) comprises preferably at least 70 mol %, more preferably at least 80 mol %, still more preferably at least 90 mol % and most preferably at
least 95 mol % of recurring units (RPA). Excellent results were obtained when the polyamide (PA) of the polymer composition (C) consisted of recurring units (RPA).
The polyamide (PA) of the polymer composition (C) may be an aliphatic polyamide polymer or an aromatic polyamide polymer.
For the purpose of the present invention, the expression "aromatic polyamide polymer" is intended to denote a polyamide which comprises more than 35 mol %, preferably more than 45 mol %, more preferably more than 55 mol %, still more preferably more than 65 mol % and most preferably more than 75 mol % of recurring units (RPA) which are aromatic recurring units.
For the purpose of the present invention, the expression "aromatic recurring unit" is intended to denote any recurring unit that comprises at least one aromatic group. The aromatic recurring units may be formed by the polycondensation of at least one aromatic dicarboxylic acid with an aliphatic diamine or by the polycondensation of at least one aliphatic dicarboxylic acid with an aromatic diamine, or by the polycondensation of aromatic
aminocarboxylic acids.
For the purpose of the present invention, a dicarboxylic acid or a diamine is considered as "aromatic" when it comprises at least one aromatic group.
Non limitative examples of aromatic dicarboxylic acids are notably phthalic acids, including isophthalic acid (IA), terephthalic acid (TA) and orthophthalic acid (OA), 2,5-pyridinedicarboxylic acid, 2,4-pyridinedicarboxylic acid, 3,5-pyridinedicarboxylic acid, 2,2-bis(4-carboxyphenyl)propane, bis(4-carboxyphenyl)methane, 2,2-bis(4-carboxyphenyl)hexafluoropropane, 2,2-bis(4-carboxyphenyl)ketone, 4,4'-bis(4-carboxyphenyl)sulfone,
2,2-bis(3-carboxyphenyl)propane, bis(3-carboxyphenyl)methane,
2,2-bis(3-carboxyphenyl)hexafluoropropane, 2,2-bis(3-carboxyphenyl)ketone, bis(3-carboxyphenoxy)benzene, the 2,6-naphthalene dicarboxylic acid,
2,7-naphthalene dicarboxylic acid, 1 ,4-naphthalene dicarboxylic acid,
2, 3 -naphthalene dicarboxylic acid, 1,8 -naphthalene dicarboxylic acid,
1 ,2-naphthalene dicarboxylic acid.
Among aromatic diamines, mention can be notably made of meta- phenylene diamine (MPD), para-phenylene diamine (PPD),
3,4'-diaminodiphenyl ether (3,4'-ODA), 4,4'-diaminodiphenyl ether
(4,4'-ODA), meta-xylylene diamine (MXDA), and para-xylylene diamine (PXDA).
According to preferred embodiments of the present invention, the dicarboxylic acid is aromatic and comprises advantageously at least one phthalic acid selected from the group consisting of isophthalic acid (IA), and terephthalic acid (TA). Isophthalic acid and terephthalic acid can be used alone or in combination. The phthalic acid is preferably terephthalic acid, optionally in combination with isophthalic acid.
For the purpose of the present invention, the expression "aliphatic polyamide polymer" is intended to denote a polyamide that comprises aliphatic recurring units exclusively and said aliphatic recurring units are derived from at least one aliphatic dicarboxylic acid, as mentioned above, and at least one aliphatic diamine, and/or said aliphatic recurring units are derived from aliphatic aminocarboxylic acids and/or aliphatic lactams.
Among aliphatic dicarboxylic acids, mention can be notably made of oxalic acid [HOOC-COOH, malonic acid (HOOC-CH2-COOH), adipic acid [HOOC-(CH2)4-COOH], succinic acid [HOOC-(CH2)2-COOH], glutaric acid [HOOC-(CH2)3-COOH], 2,2-dimethyl-glutaric acid
[HOOC-C(CH3)2-(CH2)2-COOH], 2,4,4-trimethyl-adipic acid
[HOOC-CH(CH3)-CH2-C(CH3)2- CH2-COOH], pimelic acid
[HOOC-(CH2)5_COOH], suberic acid [HOOC-(CH2)6-COOH], azelaic acid
[HOOC-(CH2)7-COOH], sebacic acid [HOOC-(CH2)8-COOH], undecanedioic acid [HOOC-(CH2)9-COOH], dodecanedioic acid [HOOC-(CH2)i0-COOH], tetradecanedioic acid [HOOC-(CH2)n-COOH], cis- and/or trans-cyclohexane-
1.4- dicarboxylic acid and/or cis- and/or trans-cyclohexane-l,3-dicarboxylic acid (CHDA).
According to preferred embodiments of the present invention, the aliphatic dicarboxylic acid is trans-cyclohexane-l,4-dicarboxylic acid.
Non limitative examples of aliphatic diamines are typically aliphatic alkylene diamines having 2 to 18 carbon atoms, which are advantageously selected from the group consisting of 1 ,2-diaminoethane, 1 ,2-diaminopropane, propylene- 1,3-diamine, 1,3-diamino butane, 1 ,4-diamino butane,
1.5- diaminopentane, 1 ,4-diamino- 1 , 1 -dimethylbutane, 1 ,4-diamino- 1 - ethylbutane, 1 ,4-diamino- 1 ,2-dimethylbutane, 1 ,4-diamino- 1 ,3-dimethylbutane, 1 ,4-diamino- 1 ,4-dimethylbutane, 1 ,4-diamino-2,3-dimethylbutane, 1 ,2-diamino- 1-butylethane, 1,6-diaminohexane, 1,7-diamino heptane, 1,8-diamino-octane, l,6-diamino-2,5-dimethylhexane, l,6-diamino-2,4-dimethylhexane, 1,6-diamino- 3,3-dimethylhexane, l,6-diamino-2,2-dimethylhexane, 2-methyl-l,8-
diaminooctane, 1 ,9-diaminononane, 1 ,6-diamino-2,2,4-trimethylhexane,
1.6- diamino-2,4,4-trimethylhexane, 1 ,7-diamino-2,3-dimethylheptane,
1.7- diamino-2,4-dimethylheptane, 1 ,7-diamino-2,5-dimethylheptane,
1 ,7-diamino-2,2-dimethylheptane, 1 , 10-diaminodecane, 1 ,8-diamino- 1,3- dimethyloctane, l,8-diamino-l,4-dimethyloctane, l,8-diamino-2,4- dimethyloctane, 1 ,8-diamino-3,4-dimethyloctane, 1 ,8-diamino-4,5- dimethyloctane, 1 ,8-diamino-2,2-dimethyloctane, 1 ,8-diamino-3,3- dimethyloctane, 1 ,8-diamino-4,4-dimethyloctane, 1 ,6-diamino-2,4- diethylhexane, l,9-diamino-5-methylnonane, 1,11-diaminoundecane and
1,12-diaminododecane.
Also, the aliphatic diamine may be chosen from cycloaliphatic diamines such as isophorone diamine (also known as 5-amino-(l-aminomethyl)-l,3,3- trimethylcyclohexane), 1 ,3-cyclohexanebis(methylamine) (1 ,3-BAMC),
1 ,4-cyclohexanebis(methylamine) (1 ,4-BAMC),
4,4-diaminodicyclohexylmethane (PACM), and bis(4-amino-3- methy lcyclo hexy l)methane .
In addition, aromatic aminocarboxylic acids or derivatives thereof may also be used for the manufacture of the polyamide of the polymer composition (C), which is generally selected from the group consisting of
4-(aminomethyl)benzoic acid and 4-aminobenzoic acid, 6-aminohexanoic acid, l-aza-2-cyclononanone, l-aza-2-cyclododecanone, 11-aminoundecanoic acid, 12-aminododecanoic acid, 4-(aminomethyl)benzoic acid, cis-4- (aminomethyl)cyclohexanecarboxylic acid, trans-4-
(aminomethyl)cyclohexanecarboxylic acid, cis-4-aminocyclohexanecarboxylic acid and trans-4-aminocyclohexanecarboxylic acid.
Non limitative examples of aliphatic lactams are notably selected from the group consisting of caprolactam and lauryl lactam.
The polyamide (PA) of the polymer composition (C) comprises preferably at least 50 mol % of recurring units comprising an aliphatic moiety comprising at least 9 carbon atoms.
The recurring units comprising an aliphatic moiety comprising at least 9 carbon atoms may be formed by the polycondensation of at least one aliphatic dicarboxylic acid with at least one aliphatic diamine or by the polycondensation of at least one aliphatic dicarboxylic acid with at least one aromatic diamine, or by the polycondensation of at least one aromatic dicarboxylic acid with at least one aliphatic diamine or by the polycondensation of aminocarboxylic acids.
The aliphatic moiety comprising at least 9 carbon atoms present in the recurring units of the polyamide (PA) may be derived from aliphatic
dicarboxylic acids and/or aliphatic diamines detailed hereafter.
Notable examples of aliphatic dicarboxylic acids comprising an aliphatic moiety comprising at least 9 carbon atoms are azelaic
acid [HOOC-(CH2)7-COOH], sebacic acid [HOOC-(CH2)8-COOH],
undecanedioic acid [HOOC-(CH2)9-COOH], dodecanedioic
acid [HOOC-(CH2)io-COOH], tetradecanedioic acid [HOOC-(CH2)n-COOH]. Among them, azelaic acid [HOOC-(CH2)7-COOH], sebacic
acid [HOOC-(CH2)8-COOH], dodecanedioic acid [HOOC-(CH2)i0-COOH] are preferred.
Notable examples of aliphatic diamines comprising an aliphatic moiety comprising at least 9 carbon atoms are 1,9-diaminononane, l,6-diamino-2,2,4- trimethylhexane, 1 ,6-diamino-2,4,4-trimethylhexane, 1 ,7-diamino-2,3- dimethylheptane, l ,7-diamino-2,4-dimethylheptane, l,7-diamino-2,5- dimethylheptane, l ,7-diamino-2,2-dimethylheptane, 2 -methyl- 1,8- diaminooctane, 1,10-diaminodecane, l,8-diamino-l,3-dimethyloctane, 1,8- diamino- 1 ,4-dimethyloctane, 1 ,8-diamino-2,4-dimethyloctane, 1 ,8-diamino-3,4- dimethyloctane, 1 ,8-diamino-4,5-dimethyloctane, 1 ,8-diamino-2,2- dimethyloctane, l,8-diamino-3,3-dimethyloctane, l,8-diamino-4,4- dimethyloctane, 1 ,6-diamino-2,4-diethylhexane, 1 ,9-diamino-5-methylnonane,
1,11 -diaminoundecane and 1 , 12-diaminododecane. Among them,
1 ,9-diaminononane, 2-methyl- 1 ,8-diaminooctane, 1 , 10-diaminodecane,
1 , 12-diaminododecane are preferred. Excellent results were obtained when using 1,9-diaminononane and/or 2-methyl- 1,8-diaminooctane.
Non limitative examples of polyamides (PA) of the polymer
composition (C) are : the polymer of terephthalic acid with 1 ,9-diaminononane and/or 2-methyl- 1,8-diaminooctane, the polymer of 1,4-cyclohexanedicarboxylic acid with 1,9-diaminononane and/or 2-methyl- 1,8-diaminooctane, the polymer of terephthalic acid with 1,10-decamethylene diamine, the polymer of terephthalic acid with dodecamethylene diamine, the copolymer of terephthalic acid with hexamethylene diamine and decamethylene diamine; the copolymer of terephthalic acid and isophthalic acid with hexamethylene diamine and decamethylene diamine; the copolymer of terephthalic acid with decamethylene diamine and 11-amino-undecanoic acid, the copolymer of terephthalic acid with hexamethylene diamine and 11-amino-undecanoic acid; the copolymer of
hexamethylene diamine with terephthalic acid and sebacic acid; the copolymer of hexamethylene diamine with terephthalic acid and 1,12-diaminododecanoic acid; the copolymer of decamethylene diamine with terephthalic acid and
4-aminocyclohexanecarboxylic acid; the copolymer of decamethylene diamine with terephthalic acid and 4-(aminomethyl)-cyclohexanecarboxylic acid; the polymer of decamethylene diamine with 2,6-napthalenedicarboxylic acid; the copolymer of 2,6-napthalenedicarboxylic acid with hexamethylene diamine and decamethylene diamine; the copolymer of 2,6-napthalenedicarboxylic acid with hexamethylene diamine and decamethylene diamine; the polymer of
decamethylene diamine with 1,4-cyclohexanedicarboxylic acid, the copolymer of hexamethylene diamine with 11-amino-undecanoic acid and
2,6-napthalenedicarboxylic acid; the copolymer of terephthalic acid with decamethylene diamine and 2-methylpentamethylene diamine; the copolymer of 1,4-cyclohexanedicarboxylic acid with decamethylene diamine.
The polyamide (PA) is preferably selected from the group consisting of the polymer of terephthalic acid with 1 ,9-diaminononane and/or 2 -methyl- 1,8- diaminooctane, the polymer of 1 ,4-cyclohexanedicarboxylic acid with 1 ,9- diaminononane and/or 2-methyl-l,8-diaminooctane, the polymer of terephthalic acid with 1,10-decamethylene diamine, and the polymer of
1,4-cyclohexanedicarboxylic acid with 1,10-decamethylene diamine.
The polyamide (PA) has a melting point, as measured by DSC according to ISO-11357-3, of advantageously at least 250°C, preferably at least 260°C, more preferably at least 270°C and most preferably at least 280°C. Besides, its melting point is advantageously of at most 350°C, preferably at most 340°C, more preferably at most 330°C and most preferably at most 320°C. Excellent results were obtained with a polyamide (PA) having a melting point ranging from 280°C to 320°C.
The polyamide (PA) is preferably present in an amount of at least 25 wt. %, more preferably at least 30 wt. %, still more preferably at least 35 wt. %, and most preferably at least 40 wt. %, based on the total weight of the polymer composition (C).
The polyamide (PA) is also present in an amount of advantageously at most 58 wt.%, preferably at most 56 wt. %, more preferably at most 54 wt. %, still more preferably at most 52 wt. %, and most preferably at most 50 wt. %, based on the total weight of the polymer composition (C).
Excellent results were obtained when the polyamide (PA) was present in the polymer composition (C) in an amount from about 35 to about 55 wt. %, preferably from about 30 to about 50 wt. %, based on the total weight of the polymer composition (C).
The polymer composition (C) may comprise more than one polyamide
(PA).
The polyester (P)
The polymer composition (C) comprises from 0.5 to 25 wt. % of at least one polyester (P) comprising at least 50 mol % of recurring units comprising at least one cycloaliphatic group.
The term "polyester" is intended to include "copolyesters" and is understood to denote a polymer comprising at least 50 mol %, preferably at least 85 mol % of recurring units comprising at least one ester moiety
(commonly described by the formula : R-(C=0)-OR'). Polyesters may be obtained by ring opening polymerization of a cyclic monomer (MA) comprising at least one ester moiety ; by poly condensation of a monomer (MB) comprising at least one hydroxyl group and at least one carboxylic acid group, or by
polycondensation of at least one monomer (Mc) comprising at least two hydroxyl groups (a diol) and at least one monomer (MD) comprising at least two carboxylic acid groups (a dicarboxylic acid). As used herein, the term
dicarboxylic acid is intended to include dicarboxylic acids and any derivative of dicarboxylic acids, including their associated acid halides, esters, half-esters, salts, half-salts, anhydrides, mixed anhydrides, or mixtures thereof.
The polyester (P) comprises at least 50 mol %, preferably at least 60 mol %, more preferably at least 70 mol %, still more preferably at least 80 mol % and most preferably at least 90 mol % of recurring units comprising, in addition to the at least one ester moiety, at least one cycloaliphatic group. Excellent results were obtained when the polyester (P) was essentially composed of recurring units comprising at least one ester moiety and at least one cycloaliphatic group. The cycloaliphatic group may derive from monomers (MA), monomers (MB), monomers (Mc) or monomers (MD) comprising at least one group which is both aliphatic and cyclic.
Non limitative examples of monomers (MA) include lactide and
caprolactone.
Non limitative examples of monomers (MB) include gly colic acid,
4-hydroxybenzoic acid and 6-hydroxynaphthalene-2-carboxylic acid.
Non limitative examples of monomers (Mc) include
1,4-cyclohexanedimethanol, ethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol, 1,10-decanediol, 2,2,4-trimethyl 1,3-pentanediol, 2,2,4,4-tetramethyl-l,3-cyclobutanediol, and neopentyl glycol, while 1,4-cyclohexanedimethanol and neopentyl glycol are preferred.
Non limitative examples of monomers (MD) include terephthalic acid, isophthalic acid, naphthalene dicarboxylic acids, 1,4-cyclohexane dicarboxylic acid, succinic acid, sebacic acid, and adipic acid, while terephthalic acid and 1 ,4-cyclohexane dicarboxylic acid are preferred.
When the polyester (P) is a copolymer, monomers (Mc) and (MD) are preferably used. In such a case, monomer (Mc) is preferably
1,4-cyclohexanedimethanol and monomer (MD) is preferably a mixture of terephthalic acid and 1 ,6-naphthalene dicarboxylic acid.
When the polyester (P) is a homopolymer, it may be selected from poly(cyclohexylenedimethylene terephthalate) ("PCT") and
poly(cyclohexylenedimethylene naphthalate) ("PCN"). Most preferably, it is PCT (i.e. a homopolymer obtained through the polycondensation of terephthalic acid with 1,4-cyclohexylenedimethanol).
The polyester (P) has advantageously an intrinsic viscosity of from about 0.4 to about 2.0 dl/g as measured in a 60:40 phenol/tetrachloroethane mixture or similar solvent at about 30°C. Particularly suitable polyester (P) for this invention has an intrinsic viscosity of 0.5 to 1.4 dl/g.
The polyester (P) has a melting point, as measured by DSC according to ISO-11357-3, of advantageously at least 250°C, preferably at least 260°C, more preferably at least 270°C and most preferably at least 280°C. Besides, its melting point is advantageously of at most 350°C, preferably at most 340°C, more preferably at most 330°C and most preferably at most 320°C. Excellent results were obtained with a polyester (P) having a melting point ranging from 280°C to 320°C.
The polyester (P) is preferably present in an amount of at least 1 wt. %, more preferably at least 2 wt. %, still more preferably at least 3 wt. %, and most preferably at least 4 wt. %, based on the total weight of the polymer
composition (C).
The polyester (P) is also present in an amount of advantageously at most 20 wt. %, preferably at most 18 wt. %, more preferably at most 16 wt. %, still
more preferably at most 14 wt. %, and most preferably at most 12 wt. %, based on the total weight of the polymer composition (C).
Excellent results were obtained when the polyester (P) was present in the polymer composition (C) in an amount from about 1 to about 20 wt. %, preferably from about 2 to about 15 wt. %, based on the total weight of the polymer composition (C).
The polymer composition (C) may comprise more than one polyester (P). The white pigment
The polymer composition (C) may also comprise at least one white pigment selected from the group consisting of Ti02, ZnS, ZnO, Ce02 and BaS04.
The white pigment is preferably titanium dioxide (Ti02). The form of titanium dioxide is not particularly limited and a variety of crystalline forms such as the anatase form, the rutile form, and the monoclinic type can be used.
However, the rutile form is preferred due to its higher refraction index and its superior light stability. Titanium dioxide may or may not be treated with a surface treatment agent. The surface of the titanium dioxide particles will preferably be coated. The titanium dioxide will preferably be first coated with an inorganic coating and then with an organic coating. The titanium dioxide particles may be coated using any method known in the art. Preferred inorganic coatings include metal oxides. Organic coatings may include one or more of carboxylic acids, polyols, alkanolamines, and/or silicon compounds.
If present, the white pigment is preferably present in an amount of at least 5 wt. %, preferably of at least 10 wt. %, more preferably of at
least 15 wt. %, even more preferably of at least 20 wt. %, and most preferably of at least 25 wt. %, based on the total weight of the polymer composition (C).
Besides, the white pigment is also preferably present in an amount of at most 60 wt. %, preferably of at most 50 wt. %, more preferably of at
most 45 wt. %, even more preferably of at most 40 wt. %, and most preferably of at most 35 wt. %, based on the total weight of the polymer composition (C).
Good results were obtained when the white pigment was used in an amount of 10-60 wt. %, preferably of 20-40 wt. %, based on the total weight of the polymer composition (C).
Excellent results were obtained when titanium dioxide was used in an amount of 10-50 wt. %, preferably of 20-40 wt. %, based on the total weight of the polymer composition (C).
The reinforcing filler
The polymer composition (C) may also further comprise at least one reinforcing filler.
Reinforcing fillers are preferably fibrous. More preferably, the reinforcing filler is selected from glass fiber, carbon fiber, synthetic polymeric fiber, aramid fiber, aluminum fiber, titanium fiber, magnesium fiber, boron carbide fibers, rock wool fiber, steel fiber, wollastonite, etc. Still more preferably, it is selected from glass fiber, carbon fiber and wollastonite.
A particular class of fibrous fillers consists of whiskers, i.e. single crystal fibers made from various raw materials such as A1203, SiC, BC, Fe and Ni.
Among fibrous fillers, glass fibers are preferred ; they include chopped strand A-, E-, C-, D-, S- T- and R-glass fibers, as described in chapter 5.2.3, p. 43-48 of Additives for Plastics Handbook, 2nd ed., John Murphy.
In a preferred embodiment of the present invention the reinforcing filler is chosen from wollastonite and glass fiber. Glass fibers may have a round cross- section or an elliptic cross-section (also called flat fibers).
If present, the reinforcing filler is preferably present in an amount of at least 2 wt. %, more preferably at least 4 wt. %, still more preferably at least 5 wt. %, and most preferably at least 10 wt. %, based on the total weight of the polymer composition (C). When present, the reinforcing filler is also preferably present in an amount of at most 40 wt. %, more preferably at most 30 wt. %, still more preferably at most 25 wt. %, and most preferably at most 20 wt. %, based on the total weight of the polymer composition (C).
Excellent results were obtained when the reinforcing filler was present in the composition in an amount from about 5 to about 40 wt. %, preferably from about 5 to about 25 wt. %, and more preferably from about 10 to about 20 wt. %, based on the total weight of the polymer composition (C).
Optional ingredients
The polymer composition (C) can further contain one or more impact modifiers. The impact modifiers can be reactive with the polyester (P) and/or the polyamide (PA) or non-reactive. In certain specific embodiment, the polymer composition (C) contains at least one reactive impact modifier and at least one non-reactive impact modifier.
Reactive impact modifiers that may be used include ethylene-maleic anhydride copolymers, ethylene-alkyl (meth)acrylate-maleic anhydride copolymers, ethylene-alkyl (meth)acrylate-glycidyl (meth)acrylate copolymers,
and the like. An example of such reactive impact modifier is a random terpolymer of ethylene, methylacrylate and glycidyl methacrylate.
Non-reactive impact modifiers that may be blended into the polymer composition (C) generally include various rubber materials, such as acrylic rubbers, ASA rubbers, diene rubbers, organosiloxane rubbers, EPDM rubbers, SBS or SEBS rubbers, ABS rubbers, NBS rubbers and the like. Particular examples of non-reactive impact modifiers include ethyl butylacrylate, ethyl (methyl)acrylate or 2 ethyl hexyl acrylate copolymers.
If present, the impact modifier is preferably present in an amount of at least 0.5 wt. %, more preferably at least 0.7 wt. %, still more preferably at least 0.9 wt. %, and most preferably at least 1 wt. %, based on the total weight of the polymer composition (C). When present, the impact modifier is also preferably present in an amount of at most 5 wt. %, more preferably at most 4 wt.%, still more preferably at most 3 wt. %, and most preferably at most 2 wt.%, based on the total weight of the polymer composition (C).
The polymer composition (C) may optionally further contain up to about 3 wt. % of ultraviolet light stabilizers or UV blockers. Examples include hindered amines, triazoles and triazines, oxanilides, hydroxybenzophenones, benzoates, and a-cyanoacrylates. When present, the ultraviolet light stabilizers are preferably present in an amount of about 0.1 to about 3 wt. %, or preferably about 0.1 to about 1 wt. %, or more preferably about 0.1 to about 0.6 wt. %, of the total weight of the polymer composition (C).
The polymer composition (C) may also comprise other optional ingredients such as mold release agents, lubricants, fillers, optical brighteners and other stabilizers, different from the ones described above.
As described above, the polymer composition (C) has excellent reflectance properties. For example, the polymer composition (C) can have an initial reflectance at 460 nm of greater than about 85 %, preferably greater than about 86 %, more preferably greater than about 88 %, still more preferably greater than about 90 %, as measured according to ASTM E- 1331-09 using a D65 illuminant with a 10° observer.
Any melt-mixing method may be used to combine the polymeric components and non-polymeric ingredients to prepare the polymer
composition (C). For example, the polymeric components and non-polymeric ingredients may be added to a melt mixer, such as, for example, a single or twin- screw extruder, a blender or a Branbury mixer, either all at once through a single
step addition, or in a stepwise fashion, and then melt-mixed. When adding the polymeric components and non-polymeric ingredients in a stepwise fashion, part of the polymeric components and/or non-polymeric ingredients are first added and melt-mixed with the remaining polymeric components and non-polymeric ingredients are subsequently added and further melt-mixed until a well-mixed composition is obtained.
A further aspect of the present invention relates thus to a process for the manufacture of the polymer composition (C).
An aspect of the present invention also provides an article comprising at least one part comprising the polymer composition (C), which provides various advantages over prior art parts and articles, in particular increased whiteness retention after exposure to heat and/or light while maintaining all their other properties at a high level.
In a particular embodiment, the article is a light emission apparatus.
Non limitative examples of light emission apparatuses are keyless entry systems of an automobile, lightings in a refrigerator, liquid crystal display apparatuses, automobile front panel lighting apparatuses, desk lamps, headlights, household electrical appliance indicators and outdoor display apparatuses such as traffic signs, and optoelectronic devices comprising at least one semi-conductor chip that emits and/or transmits electromagnetic radiation commonly known as Light Emitting Diodes devices (LEDs). Preferably, the light emission apparatus is a LED device.
As used herein, the terms "light emitting diode device" and "LED device" intend to denote a device comprising at least one light emitting diode, an electrical connection capable of connecting the diode to an electrical circuit, and a housing partially surrounding the diode. The LED device may optionally have a lens that fully or partially covers the LED.
LEDs are preferably chosen from the group of top view LEDs, side view LEDs and power LEDs. The top view LEDs are notably used in automotive lighting applications such as panel displays, stop lights and turn signals. The side view LEDs are notably used for mobile appliance applications such as, for example, cell phones and PDAs. The power LEDs are notably used in flashlights, automotive day light running lights, signs and as backlight for LCD displays and TVs.
The articles of the present invention may be incorporated into LED devices used in applications such as traffic signals, large area displays, video screens,
interior and exterior lighting, cellular telephone display backlights, automotive displays, vehicle brake lights, vehicle head lamps, laptop computer display backlights, pedestrian floor illumination and flashlights.
The articles of the present invention are preferably parts of a LED device such as housings, reflectors and heatsinks.
The articles prepared from the polymer composition (C) may be manufactured by any suitable melt-processing method known to those skilled in the art, such as injection molding or the like.
The articles may be overmolded over a metal (such as copper or silver- coated copper) lead frame that can be used to make an electrical connection to an LED inserted into the housing. The article preferably has a cavity in the portion of the housing that surrounds the LED, which serves to reflect the LED light in the outward direction and towards a lens, if one is present. The cavity may be in a cylindrical, conical, parabolic or other curved form, and preferably has a smooth surface. Alternatively, the walls of the cavity may be parallel or substantially parallel to the diode. A lens may be formed over the diode cavity and may comprise an epoxy or silicone material.
Preferably at least 50 wt. % and more preferably more than 80 wt. % of the part comprises the polymer composition (C) (the part can possibly further contain notably a metal ; for example, for certain end uses, the surface of the part acting as reflector may be metal plated). More preferably, more than 90 wt. % of the part comprises the polymer composition (C). Still more preferably, the part consists essentially of the polymer composition (C). The most preferably, the part consists of the polymer composition (C).
Should the disclosure of any patents, patent applications, and publications which are incorporated herein by reference conflict with the description of the present application to the extent that it may render a term unclear, the present description shall take precedence.
EXAMPLES
The disclosure will now be illustrated with working examples, which are intended to illustrate the present invention and are not intended to restrictively imply any limitations on the scope of the present disclosure.
The following commercially available materials were used :
Poly amide : PA 9T (GC51010) from Kuraray Co., LTD.
Polyester : PCT Polyester from Eastman™ Chemical Products.
Wollastonite : SH-1250 commercially available from Kinsei Matec Co., LTD.
Titanium Dioxide : TIPAQUE PF691 available from Ishihara Sangyo Kaisha, LTD.
General procedure for the preparation of the compositions
The polyester and polyamide resins described above were fed to the first barrel of a ZSK-26 twin screw extruder comprising 12 zones via a loss in weight feeder. The barrel set-point temperatures were in the range of 150-340°C and the resins were melted before zone 5. The other solid ingredients were fed at zone 5 through a side stuffer via a loss in weight feeder. The screw rate was in the range of 150-250 rpm. The extrudates were cooled and pelletized using conventional equipment.
The nature and quantity of the various ingredients used are summarized in Table 1 , indicating the amount of each ingredient in weight percent.
Reflectance measurements
Behavior of a part made from the inventive composition in a LED device was studied by exposing samples at 260°C for 10 minutes to simulate part of the LED manufacturing process. Therefore, each one of the compositions of examples E3 and E4 and comparative examples CE1 and CE2 were used to prepare discs of about 60 mm diameter with a thickness of about 1 mm.
Reflectances were measured on a BKY-Gardner photo-spectrometer according to ASTM E- 1331-09 using a D65 illuminant with a 10° observer. The average reflectance results on the original molded parts and on the same parts after exposure to high heat (260°C for 10 minutes for the discs) obtained on at least 10 samples are summarized in Table 2, as well as the percentages of retention of reflectance at a wavelength of 460 nm.
Table 1 : Nature and quantity in weight % of the ingredients used
Table 2 : Reflectance measurements on discs after heat treatment at 260°C
Results
CE1 exhibited good reflectance as molded and very high reflectance retention after heat aging.
On the other hand, CE2 presented higher reflectance as molded and unsatisfactory reflectance retention after heat aging.
In Table 2, expected values of the reflectance as molded and after heat aging were calculated using the following equation :
Rf (E) = (Rf (CE1) * (1-Rp)) + (Rf (CE2) * Rp)
where
Rf is the reflectance (as molded or after heat aging), and
Rp is the ratio of the weight of the polyamide over the total weight amount of resin in the composition.
As it may be seen from the data presented in Table 2, the compositions according to the present invention (E3 and E4) featured somewhat higher reflectance as molded than the expected calculated values based on the weight average of the polyester and the polyamide in the composition.
Surprisingly, the reflectance after heat aging (10 minutes at 260°C) was significantly higher than the calculated values for those compositions.
The compositions according to the present invention present thus high reflectance of light, high whiteness, high dimensional stability, high mechanical strength, high heat deflection temperature, and high heat resistance (low discoloration and low loss of reflectance when exposed to a high temperature) and are therefore very well suited for the manufacture of LED' s.
Claims
1. A polymer composition (C) comprising :
- from 20 to 60 wt. % of at least one polyamide (PA);
- from 0.5 to 25 wt. % of at least one polyester (P) comprising at
least 50 mol % of recurring units comprising at least one cycloaliphatic group;
- from 0 to 60 wt. % of at least one white pigment selected from the group consisting of Ti02, ZnS, ZnO, Ce02 and BaS04,
- from 0 to 60 wt. % of at least one reinforcing filler, based on the total weight of the polymer composition (C).
2. Polymer composition (C) according to claim 1, wherein the
polyamide (PA) is present in an amount of from 35 to 55 wt. %, based on the total weight of the composition.
3. Polymer composition (C) according to anyone of the preceding claims, wherein the polyamide (PA) is selected from the group consisting of the polymer of terephthalic acid with 1 ,9-diaminononane and/or 2-methyl- 1 ,8-diaminooctane, the polymer of 1,4-cyclohexanedicarboxylic acid with 1 ,9-diaminononane and/or 2-methyl- 1,8-diaminooctane, the polymer of terephthalic acid with
1,10-decamethylene diamine, and the polymer of 1 ,4-cyclohexanedicarboxylic acid with 1,10-decamethylene diamine.
4. Polymer composition (C) according to anyone of the preceding claims, wherein at least 50 mol % of the recurring units of the polyester (P) are obtained through the polycondensation of terephthalic acid with
1 ,4-cyclohexylenedimethanol.
5. Polymer composition (C) according to anyone of the preceding claims, wherein the polyester (P) is poly(l ,4-cyclohexylenedimethylene terephthalate).
6. Polymer composition (C) according to anyone of the preceding claims, wherein the polyester (P) is present in the polymer composition (C) in an amount of from 1 to 20 wt. %.
7. Polymer composition (C) according to anyone of the preceding claims, wherein the white pigment is present in an amount of from 10 to 60 wt. %.
8. Polymer composition (C) according to anyone of the preceding claims, wherein the white pigment is Ti02.
9. Polymer composition (C) according to anyone of the preceding claims, wherein it further comprises at least one reinforcing filler selected from the group consisting of glass fiber and wollastonite.
10. Polymer composition (C) according to claim 9, wherein the
reinforcing filler is present in an amount of from 5 to 40 wt. %, based on the total weight of the polymer composition (C).
11. An article comprising at least one part comprising the polymeric composition (C) according to any one of the preceding claims.
12. The article according to claim 11, wherein the article is a light emitting diode (LED) device.
13. The article according to claim 11, wherein the part is a reflector.
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WO2015199062A1 (en) * | 2014-06-25 | 2015-12-30 | ユニチカ株式会社 | Resin composition and molded article thereof |
JP2018160655A (en) * | 2016-07-19 | 2018-10-11 | パナソニックIpマネジメント株式会社 | Molding material for light reflector and manufacturing method thereof, light reflector, base body and manufacturing method thereof, and light-emitting device |
US11078330B2 (en) | 2016-12-22 | 2021-08-03 | Mitsubishi Gas Chemical Company, Inc. | Polyamide resin composition, molded article, and method for manufacturing polyamide resin pellet |
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WO2015199062A1 (en) * | 2014-06-25 | 2015-12-30 | ユニチカ株式会社 | Resin composition and molded article thereof |
JP2018160655A (en) * | 2016-07-19 | 2018-10-11 | パナソニックIpマネジメント株式会社 | Molding material for light reflector and manufacturing method thereof, light reflector, base body and manufacturing method thereof, and light-emitting device |
JP2018160654A (en) * | 2016-07-19 | 2018-10-11 | パナソニックIpマネジメント株式会社 | Light reflector, base body, light-emitting device, and method for manufacturing base body |
JP7065381B2 (en) | 2016-07-19 | 2022-05-12 | パナソニックIpマネジメント株式会社 | Manufacturing method of light reflector, base body, light emitting device and base body |
JP7065382B2 (en) | 2016-07-19 | 2022-05-12 | パナソニックIpマネジメント株式会社 | Molding material for light reflector and its manufacturing method, light reflector, base body and its manufacturing method, and light emitting device |
US11078330B2 (en) | 2016-12-22 | 2021-08-03 | Mitsubishi Gas Chemical Company, Inc. | Polyamide resin composition, molded article, and method for manufacturing polyamide resin pellet |
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