JP7056620B2 - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
JP7056620B2
JP7056620B2 JP2019063315A JP2019063315A JP7056620B2 JP 7056620 B2 JP7056620 B2 JP 7056620B2 JP 2019063315 A JP2019063315 A JP 2019063315A JP 2019063315 A JP2019063315 A JP 2019063315A JP 7056620 B2 JP7056620 B2 JP 7056620B2
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JP
Japan
Prior art keywords
package
coefficient
thermal expansion
solder
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019063315A
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English (en)
Japanese (ja)
Other versions
JP2020167182A (ja
JP2020167182A5 (https=
Inventor
大佳 國枝
宏樹 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2019063315A priority Critical patent/JP7056620B2/ja
Priority to CN202080024606.2A priority patent/CN113632227A/zh
Priority to PCT/JP2020/010549 priority patent/WO2020195836A1/ja
Publication of JP2020167182A publication Critical patent/JP2020167182A/ja
Publication of JP2020167182A5 publication Critical patent/JP2020167182A5/ja
Priority to US17/481,783 priority patent/US11974398B2/en
Application granted granted Critical
Publication of JP7056620B2 publication Critical patent/JP7056620B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2019063315A 2019-03-28 2019-03-28 電子装置 Active JP7056620B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019063315A JP7056620B2 (ja) 2019-03-28 2019-03-28 電子装置
CN202080024606.2A CN113632227A (zh) 2019-03-28 2020-03-11 电子装置
PCT/JP2020/010549 WO2020195836A1 (ja) 2019-03-28 2020-03-11 電子装置
US17/481,783 US11974398B2 (en) 2019-03-28 2021-09-22 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019063315A JP7056620B2 (ja) 2019-03-28 2019-03-28 電子装置

Publications (3)

Publication Number Publication Date
JP2020167182A JP2020167182A (ja) 2020-10-08
JP2020167182A5 JP2020167182A5 (https=) 2021-04-01
JP7056620B2 true JP7056620B2 (ja) 2022-04-19

Family

ID=72611369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019063315A Active JP7056620B2 (ja) 2019-03-28 2019-03-28 電子装置

Country Status (4)

Country Link
US (1) US11974398B2 (https=)
JP (1) JP7056620B2 (https=)
CN (1) CN113632227A (https=)
WO (1) WO2020195836A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024085812A (ja) 2022-12-15 2024-06-27 株式会社デンソー 電子装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000323602A (ja) 1999-05-07 2000-11-24 Toshiba Corp 配線回路装置
JP2004103665A (ja) 2002-09-05 2004-04-02 Toshiba Corp 電子デバイスモジュール
JP2004356620A (ja) 2003-03-19 2004-12-16 Ngk Spark Plug Co Ltd 中継基板、半導体素子付き中継基板、中継基板付き基板、半導体素子と中継基板と基板とからなる構造体
JP2006313800A (ja) 2005-05-09 2006-11-16 Matsushita Electric Ind Co Ltd 半導体装置における実装構造の接続信頼性の予測方法およびその半導体装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2574902B2 (ja) * 1989-09-20 1997-01-22 株式会社日立製作所 半導体装置
JPH10247706A (ja) * 1997-03-05 1998-09-14 Sumitomo Kinzoku Electro Device:Kk ボールグリッドアレイパッケージ
JP2000260912A (ja) * 1999-03-05 2000-09-22 Fujitsu Ltd 半導体装置の実装構造及び半導体装置の実装方法
US6940176B2 (en) * 2002-05-21 2005-09-06 United Microelectronics Corp. Solder pads for improving reliability of a package
TW563895U (en) * 2003-03-06 2003-11-21 Advanced Semiconductor Eng Thin type ball grid array package
JP2004356618A (ja) 2003-03-19 2004-12-16 Ngk Spark Plug Co Ltd 中継基板、半導体素子付き中継基板、中継基板付き基板、半導体素子と中継基板と基板とからなる構造体、中継基板の製造方法
KR100839075B1 (ko) * 2007-01-03 2008-06-19 삼성전자주식회사 아이씨 패키지 및 그 제조방법
JP5961625B2 (ja) 2011-11-10 2016-08-02 パナソニック株式会社 半導体装置
JP2016162815A (ja) 2015-02-27 2016-09-05 株式会社ジェイテクト 半導体部品及び半導体部品の製造方法
US10700030B2 (en) * 2018-08-14 2020-06-30 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package having varying conductive pad sizes
JP2020167181A (ja) * 2019-03-28 2020-10-08 株式会社デンソー 電子装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000323602A (ja) 1999-05-07 2000-11-24 Toshiba Corp 配線回路装置
JP2004103665A (ja) 2002-09-05 2004-04-02 Toshiba Corp 電子デバイスモジュール
JP2004356620A (ja) 2003-03-19 2004-12-16 Ngk Spark Plug Co Ltd 中継基板、半導体素子付き中継基板、中継基板付き基板、半導体素子と中継基板と基板とからなる構造体
JP2006313800A (ja) 2005-05-09 2006-11-16 Matsushita Electric Ind Co Ltd 半導体装置における実装構造の接続信頼性の予測方法およびその半導体装置

Also Published As

Publication number Publication date
US11974398B2 (en) 2024-04-30
WO2020195836A1 (ja) 2020-10-01
JP2020167182A (ja) 2020-10-08
US20220007510A1 (en) 2022-01-06
CN113632227A (zh) 2021-11-09

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