JP2020167182A5 - - Google Patents

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Publication number
JP2020167182A5
JP2020167182A5 JP2019063315A JP2019063315A JP2020167182A5 JP 2020167182 A5 JP2020167182 A5 JP 2020167182A5 JP 2019063315 A JP2019063315 A JP 2019063315A JP 2019063315 A JP2019063315 A JP 2019063315A JP 2020167182 A5 JP2020167182 A5 JP 2020167182A5
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JP
Japan
Prior art keywords
package
coefficient
thermal expansion
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019063315A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020167182A (ja
JP7056620B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2019063315A priority Critical patent/JP7056620B2/ja
Priority claimed from JP2019063315A external-priority patent/JP7056620B2/ja
Priority to CN202080024606.2A priority patent/CN113632227A/zh
Priority to PCT/JP2020/010549 priority patent/WO2020195836A1/ja
Publication of JP2020167182A publication Critical patent/JP2020167182A/ja
Publication of JP2020167182A5 publication Critical patent/JP2020167182A5/ja
Priority to US17/481,783 priority patent/US11974398B2/en
Application granted granted Critical
Publication of JP7056620B2 publication Critical patent/JP7056620B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2019063315A 2019-03-28 2019-03-28 電子装置 Active JP7056620B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019063315A JP7056620B2 (ja) 2019-03-28 2019-03-28 電子装置
CN202080024606.2A CN113632227A (zh) 2019-03-28 2020-03-11 电子装置
PCT/JP2020/010549 WO2020195836A1 (ja) 2019-03-28 2020-03-11 電子装置
US17/481,783 US11974398B2 (en) 2019-03-28 2021-09-22 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019063315A JP7056620B2 (ja) 2019-03-28 2019-03-28 電子装置

Publications (3)

Publication Number Publication Date
JP2020167182A JP2020167182A (ja) 2020-10-08
JP2020167182A5 true JP2020167182A5 (https=) 2021-04-01
JP7056620B2 JP7056620B2 (ja) 2022-04-19

Family

ID=72611369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019063315A Active JP7056620B2 (ja) 2019-03-28 2019-03-28 電子装置

Country Status (4)

Country Link
US (1) US11974398B2 (https=)
JP (1) JP7056620B2 (https=)
CN (1) CN113632227A (https=)
WO (1) WO2020195836A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024085812A (ja) 2022-12-15 2024-06-27 株式会社デンソー 電子装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2574902B2 (ja) * 1989-09-20 1997-01-22 株式会社日立製作所 半導体装置
JPH10247706A (ja) * 1997-03-05 1998-09-14 Sumitomo Kinzoku Electro Device:Kk ボールグリッドアレイパッケージ
JP2000260912A (ja) * 1999-03-05 2000-09-22 Fujitsu Ltd 半導体装置の実装構造及び半導体装置の実装方法
JP2000323602A (ja) 1999-05-07 2000-11-24 Toshiba Corp 配線回路装置
US6940176B2 (en) * 2002-05-21 2005-09-06 United Microelectronics Corp. Solder pads for improving reliability of a package
JP2004103665A (ja) 2002-09-05 2004-04-02 Toshiba Corp 電子デバイスモジュール
TW563895U (en) * 2003-03-06 2003-11-21 Advanced Semiconductor Eng Thin type ball grid array package
JP2004356618A (ja) 2003-03-19 2004-12-16 Ngk Spark Plug Co Ltd 中継基板、半導体素子付き中継基板、中継基板付き基板、半導体素子と中継基板と基板とからなる構造体、中継基板の製造方法
JP2004356620A (ja) 2003-03-19 2004-12-16 Ngk Spark Plug Co Ltd 中継基板、半導体素子付き中継基板、中継基板付き基板、半導体素子と中継基板と基板とからなる構造体
JP2006313800A (ja) 2005-05-09 2006-11-16 Matsushita Electric Ind Co Ltd 半導体装置における実装構造の接続信頼性の予測方法およびその半導体装置
KR100839075B1 (ko) * 2007-01-03 2008-06-19 삼성전자주식회사 아이씨 패키지 및 그 제조방법
JP5961625B2 (ja) 2011-11-10 2016-08-02 パナソニック株式会社 半導体装置
JP2016162815A (ja) 2015-02-27 2016-09-05 株式会社ジェイテクト 半導体部品及び半導体部品の製造方法
US10700030B2 (en) * 2018-08-14 2020-06-30 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package having varying conductive pad sizes
JP2020167181A (ja) * 2019-03-28 2020-10-08 株式会社デンソー 電子装置

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