CN113632227A - 电子装置 - Google Patents

电子装置 Download PDF

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Publication number
CN113632227A
CN113632227A CN202080024606.2A CN202080024606A CN113632227A CN 113632227 A CN113632227 A CN 113632227A CN 202080024606 A CN202080024606 A CN 202080024606A CN 113632227 A CN113632227 A CN 113632227A
Authority
CN
China
Prior art keywords
package
thermal expansion
expansion coefficient
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202080024606.2A
Other languages
English (en)
Chinese (zh)
Inventor
国枝大佳
林宏树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of CN113632227A publication Critical patent/CN113632227A/zh
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CN202080024606.2A 2019-03-28 2020-03-11 电子装置 Withdrawn CN113632227A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019063315A JP7056620B2 (ja) 2019-03-28 2019-03-28 電子装置
JP2019-063315 2019-03-28
PCT/JP2020/010549 WO2020195836A1 (ja) 2019-03-28 2020-03-11 電子装置

Publications (1)

Publication Number Publication Date
CN113632227A true CN113632227A (zh) 2021-11-09

Family

ID=72611369

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080024606.2A Withdrawn CN113632227A (zh) 2019-03-28 2020-03-11 电子装置

Country Status (4)

Country Link
US (1) US11974398B2 (https=)
JP (1) JP7056620B2 (https=)
CN (1) CN113632227A (https=)
WO (1) WO2020195836A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024085812A (ja) 2022-12-15 2024-06-27 株式会社デンソー 電子装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10247706A (ja) * 1997-03-05 1998-09-14 Sumitomo Kinzoku Electro Device:Kk ボールグリッドアレイパッケージ
JP2000323602A (ja) * 1999-05-07 2000-11-24 Toshiba Corp 配線回路装置
CN1489202A (zh) * 2002-09-05 2004-04-14 ��ʽ���綫֥ 电子器件模块
JP2004356620A (ja) * 2003-03-19 2004-12-16 Ngk Spark Plug Co Ltd 中継基板、半導体素子付き中継基板、中継基板付き基板、半導体素子と中継基板と基板とからなる構造体
KR100839075B1 (ko) * 2007-01-03 2008-06-19 삼성전자주식회사 아이씨 패키지 및 그 제조방법
CN113632218A (zh) * 2019-03-28 2021-11-09 株式会社电装 电子装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2574902B2 (ja) * 1989-09-20 1997-01-22 株式会社日立製作所 半導体装置
JP2000260912A (ja) * 1999-03-05 2000-09-22 Fujitsu Ltd 半導体装置の実装構造及び半導体装置の実装方法
US6940176B2 (en) * 2002-05-21 2005-09-06 United Microelectronics Corp. Solder pads for improving reliability of a package
TW563895U (en) * 2003-03-06 2003-11-21 Advanced Semiconductor Eng Thin type ball grid array package
JP2004356618A (ja) 2003-03-19 2004-12-16 Ngk Spark Plug Co Ltd 中継基板、半導体素子付き中継基板、中継基板付き基板、半導体素子と中継基板と基板とからなる構造体、中継基板の製造方法
JP2006313800A (ja) 2005-05-09 2006-11-16 Matsushita Electric Ind Co Ltd 半導体装置における実装構造の接続信頼性の予測方法およびその半導体装置
JP5961625B2 (ja) 2011-11-10 2016-08-02 パナソニック株式会社 半導体装置
JP2016162815A (ja) 2015-02-27 2016-09-05 株式会社ジェイテクト 半導体部品及び半導体部品の製造方法
US10700030B2 (en) * 2018-08-14 2020-06-30 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package having varying conductive pad sizes

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10247706A (ja) * 1997-03-05 1998-09-14 Sumitomo Kinzoku Electro Device:Kk ボールグリッドアレイパッケージ
JP2000323602A (ja) * 1999-05-07 2000-11-24 Toshiba Corp 配線回路装置
CN1489202A (zh) * 2002-09-05 2004-04-14 ��ʽ���綫֥ 电子器件模块
JP2004356620A (ja) * 2003-03-19 2004-12-16 Ngk Spark Plug Co Ltd 中継基板、半導体素子付き中継基板、中継基板付き基板、半導体素子と中継基板と基板とからなる構造体
KR100839075B1 (ko) * 2007-01-03 2008-06-19 삼성전자주식회사 아이씨 패키지 및 그 제조방법
CN113632218A (zh) * 2019-03-28 2021-11-09 株式会社电装 电子装置

Also Published As

Publication number Publication date
US11974398B2 (en) 2024-04-30
WO2020195836A1 (ja) 2020-10-01
JP2020167182A (ja) 2020-10-08
US20220007510A1 (en) 2022-01-06
JP7056620B2 (ja) 2022-04-19

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Application publication date: 20211109