JP7043173B2 - ダイシング用保護膜基材、ダイシング用保護膜組成物、ダイシング用保護シート、及び被加工ウエーハの製造方法 - Google Patents

ダイシング用保護膜基材、ダイシング用保護膜組成物、ダイシング用保護シート、及び被加工ウエーハの製造方法 Download PDF

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JP7043173B2
JP7043173B2 JP2017020445A JP2017020445A JP7043173B2 JP 7043173 B2 JP7043173 B2 JP 7043173B2 JP 2017020445 A JP2017020445 A JP 2017020445A JP 2017020445 A JP2017020445 A JP 2017020445A JP 7043173 B2 JP7043173 B2 JP 7043173B2
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Prior art keywords
protective film
dicing
base material
monomer constituent
wafer
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Japanese (ja)
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JP2018129365A (ja
Inventor
隆宏 浅井
健人 安蘇谷
聡 嶋谷
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Tokyo Ohka Kogyo Co Ltd
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Tokyo Ohka Kogyo Co Ltd
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Priority to JP2017020445A priority Critical patent/JP7043173B2/ja
Priority to TW106143496A priority patent/TWI766913B/zh
Priority to KR1020180005464A priority patent/KR102406755B1/ko
Publication of JP2018129365A publication Critical patent/JP2018129365A/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D125/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Coating compositions based on derivatives of such polymers
    • C09D125/02—Homopolymers or copolymers of hydrocarbons
    • C09D125/04—Homopolymers or copolymers of styrene
    • C09D125/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2017020445A 2017-02-07 2017-02-07 ダイシング用保護膜基材、ダイシング用保護膜組成物、ダイシング用保護シート、及び被加工ウエーハの製造方法 Active JP7043173B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017020445A JP7043173B2 (ja) 2017-02-07 2017-02-07 ダイシング用保護膜基材、ダイシング用保護膜組成物、ダイシング用保護シート、及び被加工ウエーハの製造方法
TW106143496A TWI766913B (zh) 2017-02-07 2017-12-12 切割用保護膜基材、切割用保護膜組成物、切割用保護薄片及被加工晶圓之製造方法
KR1020180005464A KR102406755B1 (ko) 2017-02-07 2018-01-16 다이싱용 보호막 기재, 다이싱용 보호막 조성물, 다이싱용 보호 시트, 및 피가공 웨이퍼의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017020445A JP7043173B2 (ja) 2017-02-07 2017-02-07 ダイシング用保護膜基材、ダイシング用保護膜組成物、ダイシング用保護シート、及び被加工ウエーハの製造方法

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JP2018129365A JP2018129365A (ja) 2018-08-16
JP7043173B2 true JP7043173B2 (ja) 2022-03-29

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KR (1) KR102406755B1 (ko)
TW (1) TWI766913B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020209127A1 (ja) * 2019-04-12 2020-10-15 東京エレクトロン株式会社 基板処理方法及び基板処理システム
WO2023002846A1 (ja) 2021-07-20 2023-01-26 昭和電工マテリアルズ株式会社 ダイシング保護層用の樹脂組成物及び半導体ウェハの加工方法
CN115651474B (zh) * 2022-10-21 2023-07-07 大连奥首科技有限公司 Cmos影像感应器防污染和防划伤的保护液及专用清洗液
WO2024203855A1 (ja) * 2023-03-30 2024-10-03 日東電工株式会社 保護シート、及び、電子部品の製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009283607A (ja) 2008-05-21 2009-12-03 Hitachi Chem Co Ltd ウエハ薄化加工兼用の半導体用接着テープ及びウエハ薄化加工兼用の半導体用接着テープの半導体ウエハ表面への貼り付け方法
JP2010262970A (ja) 2009-04-30 2010-11-18 Nitto Denko Corp 積層フィルム及び半導体装置の製造方法
JP2011045890A (ja) 2009-08-25 2011-03-10 Kansai Paint Co Ltd レーザー加工方法
JP2011204806A (ja) 2010-03-24 2011-10-13 Nitto Denko Corp ウエハの加工方法
JP2014130853A (ja) 2012-12-27 2014-07-10 Fujifilm Corp 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法
JP2014172932A (ja) 2013-03-06 2014-09-22 Nagase Chemtex Corp 電子部品保護膜形成用組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2674819B2 (ja) * 1989-01-18 1997-11-12 株式会社クラレ アルカリ水可溶性ホットメルト型接着剤
JPH05230433A (ja) * 1992-02-19 1993-09-07 Kuraray Co Ltd ラベル用接着剤
JP4571850B2 (ja) 2004-11-12 2010-10-27 東京応化工業株式会社 レーザーダイシング用保護膜剤及び該保護膜剤を用いたウエーハの加工方法
JP2008024771A (ja) * 2006-07-19 2008-02-07 Daicel Chem Ind Ltd 半導体レジスト樹脂の保護膜用樹脂製造方法及び半導体の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009283607A (ja) 2008-05-21 2009-12-03 Hitachi Chem Co Ltd ウエハ薄化加工兼用の半導体用接着テープ及びウエハ薄化加工兼用の半導体用接着テープの半導体ウエハ表面への貼り付け方法
JP2010262970A (ja) 2009-04-30 2010-11-18 Nitto Denko Corp 積層フィルム及び半導体装置の製造方法
JP2011045890A (ja) 2009-08-25 2011-03-10 Kansai Paint Co Ltd レーザー加工方法
JP2011204806A (ja) 2010-03-24 2011-10-13 Nitto Denko Corp ウエハの加工方法
JP2014130853A (ja) 2012-12-27 2014-07-10 Fujifilm Corp 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法
JP2014172932A (ja) 2013-03-06 2014-09-22 Nagase Chemtex Corp 電子部品保護膜形成用組成物

Also Published As

Publication number Publication date
JP2018129365A (ja) 2018-08-16
TW201840690A (zh) 2018-11-16
KR102406755B1 (ko) 2022-06-08
TWI766913B (zh) 2022-06-11
KR20180091711A (ko) 2018-08-16

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