TWI766913B - 切割用保護膜基材、切割用保護膜組成物、切割用保護薄片及被加工晶圓之製造方法 - Google Patents

切割用保護膜基材、切割用保護膜組成物、切割用保護薄片及被加工晶圓之製造方法 Download PDF

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Publication number
TWI766913B
TWI766913B TW106143496A TW106143496A TWI766913B TW I766913 B TWI766913 B TW I766913B TW 106143496 A TW106143496 A TW 106143496A TW 106143496 A TW106143496 A TW 106143496A TW I766913 B TWI766913 B TW I766913B
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TW
Taiwan
Prior art keywords
protective film
dicing
wafer
base material
copolymer
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TW106143496A
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English (en)
Chinese (zh)
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TW201840690A (zh
Inventor
浅井𨺓宏
安蘇谷健人
嶋谷聡
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日商東京應化工業股份有限公司
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Publication of TW201840690A publication Critical patent/TW201840690A/zh
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Publication of TWI766913B publication Critical patent/TWI766913B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D125/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Coating compositions based on derivatives of such polymers
    • C09D125/02—Homopolymers or copolymers of hydrocarbons
    • C09D125/04—Homopolymers or copolymers of styrene
    • C09D125/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW106143496A 2017-02-07 2017-12-12 切割用保護膜基材、切割用保護膜組成物、切割用保護薄片及被加工晶圓之製造方法 TWI766913B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017020445A JP7043173B2 (ja) 2017-02-07 2017-02-07 ダイシング用保護膜基材、ダイシング用保護膜組成物、ダイシング用保護シート、及び被加工ウエーハの製造方法
JP2017-020445 2017-02-07

Publications (2)

Publication Number Publication Date
TW201840690A TW201840690A (zh) 2018-11-16
TWI766913B true TWI766913B (zh) 2022-06-11

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TW106143496A TWI766913B (zh) 2017-02-07 2017-12-12 切割用保護膜基材、切割用保護膜組成物、切割用保護薄片及被加工晶圓之製造方法

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JP (1) JP7043173B2 (ko)
KR (1) KR102406755B1 (ko)
TW (1) TWI766913B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020209127A1 (ja) * 2019-04-12 2020-10-15 東京エレクトロン株式会社 基板処理方法及び基板処理システム
WO2023002846A1 (ja) 2021-07-20 2023-01-26 昭和電工マテリアルズ株式会社 ダイシング保護層用の樹脂組成物及び半導体ウェハの加工方法
CN115651474B (zh) * 2022-10-21 2023-07-07 大连奥首科技有限公司 Cmos影像感应器防污染和防划伤的保护液及专用清洗液
WO2024203855A1 (ja) * 2023-03-30 2024-10-03 日東電工株式会社 保護シート、及び、電子部品の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011045890A (ja) * 2009-08-25 2011-03-10 Kansai Paint Co Ltd レーザー加工方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2674819B2 (ja) * 1989-01-18 1997-11-12 株式会社クラレ アルカリ水可溶性ホットメルト型接着剤
JPH05230433A (ja) * 1992-02-19 1993-09-07 Kuraray Co Ltd ラベル用接着剤
JP4571850B2 (ja) 2004-11-12 2010-10-27 東京応化工業株式会社 レーザーダイシング用保護膜剤及び該保護膜剤を用いたウエーハの加工方法
JP2008024771A (ja) * 2006-07-19 2008-02-07 Daicel Chem Ind Ltd 半導体レジスト樹脂の保護膜用樹脂製造方法及び半導体の製造方法
JP5837272B2 (ja) * 2008-05-21 2015-12-24 日立化成株式会社 半導体製造装置の製造方法
JP2010262970A (ja) * 2009-04-30 2010-11-18 Nitto Denko Corp 積層フィルム及び半導体装置の製造方法
JP2011204806A (ja) * 2010-03-24 2011-10-13 Nitto Denko Corp ウエハの加工方法
JP6170672B2 (ja) * 2012-12-27 2017-07-26 富士フイルム株式会社 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法
JP6191169B2 (ja) * 2013-03-06 2017-09-06 ナガセケムテックス株式会社 電子部品保護膜形成用組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011045890A (ja) * 2009-08-25 2011-03-10 Kansai Paint Co Ltd レーザー加工方法

Also Published As

Publication number Publication date
JP2018129365A (ja) 2018-08-16
TW201840690A (zh) 2018-11-16
JP7043173B2 (ja) 2022-03-29
KR102406755B1 (ko) 2022-06-08
KR20180091711A (ko) 2018-08-16

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