JP7032502B2 - 酸性水性銀－ニッケル合金電気めっき組成物及び方法 - Google Patents

酸性水性銀－ニッケル合金電気めっき組成物及び方法 Download PDF

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JP7032502B2
JP7032502B2 JP2020167105A JP2020167105A JP7032502B2 JP 7032502 B2 JP7032502 B2 JP 7032502B2 JP 2020167105 A JP2020167105 A JP 2020167105A JP 2020167105 A JP2020167105 A JP 2020167105A JP 7032502 B2 JP7032502 B2 JP 7032502B2
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silver
nickel
nickel alloy
alloy electroplating
electroplating composition
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Japanese (ja)
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JP2021063291A (ja
Inventor
シー．・チェン ジェイミー・ワイ．
マイケル・リップシュッツ
ミゲル・エー．・ロドリゲス
キンチャン・ロー
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Rohm and Haas Electronic Materials LLC
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Rohm and Haas Electronic Materials LLC
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/005—Jewels; Clockworks; Coins

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2020167105A 2019-10-15 2020-10-01 酸性水性銀－ニッケル合金電気めっき組成物及び方法 Active JP7032502B2 (ja)

Priority Applications (1)

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JP2021181367A JP2022023995A (ja) 2019-10-15 2021-11-05 酸性水性銀－ニッケル合金電気めっき組成物及び方法

Applications Claiming Priority (2)

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US16/653,216 2019-10-15
US16/653,216 US11242609B2 (en) 2019-10-15 2019-10-15 Acidic aqueous silver-nickel alloy electroplating compositions and methods

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JP2021181367A Division JP2022023995A (ja) 2019-10-15 2021-11-05 酸性水性銀－ニッケル合金電気めっき組成物及び方法

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JP2021063291A JP2021063291A (ja) 2021-04-22
JP7032502B2 true JP7032502B2 (ja) 2022-03-08

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JP2021181367A Pending JP2022023995A (ja) 2019-10-15 2021-11-05 酸性水性銀－ニッケル合金電気めっき組成物及び方法

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Country Link
US (1) US11242609B2 (zh)
EP (1) EP3816325A3 (zh)
JP (2) JP7032502B2 (zh)
KR (1) KR102418723B1 (zh)
CN (1) CN112663101A (zh)
TW (1) TWI747506B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11629426B1 (en) * 2022-06-29 2023-04-18 Rohm And Haas Electronic Materials Llc Silver electroplating compositions and methods for electroplating rough matt silver

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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JP2016522327A (ja) 2013-06-04 2016-07-28 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 銀−スズ合金の電気めっき浴

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DE10158227A1 (de) 2001-11-15 2003-06-05 Siemens Ag Elektrolysebad zum galvanischen Abscheiden von Silber-Zinn-Legierungen
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US7273540B2 (en) * 2002-07-25 2007-09-25 Shinryo Electronics Co., Ltd. Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
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KR20130006658A (ko) * 2010-03-12 2013-01-17 엑스탤릭 코포레이션 코팅된 물품 및 방법
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DE102013215476B3 (de) 2013-08-06 2015-01-08 Umicore Galvanotechnik Gmbh Elektrolyt zur elektrolytischen Abscheidung von Silber-Palladium-Legierungen und Verfahren zu deren Abscheidung
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CN104611739A (zh) 2013-11-05 2015-05-13 无锡市雪江环境工程设备有限公司 一种半胱氨酸镀银电镀液及电镀方法
US10889907B2 (en) * 2014-02-21 2021-01-12 Rohm And Haas Electronic Materials Llc Cyanide-free acidic matte silver electroplating compositions and methods
CN104120464A (zh) 2014-07-31 2014-10-29 宁国市裕华电器有限公司 一种酸性镀银液
EP3159435B1 (de) 2015-10-21 2018-05-23 Umicore Galvanotechnik GmbH Zusatz für silber-palladium-legierungselektrolyte
JP6838839B2 (ja) * 2017-05-25 2021-03-03 トヨタ自動車株式会社 銀めっき液、銀めっき材料及び電気・電子部品、並びに銀めっき材料の製造方法。
US10718059B2 (en) * 2017-07-10 2020-07-21 Rohm And Haas Electronic Materials Llc Nickel electroplating compositions with cationic polymers and methods of electroplating nickel
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Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010265491A (ja) 2009-05-12 2010-11-25 Ishihara Chem Co Ltd スズ又はスズ合金メッキ浴、及び当該メッキ浴を用いたバレルメッキ方法
JP2016522327A (ja) 2013-06-04 2016-07-28 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 銀−スズ合金の電気めっき浴

Also Published As

Publication number Publication date
KR102418723B1 (ko) 2022-07-07
US20210108324A1 (en) 2021-04-15
CN112663101A (zh) 2021-04-16
KR20210045310A (ko) 2021-04-26
JP2022023995A (ja) 2022-02-08
US11242609B2 (en) 2022-02-08
TWI747506B (zh) 2021-11-21
EP3816325A3 (en) 2021-08-18
TW202117088A (zh) 2021-05-01
JP2021063291A (ja) 2021-04-22
EP3816325A2 (en) 2021-05-05

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