ES2117995T3 - Baño para deposito galvanico de aleaciones de plata-estaño. - Google Patents
Baño para deposito galvanico de aleaciones de plata-estaño.Info
- Publication number
- ES2117995T3 ES2117995T3 ES95100167T ES95100167T ES2117995T3 ES 2117995 T3 ES2117995 T3 ES 2117995T3 ES 95100167 T ES95100167 T ES 95100167T ES 95100167 T ES95100167 T ES 95100167T ES 2117995 T3 ES2117995 T3 ES 2117995T3
- Authority
- ES
- Spain
- Prior art keywords
- silver
- tin
- tin alloys
- bath
- galvanic deposit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
LAS ALEACIONES PLATA-ESTAÑO SE SEPARAN SOBRE UNA VIA GALVANICA A PARTIR DE UN BAÑO LIBRE DE CIANURO, QUE SE PREPARA BAJO LA UTILIZACION DE PLATA COMO NITRATO O COMPLEJO DE DIAMMINA, ESTAÑO COMO COMPUESTO SOLUBLE DE ESTAÑO (II) O COMO ESTAÑO (IV), ACIDOS CARBOXILICOS MERCAPTO ALCANO Y ACIDOS SULFONICOS MERCAPTO ALCANO. A PARTIR DEL BAÑO SE SEPARAN LAS CAPAS REGULARES Y RESISTENTES A LA ADHERENCIA A BASE DE ALEACIONES PLATA-ESTAÑO CON UN CONTENIDO EN PLATA DE APROXIMADAMENTE 20-99 % EN PESO.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4403601 | 1994-02-05 | ||
DE4440176A DE4440176C2 (de) | 1994-02-05 | 1994-11-10 | Bad zum galvanischen Abscheiden von Silber-Zinn-Legierungen |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2117995T3 true ES2117995T3 (es) | 1998-09-01 |
Family
ID=25933579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES95100167T Expired - Lifetime ES2117995T3 (es) | 1994-02-05 | 1995-01-07 | Baño para deposito galvanico de aleaciones de plata-estaño. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5514261A (es) |
EP (1) | EP0666342B1 (es) |
JP (1) | JPH07252684A (es) |
CA (1) | CA2141090A1 (es) |
ES (1) | ES2117995T3 (es) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3301707B2 (ja) * | 1997-01-20 | 2002-07-15 | ディップソール株式会社 | 錫−銀合金酸性電気めっき浴 |
DE19752329A1 (de) * | 1997-11-26 | 1999-05-27 | Stolberger Metallwerke Gmbh | Verfahren zur Herstellung eines metallischen Verbundbands |
US6210556B1 (en) | 1998-02-12 | 2001-04-03 | Learonal, Inc. | Electrolyte and tin-silver electroplating process |
JP3352422B2 (ja) | 1999-02-10 | 2002-12-03 | セントラル硝子株式会社 | 銀被膜形成用薬液および銀被膜形成方法 |
JP3433291B2 (ja) * | 1999-09-27 | 2003-08-04 | 石原薬品株式会社 | スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品 |
JP3266242B2 (ja) * | 1999-10-12 | 2002-03-18 | 理研電線株式会社 | 錫めっき線の熱酸化黄変防止法 |
DE10014852A1 (de) * | 2000-03-24 | 2001-09-27 | Enthone Omi Deutschland Gmbh | Verfahren zur Abscheidung einer Silber-Zinn-Legierung |
US6491806B1 (en) * | 2000-04-27 | 2002-12-10 | Intel Corporation | Electroplating bath composition |
US7628903B1 (en) | 2000-05-02 | 2009-12-08 | Ishihara Chemical Co., Ltd. | Silver and silver alloy plating bath |
US6924044B2 (en) | 2001-08-14 | 2005-08-02 | Snag, Llc | Tin-silver coatings |
US7122108B2 (en) | 2001-10-24 | 2006-10-17 | Shipley Company, L.L.C. | Tin-silver electrolyte |
TW500836B (en) * | 2001-11-13 | 2002-09-01 | Jung-Huei Chen | Low-lead-content plating process |
DE10158227A1 (de) * | 2001-11-15 | 2003-06-05 | Siemens Ag | Elektrolysebad zum galvanischen Abscheiden von Silber-Zinn-Legierungen |
US20070037005A1 (en) * | 2003-04-11 | 2007-02-15 | Rohm And Haas Electronic Materials Llc | Tin-silver electrolyte |
DE102005055742A1 (de) * | 2005-11-23 | 2007-05-24 | Robert Bosch Gmbh | Verfahren zum Herstellen einer kontaktgeeigneten Schicht auf einem Metallelement |
US20070158199A1 (en) * | 2005-12-30 | 2007-07-12 | Haight Scott M | Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps |
US20080308300A1 (en) * | 2007-06-18 | 2008-12-18 | Conti Mark A | Method of manufacturing electrically conductive strips |
EP2085502A1 (en) * | 2008-01-29 | 2009-08-05 | Enthone, Incorporated | Electrolyte composition and method for the deposition of a tin-zinc alloy |
DE102011088211A1 (de) * | 2011-12-12 | 2013-06-13 | Robert Bosch Gmbh | Kontaktelement und Verfahren zu seiner Herstellung |
US9663667B2 (en) | 2013-01-22 | 2017-05-30 | Andre Reiss | Electroless silvering ink |
US9512529B2 (en) | 2013-06-04 | 2016-12-06 | Rohm And Haas Electronic Materials Llc | Electroplating baths of silver and tin alloys |
CN108517516B (zh) * | 2018-05-29 | 2020-10-23 | 电子科技大学 | 一种化学镀银液及其制备方法 |
DE102018126174B3 (de) * | 2018-10-22 | 2019-08-29 | Umicore Galvanotechnik Gmbh | Thermisch stabile Silberlegierungsschichten, Verfahren zur Abscheidung und Verwendung |
US11242609B2 (en) * | 2019-10-15 | 2022-02-08 | Rohm and Hass Electronic Materials LLC | Acidic aqueous silver-nickel alloy electroplating compositions and methods |
US11434577B2 (en) * | 2019-10-17 | 2022-09-06 | Rohm And Haas Electronic Materials Llc | Acid aqueous binary silver-bismuth alloy electroplating compositions and methods |
EP4186999A4 (en) * | 2020-07-22 | 2024-07-31 | Mitsubishi Materials Corp | TERMINAL MATERIAL FOR CONNECTORS |
JP7119267B2 (ja) * | 2020-07-22 | 2022-08-17 | 三菱マテリアル株式会社 | コネクタ用端子材 |
JP7353249B2 (ja) * | 2020-08-19 | 2023-09-29 | Eeja株式会社 | シアン系電解銀合金めっき液 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE718252C (de) * | 1939-06-01 | 1942-03-07 | Degussa | Verfahren zur Erzeugung schwefelwasserstoffbestaendiger galvanischer Silberueberzuege |
DE849787C (de) * | 1949-11-15 | 1952-09-18 | Forsch | Verfahren zur Herstellung harter galvanischer Silber- und Goldueberzuege |
NL263506A (es) * | 1960-04-12 | |||
CH494284A (fr) * | 1968-11-28 | 1970-07-31 | Sel Rex Corp | Procédé pour le dépôt électrolytique d'un alliage d'or avec au moins un autre métal commun et bain aqueux de placage pour la mise en oeuvre de ce procédé |
US4246077A (en) * | 1975-03-12 | 1981-01-20 | Technic, Inc. | Non-cyanide bright silver electroplating bath therefor, silver compounds and method of making silver compounds |
JPS54141346A (en) * | 1978-04-26 | 1979-11-02 | Matsushita Electric Ind Co Ltd | Silver-copper alloy plating method |
JPS5512111A (en) * | 1978-07-11 | 1980-01-28 | Chugoku Toryo Kk | Seaweed-feeding coating composition |
US4399006A (en) * | 1978-08-29 | 1983-08-16 | Learonal, Inc. | Silver plating |
BR8001854A (pt) * | 1979-04-04 | 1980-11-18 | Engelhard Min & Chem | Banho de revestimento de prata ou liga da mesma e respectivo processo de estabilizacao |
US4248375A (en) * | 1979-08-30 | 1981-02-03 | Honeywell Inc. | Clock thermostat apparatus having means for reducing the setback temperature when the normal temperature selection is turned down |
JPS574715A (en) * | 1980-06-12 | 1982-01-11 | Matsushita Electric Works Ltd | Extrusion type granulator for synthetic resin molding material |
JPS5782492A (en) * | 1980-11-11 | 1982-05-22 | Seiko Instr & Electronics Ltd | Copper-tin alloy plating bath |
US4412965A (en) * | 1981-09-08 | 1983-11-01 | The Goodyear Tire & Rubber Company | Method of making an air spring |
US4582576A (en) * | 1985-03-26 | 1986-04-15 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
JPH0751630B2 (ja) * | 1989-06-20 | 1995-06-05 | 住友精化株式会社 | 硬化性組成物 |
JP2676547B2 (ja) * | 1989-03-29 | 1997-11-17 | 株式会社大和化成研究所 | 中性すず又はすず―鉛合金電気めっき浴 |
-
1995
- 1995-01-07 EP EP95100167A patent/EP0666342B1/de not_active Expired - Lifetime
- 1995-01-07 ES ES95100167T patent/ES2117995T3/es not_active Expired - Lifetime
- 1995-01-25 CA CA002141090A patent/CA2141090A1/en not_active Abandoned
- 1995-01-30 US US08/380,066 patent/US5514261A/en not_active Expired - Fee Related
- 1995-01-31 JP JP7014285A patent/JPH07252684A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US5514261A (en) | 1996-05-07 |
JPH07252684A (ja) | 1995-10-03 |
CA2141090A1 (en) | 1995-08-06 |
EP0666342A1 (de) | 1995-08-09 |
EP0666342B1 (de) | 1998-05-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES2117995T3 (es) | Baño para deposito galvanico de aleaciones de plata-estaño. | |
ES2063108T3 (es) | Derivados de 3-aril-pirrolidin-2,4-diona. | |
GT199900055A (es) | Nuevas dihidropirimidinas2 heterocìclicamente sustituidas. | |
ES2054988T3 (es) | Quinuclidinas, su empleo como medicamentos y procedimiento para su produccion. | |
ATE349976T1 (de) | Mikrostruktur-stentstruktur | |
PE20030580A1 (es) | Composiciones farmaceuticas de glibenclamida y metformina, en capas separadas | |
AR248136A1 (es) | Procedimiento e intermediarios para la preparacion de 5 5 5 5 5 | |
ES2061688T3 (es) | Composiciones farmaceuticas que comprenden una calcitonina y un glicirricinato como mejorador de la absorcion. | |
PL1654470T3 (pl) | Kompozyt warstwowy, wytwarzanie i zastosowanie | |
ES2190284T3 (es) | Anodos de extraccion electroliticos que permiten producir rapidamente un revestimiento de oxido protector. | |
ES2002616A4 (es) | Electrodo de referencia de estado solido. | |
DE60202378D1 (de) | Elektrolytisches bad zum elektrochemischen abscheiden von gold und goldlegierungen | |
IT8822744A0 (it) | Lega a base di nichel con elevato contenuto di molibdeno. | |
AR209761A1 (es) | Bano acuoso exento de cianuro para el deposito galvanico de recubrimientos en plata | |
ES2107431T3 (es) | Agentes con accion selectiva sobre los receptores de la adenosina. | |
ES2028084T3 (es) | Un catodo adecuado para su uso en procesos electroquimicos que desprenden hidrogeno. | |
GB1338527A (en) | Aqueous electrolytic stripping bath | |
DE50208411D1 (de) | Endoprothese mit galvanischer silberschicht | |
IT8467849A0 (it) | Procedimento per la preparazione di migliorati lamierini di acciaio elettroplaccati con leghe di zn ni. | |
ES2035436T3 (es) | Bano acuoso alcalino para la deposicion galvanica de aleaciones de zinc y hierro. | |
ES2150420T3 (es) | Derivados de la sampangina de utilidad como agentes antifungicos. | |
SV1996000066A (es) | Acido para-hidroxifenilacetico para la reduccion de la repelencia de insecticidas ref. lea 31226-sv | |
Mahato | Basanti Devi: A Woman Activist of Manbhum's Quit India Movement | |
KR960023260A (ko) | 주석/아연 이종금속 전기도금강판 | |
Cacanoska | Protestantism in Macedonia and contemporary minority-Christian religious structuring |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
Ref document number: 666342 Country of ref document: ES |