JP7023147B2 - 断熱構造体及び縦型熱処理装置 - Google Patents

断熱構造体及び縦型熱処理装置 Download PDF

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Publication number
JP7023147B2
JP7023147B2 JP2018045873A JP2018045873A JP7023147B2 JP 7023147 B2 JP7023147 B2 JP 7023147B2 JP 2018045873 A JP2018045873 A JP 2018045873A JP 2018045873 A JP2018045873 A JP 2018045873A JP 7023147 B2 JP7023147 B2 JP 7023147B2
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Prior art keywords
processing container
shaped member
opening
inner pipe
tube
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English (en)
Japanese (ja)
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JP2019161018A5 (enExample
JP2019161018A (ja
Inventor
弘治 吉井
達也 山口
寛之 林
充弘 岡田
聡 ▲高▼木
敏彦 高橋
正文 庄司
和也 北村
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2018045873A priority Critical patent/JP7023147B2/ja
Priority to KR1020190026315A priority patent/KR102414894B1/ko
Priority to US16/297,858 priority patent/US11424143B2/en
Priority to TW108107993A priority patent/TWI748167B/zh
Priority to CN201910184953.0A priority patent/CN110277334B/zh
Publication of JP2019161018A publication Critical patent/JP2019161018A/ja
Publication of JP2019161018A5 publication Critical patent/JP2019161018A5/ja
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    • H10P72/0431—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • H10P72/04—
    • H10P72/0402—
    • H10P72/0434—
    • H10P72/0436—
    • H10P72/33—
    • H10P72/70—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical Vapour Deposition (AREA)
JP2018045873A 2018-03-13 2018-03-13 断熱構造体及び縦型熱処理装置 Active JP7023147B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018045873A JP7023147B2 (ja) 2018-03-13 2018-03-13 断熱構造体及び縦型熱処理装置
KR1020190026315A KR102414894B1 (ko) 2018-03-13 2019-03-07 단열 구조체 및 종형 열 처리 장치
US16/297,858 US11424143B2 (en) 2018-03-13 2019-03-11 Heat insulation structure at lower end of vertical heat treatment apparatus and vertical heat treatment apparatus including heat insulation structure thereof
TW108107993A TWI748167B (zh) 2018-03-13 2019-03-11 絕熱構造體及縱型熱處理裝置
CN201910184953.0A CN110277334B (zh) 2018-03-13 2019-03-12 绝热构造体和立式热处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018045873A JP7023147B2 (ja) 2018-03-13 2018-03-13 断熱構造体及び縦型熱処理装置

Publications (3)

Publication Number Publication Date
JP2019161018A JP2019161018A (ja) 2019-09-19
JP2019161018A5 JP2019161018A5 (enExample) 2020-10-08
JP7023147B2 true JP7023147B2 (ja) 2022-02-21

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Family Applications (1)

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JP2018045873A Active JP7023147B2 (ja) 2018-03-13 2018-03-13 断熱構造体及び縦型熱処理装置

Country Status (5)

Country Link
US (1) US11424143B2 (enExample)
JP (1) JP7023147B2 (enExample)
KR (1) KR102414894B1 (enExample)
CN (1) CN110277334B (enExample)
TW (1) TWI748167B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019186335A (ja) * 2018-04-06 2019-10-24 東京エレクトロン株式会社 基板処理装置と基板処理方法
JP1700778S (ja) 2021-03-15 2021-11-29 基板処理装置用遮蔽具
KR102788333B1 (ko) * 2023-05-09 2025-03-31 주식회사 유진테크 공정 튜브 및 배치식 기판처리장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002280375A (ja) 2001-03-21 2002-09-27 Hitachi Kokusai Electric Inc 基板処理装置
JP2002319546A (ja) 2001-04-23 2002-10-31 Hitachi Kokusai Electric Inc 半導体製造装置
JP2004119510A (ja) 2002-09-24 2004-04-15 Tokyo Electron Ltd 熱処理装置
JP2008172204A (ja) 2006-12-12 2008-07-24 Hitachi Kokusai Electric Inc 基板処理装置、半導体装置の製造方法、および加熱装置
JP2010283336A (ja) 2009-05-01 2010-12-16 Hitachi Kokusai Electric Inc 熱処理装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536609A (ja) * 1991-08-01 1993-02-12 Mitsubishi Electric Corp 半導体製造装置
JP3907546B2 (ja) * 2002-07-25 2007-04-18 株式会社日立国際電気 縦型熱処理装置および半導体集積回路装置の製造方法
JP4907937B2 (ja) * 2005-09-26 2012-04-04 株式会社日立国際電気 断熱壁体、発熱体の保持構造体、加熱装置および基板処理装置
WO2008099449A1 (ja) * 2007-02-09 2008-08-21 Hitachi Kokusai Electric Inc. 断熱構造体、加熱装置、加熱システム、基板処理装置および半導体装置の製造方法
JP5593472B2 (ja) 2008-08-27 2014-09-24 株式会社日立国際電気 基板処理装置および半導体デバイスの製造方法
JP5562188B2 (ja) 2010-09-16 2014-07-30 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
JP5565242B2 (ja) * 2010-09-29 2014-08-06 東京エレクトロン株式会社 縦型熱処理装置
JP5134673B2 (ja) * 2010-10-29 2013-01-30 東京エレクトロン株式会社 貼り合わせ装置及び貼り合わせ方法
JP5702657B2 (ja) * 2011-04-18 2015-04-15 東京エレクトロン株式会社 熱処理装置
CN104520975B (zh) * 2012-07-30 2018-07-31 株式会社日立国际电气 衬底处理装置及半导体器件的制造方法
JP5882167B2 (ja) * 2012-09-13 2016-03-09 東京エレクトロン株式会社 熱処理装置
CN105135883B (zh) * 2015-08-27 2018-03-23 北京矿冶研究总院 一种中频炉高温烧结用隔热工装
JP6616258B2 (ja) * 2016-07-26 2019-12-04 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、蓋部カバーおよび半導体装置の製造方法
JP6737139B2 (ja) * 2016-11-14 2020-08-05 東京エレクトロン株式会社 ガスインジェクタ、及び縦型熱処理装置
WO2021187277A1 (ja) * 2020-03-19 2021-09-23 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、断熱材アセンブリ及び半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002280375A (ja) 2001-03-21 2002-09-27 Hitachi Kokusai Electric Inc 基板処理装置
JP2002319546A (ja) 2001-04-23 2002-10-31 Hitachi Kokusai Electric Inc 半導体製造装置
JP2004119510A (ja) 2002-09-24 2004-04-15 Tokyo Electron Ltd 熱処理装置
JP2008172204A (ja) 2006-12-12 2008-07-24 Hitachi Kokusai Electric Inc 基板処理装置、半導体装置の製造方法、および加熱装置
JP2010283336A (ja) 2009-05-01 2010-12-16 Hitachi Kokusai Electric Inc 熱処理装置

Also Published As

Publication number Publication date
KR20190108052A (ko) 2019-09-23
TW201939615A (zh) 2019-10-01
KR102414894B1 (ko) 2022-07-01
US20190287828A1 (en) 2019-09-19
CN110277334A (zh) 2019-09-24
TWI748167B (zh) 2021-12-01
CN110277334B (zh) 2023-09-05
JP2019161018A (ja) 2019-09-19
US11424143B2 (en) 2022-08-23

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