KR102414894B1 - 단열 구조체 및 종형 열 처리 장치 - Google Patents

단열 구조체 및 종형 열 처리 장치 Download PDF

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KR102414894B1
KR102414894B1 KR1020190026315A KR20190026315A KR102414894B1 KR 102414894 B1 KR102414894 B1 KR 102414894B1 KR 1020190026315 A KR1020190026315 A KR 1020190026315A KR 20190026315 A KR20190026315 A KR 20190026315A KR 102414894 B1 KR102414894 B1 KR 102414894B1
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South Korea
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inner tube
insulating structure
heat insulating
shaped member
opening
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KR1020190026315A
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Korean (ko)
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KR20190108052A (ko
Inventor
고지 요시이
다츠야 야마구치
히로유키 하야시
미츠히로 오카다
사토시 다카기
도시히코 다카하시
마사후미 소지
가즈야 기타무라
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도쿄엘렉트론가부시키가이샤
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Publication of KR20190108052A publication Critical patent/KR20190108052A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H10P72/0431—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H10P72/04—
    • H10P72/0402—
    • H10P72/0434—
    • H10P72/0436—
    • H10P72/33—
    • H10P72/70—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020190026315A 2018-03-13 2019-03-07 단열 구조체 및 종형 열 처리 장치 Active KR102414894B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2018-045873 2018-03-13
JP2018045873A JP7023147B2 (ja) 2018-03-13 2018-03-13 断熱構造体及び縦型熱処理装置

Publications (2)

Publication Number Publication Date
KR20190108052A KR20190108052A (ko) 2019-09-23
KR102414894B1 true KR102414894B1 (ko) 2022-07-01

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ID=67904128

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KR1020190026315A Active KR102414894B1 (ko) 2018-03-13 2019-03-07 단열 구조체 및 종형 열 처리 장치

Country Status (5)

Country Link
US (1) US11424143B2 (enExample)
JP (1) JP7023147B2 (enExample)
KR (1) KR102414894B1 (enExample)
CN (1) CN110277334B (enExample)
TW (1) TWI748167B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019186335A (ja) * 2018-04-06 2019-10-24 東京エレクトロン株式会社 基板処理装置と基板処理方法
JP1700778S (ja) 2021-03-15 2021-11-29 基板処理装置用遮蔽具
KR102788333B1 (ko) * 2023-05-09 2025-03-31 주식회사 유진테크 공정 튜브 및 배치식 기판처리장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002319546A (ja) * 2001-04-23 2002-10-31 Hitachi Kokusai Electric Inc 半導体製造装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536609A (ja) * 1991-08-01 1993-02-12 Mitsubishi Electric Corp 半導体製造装置
JP2002280375A (ja) * 2001-03-21 2002-09-27 Hitachi Kokusai Electric Inc 基板処理装置
JP3907546B2 (ja) * 2002-07-25 2007-04-18 株式会社日立国際電気 縦型熱処理装置および半導体集積回路装置の製造方法
JP4523225B2 (ja) * 2002-09-24 2010-08-11 東京エレクトロン株式会社 熱処理装置
JP4907937B2 (ja) * 2005-09-26 2012-04-04 株式会社日立国際電気 断熱壁体、発熱体の保持構造体、加熱装置および基板処理装置
JP4971954B2 (ja) * 2006-12-12 2012-07-11 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、および加熱装置
WO2008099449A1 (ja) * 2007-02-09 2008-08-21 Hitachi Kokusai Electric Inc. 断熱構造体、加熱装置、加熱システム、基板処理装置および半導体装置の製造方法
JP5593472B2 (ja) 2008-08-27 2014-09-24 株式会社日立国際電気 基板処理装置および半導体デバイスの製造方法
JP5730496B2 (ja) * 2009-05-01 2015-06-10 株式会社日立国際電気 熱処理装置、半導体デバイスの製造方法および基板処理方法
JP5562188B2 (ja) 2010-09-16 2014-07-30 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
JP5565242B2 (ja) * 2010-09-29 2014-08-06 東京エレクトロン株式会社 縦型熱処理装置
JP5134673B2 (ja) * 2010-10-29 2013-01-30 東京エレクトロン株式会社 貼り合わせ装置及び貼り合わせ方法
JP5702657B2 (ja) * 2011-04-18 2015-04-15 東京エレクトロン株式会社 熱処理装置
CN104520975B (zh) * 2012-07-30 2018-07-31 株式会社日立国际电气 衬底处理装置及半导体器件的制造方法
JP5882167B2 (ja) * 2012-09-13 2016-03-09 東京エレクトロン株式会社 熱処理装置
CN105135883B (zh) * 2015-08-27 2018-03-23 北京矿冶研究总院 一种中频炉高温烧结用隔热工装
JP6616258B2 (ja) * 2016-07-26 2019-12-04 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、蓋部カバーおよび半導体装置の製造方法
JP6737139B2 (ja) * 2016-11-14 2020-08-05 東京エレクトロン株式会社 ガスインジェクタ、及び縦型熱処理装置
WO2021187277A1 (ja) * 2020-03-19 2021-09-23 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、断熱材アセンブリ及び半導体装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002319546A (ja) * 2001-04-23 2002-10-31 Hitachi Kokusai Electric Inc 半導体製造装置

Also Published As

Publication number Publication date
JP7023147B2 (ja) 2022-02-21
KR20190108052A (ko) 2019-09-23
TW201939615A (zh) 2019-10-01
US20190287828A1 (en) 2019-09-19
CN110277334A (zh) 2019-09-24
TWI748167B (zh) 2021-12-01
CN110277334B (zh) 2023-09-05
JP2019161018A (ja) 2019-09-19
US11424143B2 (en) 2022-08-23

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