JP7020772B2 - 統合バッファを備えたウエハ搬送アセンブリ - Google Patents
統合バッファを備えたウエハ搬送アセンブリ Download PDFInfo
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- JP7020772B2 JP7020772B2 JP2016201375A JP2016201375A JP7020772B2 JP 7020772 B2 JP7020772 B2 JP 7020772B2 JP 2016201375 A JP2016201375 A JP 2016201375A JP 2016201375 A JP2016201375 A JP 2016201375A JP 7020772 B2 JP7020772 B2 JP 7020772B2
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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Description
Claims (16)
- ウエハ搬送アセンブリであって、
第1ウエハ搬送モジュールと、
第2ウエハ搬送モジュールと、
前記第1および第2ウエハ搬送モジュールの間に接続されたバッファモジュールであって、前記第1ウエハ搬送モジュール、前記第2ウエハ搬送モジュール、および、前記バッファモジュールは、単一方向軸に整列され、前記バッファモジュールは、第1バッファスタックおよび第2バッファスタックを有し、前記第1バッファスタックは、前記単一方向軸の第1側に配置された前記バッファモジュールの第1側端に配置され、前記第2バッファスタックは、前記単一方向軸の第2側に配置された前記バッファモジュールの第2側端に配置されている、バッファモジュールと
を備え、
前記単一方向軸の前記第1側に配置された前記第1ウエハ搬送モジュールの第1側は、第1処理モジュールに接続するよう構成され、
前記単一方向軸の前記第1側に配置された前記第2ウエハ搬送モジュールの第1側は、第2処理モジュールに接続するよう構成され、
前記バッファモジュールの前記第1側端は、前記第1および第2ウエハ搬送モジュールと前記第1および第2処理モジュールとの間に入れ子状に配置された第1側面突起を規定し、
前記単一方向軸の前記第2側に配置された前記第1ウエハ搬送モジュールの第2側は、第3処理モジュールに接続するよう構成され、
前記単一方向軸の前記第2側に配置された前記第2ウエハ搬送モジュールの第2側は、第4処理モジュールに接続するよう構成され、
前記バッファモジュールの前記第2側端は、前記第1および第2ウエハ搬送モジュールと前記第3および第4処理モジュールとの間に入れ子状に配置された第2側面突起を規定し、前記第1ウエハ搬送モジュール、前記第2ウエハ搬送モジュール、および、前記バッファモジュールは、連続的な制御環境を規定するよう構成されており、
前記第1バッファスタックの上側部分が、複数の第1ウエハ格納スロットを規定し、前記第1バッファスタックの前記上側部分は、前記複数の第1ウエハ格納スロットの各々の間に規定された1または複数のセパレータを有し、
前記第1バッファスタックの下側部分が、複数の第2ウエハ格納スロットを規定し、前記第1バッファスタックの前記下側部分は、前記複数の第2ウエハ格納スロットの各々の間に規定されたセパレータを有していない
ウエハ搬送アセンブリ。 - 請求項1に記載のウエハ搬送アセンブリであって、前記ウエハ搬送アセンブリは、前記第1または第3処理モジュールの一方から、前記第1ウエハ搬送モジュール、前記第1または第2バッファスタックの一方、前記第2ウエハ搬送モジュール、前記第2または第4処理モジュールの一方まで、ウエハのための搬送路を規定するよう構成されているウエハ搬送アセンブリ。
- 請求項1に記載のウエハ搬送アセンブリであって、前記第1および第2バッファスタックの各々は、5~10のウエハを格納するよう構成されているウエハ搬送アセンブリ。
- 請求項1に記載のウエハ搬送アセンブリであって、前記制御環境は、真空制御された環境によって規定されるウエハ搬送アセンブリ。
- 請求項1に記載のウエハ搬送アセンブリであって、前記複数の第1ウエハ格納スロットと前記複数の第2ウエハ格納スロットの少なくとも1つのウエハ格納スロットは、前記ウエハ搬送アセンブリによって規定された前記制御環境内でカバーウエハを格納するよう構成されているウエハ搬送アセンブリ。
- 請求項1に記載のウエハ搬送アセンブリであって、さらに、
前記第2ウエハ搬送モジュールに接続され、前記単一方向軸に沿って整列された第2バッファモジュールを備え、
前記第2バッファモジュールは、前記単一方向軸の前記第1側に配置された前記第2バッファモジュールの第1側端に位置する第3バッファスタックと、前記単一方向軸の前記第2側に配置された前記第2バッファモジュールの第2側端に位置する第4バッファスタックとを有する
ウエハ搬送アセンブリ。 - 請求項6に記載のウエハ搬送アセンブリであって、前記第2バッファモジュールの前記第1側端は、第3側面突起を規定し、前記第2バッファモジュールの前記第2側端は、第4側面突起を規定するウエハ搬送アセンブリ。
- 請求項7に記載のウエハ搬送アセンブリであって、さらに、
前記第2バッファモジュールに接続され、前記単一方向軸に沿って整列された第3ウエハ搬送モジュールを備え、
前記単一方向軸の前記第1側に配置された前記第3ウエハ搬送モジュールの第1側は、第5処理モジュールに接続するよう構成され、前記単一方向軸の前記第2側に配置された前記第3ウエハ搬送モジュールの第2側は、第6処理モジュールに接続するよう構成されている
ウエハ搬送アセンブリ。 - 請求項8に記載のウエハ搬送アセンブリであって、
前記第3側面突起は、前記第2および第3ウエハ搬送モジュールと前記第2および第5処理モジュールとの間に入れ子状に配置され、
前記第4側面突起は、前記第2および第3ウエハ搬送モジュールと前記第4および第6処理モジュールとの間に入れ子状に配置されている
ウエハ搬送アセンブリ。 - 請求項1に記載のウエハ搬送アセンブリであって、前記ウエハ搬送アセンブリは、前記ウエハ搬送アセンブリの前端から前記ウエハ搬送アセンブリの後端まで伸びるサービストンネルの上に規定されているウエハ搬送アセンブリ。
- ウエハ搬送アセンブリであって、
ハウジングと、
前記ハウジング内に配置された第1ウエハ搬送ロボットと、
前記ハウジング内に配置された第2ウエハ搬送ロボットと、
前記ハウジング内に配置され、前記第1および第2ウエハ搬送ロボットの間に位置する第1および第2バッファスタックと
を備え、
第1インターフェースが、前記ハウジングの第1側に沿って規定され、第1処理モジュールに接続するよう構成され、
第2インターフェースが、前記ハウジングの前記第1側に沿って規定され、第2処理モジュールに接続するよう構成され、
第1側面突起が、前記ハウジングの前記第1側に沿って前記第1および第2インターフェースの間に規定され、前記第1側面突起は、前記第1バッファスタックの位置を規定し、前記第1および第2ウエハ搬送ロボットと前記第1および第2処理モジュールとの間に入れ子状に配置され、
第3インターフェースが、前記ハウジングの第2側に沿って規定され、第3処理モジュールに接続するよう構成され、
第4インターフェースが、前記ハウジングの前記第2側に沿って規定され、第4処理モジュールに接続するよう構成され、
第2側面突起が、前記ハウジングの前記第2側に沿って前記第3および第4インターフェースの間に規定され、前記第2側面突起は、前記第2バッファスタックの位置を規定し、前記第1および第2ウエハ搬送ロボットと前記第3および第4処理モジュールとの間に入れ子状に配置され、
前記ウエハ搬送アセンブリは、連続的な制御環境を規定しており、
前記第1バッファスタックの上側部分が、複数の第1ウエハ格納スロットを規定し、前記第1バッファスタックの前記上側部分は、前記複数の第1ウエハ格納スロットの各々の間に規定された1または複数のセパレータを有し、
前記第1バッファスタックの下側部分が、複数の第2ウエハ格納スロットを規定し、前記第1バッファスタックの前記下側部分は、前記複数の第2ウエハ格納スロットの各々の間に規定されたセパレータを有していない
ウエハ搬送アセンブリ。 - 請求項11に記載のウエハ搬送アセンブリであって、前記ウエハ搬送アセンブリは、前記第1または第3処理モジュールの一方から、前記第1ウエハ搬送ロボット、前記第1または第2バッファスタックの一方、前記第2ウエハ搬送ロボット、前記第2または第4処理モジュールの一方まで、ウエハのための搬送路を規定するよう構成されているウエハ搬送アセンブリ。
- 請求項11に記載のウエハ搬送アセンブリであって、さらに、
真空源に接続するためのコネクタを備え、
前記連続的な制御環境は、真空制御された環境によって規定される
ウエハ搬送アセンブリ。 - 請求項11に記載のウエハ搬送アセンブリであって、前記第1バッファスタックの前記下側部分は、1または複数のカバーウエハまたはシーズニングウエハを格納するよう構成されているウエハ搬送アセンブリ。
- 請求項11に記載のウエハ搬送アセンブリであって、前記第1および第2バッファスタックの各々は、5~10のウエハを格納するよう構成されているウエハ搬送アセンブリ。
- 請求項11に記載のウエハ搬送アセンブリであって、前記ウエハ搬送アセンブリは、前記ウエハ搬送アセンブリの前端から前記ウエハ搬送アセンブリの後端まで伸びるサービストンネルの上に規定されているウエハ搬送アセンブリ。
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