JP5350692B2 - 基板処理装置及びそれに用いられる支持フレーム - Google Patents
基板処理装置及びそれに用いられる支持フレーム Download PDFInfo
- Publication number
- JP5350692B2 JP5350692B2 JP2008174128A JP2008174128A JP5350692B2 JP 5350692 B2 JP5350692 B2 JP 5350692B2 JP 2008174128 A JP2008174128 A JP 2008174128A JP 2008174128 A JP2008174128 A JP 2008174128A JP 5350692 B2 JP5350692 B2 JP 5350692B2
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- JP
- Japan
- Prior art keywords
- scaffold
- door
- support frame
- processing chamber
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/16—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
- F24F3/167—Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Semiconductors (AREA)
Description
また,支持フレームに足場を直接設けることにより,メンテナンス作業を行い易い位置に足場を形成することができる。
まず,本発明を複数の処理室を備えるマルチチャンバ型の基板処理装置に適用した場合の実施形態について図面を参照しながら説明する。図1は,本実施形態にかかる基板処理装置の外観構成の概略を示す斜視図である。図2は図1に示す基板処理装置の平面図(図1矢視A)であり,図3は正面図(図1矢視B)である。図1〜図3に示す基板処理装置100は,被処理基板としてのフラットパネルディスプレイ用基板(FPD用基板)に対してプラズマ処理を施すための3つの処理室110(110A〜110C)を備える。
ここで本実施形態にかかる足場160の具体的な構成例について図面を参照しながら詳細に説明する。図4は,基板処理装置の支持フレームを説明するための斜視図である。なお,図4に示すように,処理室110,搬送室120,およびロードロック室130は,支持フレーム140の上側に載置される。
次に,本発明の第2実施形態について図面を参照しながら詳細に説明する。図7は,第2実施形態にかかる基板処理装置の構成例の概略を示す平面図である。図7に示すように,この基板処理装置200は,第1実施形態にかかる基板処理装置100と同様に,搬送室120の周りに複数の処理室110とロードロック室130を設けて構成される。
102(102A〜102C) ゲートバルブ
104,106 ゲートバルブ
110(110A〜110C) 処理室
112(112A〜112C) 基体部
113(113A〜113C) スライド機構
114(114A〜114C) 蓋体部
120 搬送室
130 ロードロック室
140 支持フレーム
142 梁部材
144 柱部材
160 足場
162 支持ブラケット
164 足場板
166 柵
170 ベース板
172 締結部材
200 基板処理装置
202(202A〜202C) レール
210(210A1,210A2,210B1,210B2,210C1) 扉
212 扉本体
214 支柱部
216 ヒンジ部
218 センサ
220 二重扉
222 外扉
224 内扉
260,262 足場
290 制御部
S 隙間
Claims (8)
- 被処理基板に対して所定の処理を施す処理室を備えた基板処理装置を支持するために床面上に配置される支持フレームであって,
前記床面から所定の高さの部位に前記処理室の周囲から外側に張り出すように足場を直接設け,
前記足場は,前記支持フレームの外側に取り付けられた複数の支持ブラケットと,前記支持ブラケットに水平に支持された足場板と,を備え,
前記処理室は,基体部と,この基体部に着脱自在の蓋体部とから構成されており,さらに前記基体部から離脱した前記蓋体部を前記基体部の側方の待避部位までスライド可能なレールを備え,前記レールの周囲にも足場を設け,前記処理室の周囲の足場との間を往来できるようにしたことを特徴とする支持フレーム。 - 前記各支持ブラケットは,形鋼によって形成されたことを特徴とする請求項1に記載の支持フレーム。
- 前記各支持ブラケットは,前記支持フレームに対して着脱自在であることを特徴とする請求項1又は2に記載の支持フレーム。
- 前記処理室の周囲の足場と前記レールの周囲の足場との間に,これらの足場間の往来を妨げる扉を設けたことを特徴とする請求項1に記載の支持フレーム。
- 前記扉の開閉状態を検出するセンサと,
前記センサの検出結果に応じて前記蓋体部の着脱動作を制御する制御部と,を備え,
前記制御部は,前記センサが前記扉の開状態を検出している間は前記蓋体部の着脱動作ができないように規制することを特徴とする請求項4に記載の支持フレーム。 - 前記扉にロック機構を設け,
前記制御部は,前記蓋体部が閉状態を検出している間及び前記蓋体部の着脱動作が行われている間は,前記扉が開かないようにロックすることを特徴とする請求項4又は5に記載の支持フレーム。 - 前記扉は,外扉と,この外扉に対して回動自在な内扉とからなる二重扉で構成され,
前記外扉は,前記足場の幅よりも狭い幅で構成して,前記足場の外側寄りに設けた支柱部に枢支し,
前記内扉は,前記外扉の戸先側に枢支したことを特徴とする請求項4〜6のいずれかに記載の支持フレーム。 - 被処理基板に対して所定の処理を施す処理室と,床面上に配置されて前記処理室を支持する支持フレームと,を備えた基板処理装置であって,
前記床面から所定の高さの部位に,前記処理室の周囲から外側に張り出すように前記支持フレームの外側に直接取り付けられた複数の支持ブラケットと,
前記支持ブラケットに水平に支持された足場板と,を備え,
前記足場は,前記支持フレームの外側に取り付けられた複数の支持ブラケットと,前記支持ブラケットに水平に支持された足場板と,を備え,
前記処理室は,基体部と,この基体部に着脱自在の蓋体部とから構成されており,さらに前記基体部から離脱した前記蓋体部を前記基体部の側方の待避部位までスライド可能なレールを備え,前記レールの周囲にも足場を設け,前記処理室の周囲の足場との間を往来できるようにしたことを特徴とする基板処理装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008174128A JP5350692B2 (ja) | 2008-07-03 | 2008-07-03 | 基板処理装置及びそれに用いられる支持フレーム |
TW098122421A TWI513882B (zh) | 2008-07-03 | 2009-07-02 | A substrate processing device and a support box used therefor |
KR1020090060369A KR20100004880A (ko) | 2008-07-03 | 2009-07-02 | 기판 처리 장치 및 그것에 이용되는 지지 프레임 |
CN2009101587089A CN101621023B (zh) | 2008-07-03 | 2009-07-03 | 基板处理装置和其使用的支承架 |
KR1020120025565A KR101278800B1 (ko) | 2008-07-03 | 2012-03-13 | 기판 처리 장치 및 그것에 이용되는 지지 프레임 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008174128A JP5350692B2 (ja) | 2008-07-03 | 2008-07-03 | 基板処理装置及びそれに用いられる支持フレーム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010016144A JP2010016144A (ja) | 2010-01-21 |
JP5350692B2 true JP5350692B2 (ja) | 2013-11-27 |
Family
ID=41514179
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008174128A Expired - Fee Related JP5350692B2 (ja) | 2008-07-03 | 2008-07-03 | 基板処理装置及びそれに用いられる支持フレーム |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5350692B2 (ja) |
KR (2) | KR20100004880A (ja) |
CN (1) | CN101621023B (ja) |
TW (1) | TWI513882B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6217611B2 (ja) * | 2014-12-02 | 2017-10-25 | 株式会社ダイフク | 物品保管設備 |
US10014196B2 (en) * | 2015-10-20 | 2018-07-03 | Lam Research Corporation | Wafer transport assembly with integrated buffers |
KR102497795B1 (ko) * | 2016-07-04 | 2023-02-09 | 세메스 주식회사 | 기판 처리 장치 |
CN110556317B (zh) * | 2019-08-13 | 2022-11-11 | 世源科技工程有限公司 | 一种半导体加工系统 |
JP7177130B2 (ja) * | 2020-11-30 | 2022-11-22 | キヤノントッキ株式会社 | 成膜装置及び足場ユニット |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100267617B1 (ko) * | 1993-04-23 | 2000-10-16 | 히가시 데쓰로 | 진공처리장치 및 진공처리방법 |
JP2001023872A (ja) * | 1999-07-09 | 2001-01-26 | Hitachi Ltd | 半導体基板処理装置 |
JP2002147811A (ja) * | 2000-11-08 | 2002-05-22 | Sharp Corp | クリーンルーム |
TWI276157B (en) * | 2005-01-31 | 2007-03-11 | Dainippon Screen Mfg | Substrate processing apparatus |
JP4108092B2 (ja) * | 2005-10-19 | 2008-06-25 | 株式會社 村上工務店 | 作業足場支持装置および作業足場設置方法 |
KR20070043214A (ko) * | 2005-10-20 | 2007-04-25 | 삼성전자주식회사 | 반도체 설비 관리 기구 |
TWM306250U (en) * | 2006-07-19 | 2007-02-11 | Cheng Lee Steel Sheet Co Ltd | Structure of supporting rack frame capable of having safety net hooked onto |
JP4800149B2 (ja) * | 2006-08-17 | 2011-10-26 | 東京エレクトロン株式会社 | 半導体製造装置 |
-
2008
- 2008-07-03 JP JP2008174128A patent/JP5350692B2/ja not_active Expired - Fee Related
-
2009
- 2009-07-02 KR KR1020090060369A patent/KR20100004880A/ko active Application Filing
- 2009-07-02 TW TW098122421A patent/TWI513882B/zh active
- 2009-07-03 CN CN2009101587089A patent/CN101621023B/zh active Active
-
2012
- 2012-03-13 KR KR1020120025565A patent/KR101278800B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20120044950A (ko) | 2012-05-08 |
JP2010016144A (ja) | 2010-01-21 |
CN101621023B (zh) | 2013-03-06 |
TWI513882B (zh) | 2015-12-21 |
TW201016933A (en) | 2010-05-01 |
CN101621023A (zh) | 2010-01-06 |
KR101278800B1 (ko) | 2013-06-25 |
KR20100004880A (ko) | 2010-01-13 |
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