TWI276157B - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

Info

Publication number
TWI276157B
TWI276157B TW094137538A TW94137538A TWI276157B TW I276157 B TWI276157 B TW I276157B TW 094137538 A TW094137538 A TW 094137538A TW 94137538 A TW94137538 A TW 94137538A TW I276157 B TWI276157 B TW I276157B
Authority
TW
Taiwan
Prior art keywords
processing
processing apparatus
substrate
maintenance
upper cover
Prior art date
Application number
TW094137538A
Other languages
Chinese (zh)
Other versions
TW200639923A (en
Inventor
Shingo Nakane
Masayuki Handa
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005023565A external-priority patent/JP2006210808A/en
Priority claimed from JP2005022859A external-priority patent/JP4515275B2/en
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200639923A publication Critical patent/TW200639923A/en
Application granted granted Critical
Publication of TWI276157B publication Critical patent/TWI276157B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention provides a substrate processing apparatus which can support the component of processing chamber firmly by a concise structure at maintenance position. The processing chamber 13 of the substrate processing apparatus 1 is composed of a main body 131 and an upper cover 132 for treating the substrate W. The processing equipment frame 11 supports each component in the inner processing position of the specified processing equipment frame 11. While maintaining, each component in the inner maintenance position of the specified maintenance frame 21 is supported by the maintenance frame 21. Each main body 131 and upper cover 132 in the processing chamber 13 can move independently between the processing position and the maintenance position. The maintenance frame 21 and the processing equipment frame 22 are independent and form the support structure to support the main body 131 and the upper cover 132 from outside of the processing apparatus frame 11.

Description

!276157 ^ 九、#明說明: ‘ 【發明所屬之技術領域】 本發明係關於具有對基板進行特定處理之處理室之基板 處理裝置。 【先前技術】 由先前,已有具有對基板進行特定處理之處理室之基板 處理裝置被使用。於該基板處理裝置,為了減少機體所佔 _ 面積,將複數處理室於垂直方向進行層疊。例如,於專利 文獻1揭示,將複數處理室於垂直方向層疊,並且為使維 修容易,可將處理室拉出至框體外部之維修時位置之多層 式基板處理裝置。於專利文獻1之基板處理裝置,拉出至 維修時位置之處理室,係藉由從框體向略水平方向延伸之 構件單邊支持。 於如此之基板處理裝置,對基板進行處理時將處理室密 閉’並且進行維修時為可進入處理室内部,使用於處理室 I 上面設置以鉸鏈為軸可開閉之蓋者。於設置如此之蓋之基 板處理室,將處理室全體向框體外部拉出後將該蓋向上方 舉起使内部呈開放狀態,之後進行處理室内部之維修。 [專利文獻]特開2000-12448 另一方面,基板處理裝置作為處理對象之基板有大型化 之傾向,近年,出現處理室重量超過1〇〇〇 kg之情形,蓋 的重量也有超過1〇0 kg之情形。因此,於專利文獻i之其 板處理裝置,以單邊支持向維修時位置拉出之處理室之構 件及開閉蓋之構件迫切需要提高強度,起因於該構件之大 105795.doc 1276157 型化或重量增加而使基板處理裝置全體之大型化或重量增 加成問題。 【發明内容】 本發明係為解決該等問題而完成者,其目的在於提供一 種可將構成處理室之構件以簡潔的構造確實地支持之基板 處理裝置。!276157 ^ 九,#明说明: ‘Technical Field to Which the Invention Is Along The present invention relates to a substrate processing apparatus having a processing chamber for performing specific processing on a substrate. [Prior Art] Conventionally, a substrate processing apparatus having a processing chamber for performing specific processing on a substrate has been used. In the substrate processing apparatus, in order to reduce the area occupied by the body, the plurality of processing chambers are stacked in the vertical direction. For example, Patent Document 1 discloses a multilayer substrate processing apparatus in which a plurality of processing chambers are stacked in a vertical direction and a processing chamber can be pulled out to a maintenance position outside the housing for ease of maintenance. In the substrate processing apparatus of Patent Document 1, the processing chamber pulled out to the position at the time of maintenance is supported by one side of the member extending from the frame to the horizontal direction. In such a substrate processing apparatus, when the substrate is processed, the processing chamber is sealed', and when the maintenance is performed, it is possible to enter the processing chamber, and the processing chamber I is provided with a cover that can be opened and closed with the hinge as the axis. In the substrate processing chamber provided with such a cover, the entire processing chamber is pulled out to the outside of the casing, and the lid is lifted upward to open the inside, and then the inside of the processing chamber is repaired. [Patent Document] JP-A-2000-12448 On the other hand, the substrate processing apparatus tends to increase the size of the substrate to be processed. In recent years, when the weight of the processing chamber exceeds 1 〇〇〇kg, the weight of the cover exceeds 1 〇0. The case of kg. Therefore, in the plate processing apparatus of Patent Document i, the members of the processing chamber that are unilaterally supported to be pulled out to the maintenance position and the members of the opening and closing cover are inevitably required to be increased in strength, which is caused by the large size of the member or The increase in weight causes a problem of an increase in size or weight of the entire substrate processing apparatus. SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a substrate processing apparatus capable of reliably supporting a member constituting a processing chamber with a simple structure.

為解決上述課題,請求項1之發明係一種基板處理裝 置,其具有對基板進行特定處理之處理室,且具備:第i 支持構ie,其係於在上述處理室對基板進行處理時之位置 之處理時位置’支持構成上述處理室之特定構件;第2支 寺構ie其係於與上述處理時位置相異之退避時位置,與 上述第1支持構造獨立而於上述第丨支持構造之外部支持上 述特疋構件,及移動機構,其係使上述特定構件於上述處 理時位置與上述退避時位置之間移動。 :求項2之發明係於請求項i之基板處理裝置中,上述處 理室可分離為複數構件,上述移動機構係將該複數構件之 中至少-個構件作為上述特定構件,使之於上述處理時位 置與退避時位置之間移動。 明,項3之發明係於請求項〗之基板處理裝置中,上述美In order to solve the above problems, the invention of claim 1 is a substrate processing apparatus including a processing chamber for performing a specific processing on a substrate, and an i-th support structure which is disposed at a position where the processing chamber processes the substrate The processing position 'supports a specific member constituting the processing chamber; the second branch structure is at a retracted position different from the processing position, and is independent of the first supporting structure and is in the second supporting structure The feature member and the moving mechanism are externally supported to move the specific member between the processing position and the retracted position. The invention of claim 2 is the substrate processing apparatus of claim 1, wherein the processing chamber is separable into a plurality of members, and the moving mechanism is configured to perform at least one of the plurality of members as the specific member. Move between the time position and the back-off position. The invention of Item 3 is in the substrate processing apparatus of the claim item, the above beauty

Li:裝置具有複數上述處理室,上述第1支持構造及第2 夂籌造分別將構成複數上述處理室各個之上述特定構件 2特定構件所規定之上述處理時位置及上述退避時 支持’上述移動機構錢上㈣^構 構件所規定之上述處料位置及上料避時位置之= 105795.doc 1276157 動。 、、員4之么明係於請求項丨之基板處理裝置中,上述移 動機構於上述處理時位置與上述退避時位置之間,使上述 特定構件水平移動。 —請,項5之發明係—種基板處理裝置,其具有對基板進 疋處理之處理室’且具備:第1支持構造,其係支持 、上述處理室之可分離之複數構件者;及移動機構,盆 2將該複數構件之中至少一個特定構件移動至上述第以 持構造之外部者。 請求項6之發明係於請求項5之基板處理裝置中,進—牛 Π;/2支持構造,其係與上述第1支持構造獨立而於^ 係於由H造之外部支持上述特定構件,上述移動機構 第2支持構造進行弟1支持位置與由上述 構件。 f之第2支持位置之間多動上述特定 請求項7之發明係於請求項5之基板處理襄置中,上述美 板處理裝置具有複數上述處理室,上#篦 土 ^成複數上述處理室各個之上述特定構件,上述移動機構 ㈣成㈣上述處理室各個之上述特定構件向上述第 持構造之外部移動。 支 請求項8之發明係於請求項6 動機構於上述p支持… 敬置中’上述移 述特定構件水平移動。 吏上 根據晴求項1至請求項4夕疏nn J員4之兔明,於退避時位置,由於藉 105795.doc 176157 由與第以持構造獨立之第2支 以簡潔的構造確實地支持該料構件 構件’故可 根據請求項2 > | nn 避時位置’故處理室之維需要退避之構件退避至退 情形,亦2:,之處理裝置具有複數處理室之 之特定構件。構造確實地支持構成複數處理室各個Li: the apparatus has a plurality of processing chambers, and the first support structure and the second stacking unit respectively support the processing position and the retreat support "the movement" defined by the specific member of the specific member 2 that constitutes each of the processing chambers The position of the above-mentioned material and the position of the material to be evaded as stipulated by the structure of the body (4) ^ components are = 105795.doc 1276157. Further, in the substrate processing apparatus of the request item, the moving mechanism moves the specific member horizontally between the processing position and the retracted position. The invention of claim 5, wherein the substrate processing apparatus includes a processing chamber for processing a substrate, and includes: a first support structure supporting the plurality of separable members of the processing chamber; and moving The mechanism 2 moves the at least one specific member of the plurality of members to the outside of the first holding structure. The invention of claim 6 is directed to the substrate processing apparatus of claim 5, wherein the support structure is independent of the first support structure and supports the specific member outside the H-made structure. The second support structure of the moving mechanism performs the support position of the brother 1 and the member. The invention of the specific request item 7 in the second support position of f is in the substrate processing apparatus of claim 5, wherein the above-mentioned sheet processing apparatus has a plurality of processing chambers, and the upper chamber is formed into a plurality of processing chambers. In each of the specific members, the moving mechanism (4) is (4) the specific member of each of the processing chambers moves outside the first holding structure. The invention of claim 8 is directed to the request item 6 in the above-mentioned p support... In the above, the specific component is horizontally moved.吏 根据 根据 根据 根据 根据 根据 根据 至 nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn nn The material member member can be retracted to the retracted condition according to the request item 2 > | nn avoiding the position, so that the processing device has a specific member of the plurality of processing chambers. The structure does support each of the complex processing rooms

根據請求項5至枝屯^ ^ 付疋稱件。 複數構件之Φ 明,由於可將構成處理室之 =的槿定構件向第1支持構件之外部移動,故 間4的構造確實地支持該特定構件。 ==6之發明,於第2支持位置,由於藉〗 支持構把獨立之第2支持構造支持特 的構造確實地支持該特^構件。 可以簡潔According to the request item 5 to the branch ^ ^ pay the nickname. The Φ of the plurality of members is such that the damming member constituting the processing chamber can be moved outside the first supporting member, so that the structure of the intermediate member 4 surely supports the specific member. The invention of ==6, in the second support position, the support structure is supported by the support structure of the second support structure. Can be simple

根據請求項7之發明’基板處理裝置具有複數處理室之 月形’亦可以簡潔的構造確實地支持特^構件。 根據請求項8之發明,可以小的力移動特定構件。 【實施方式】 >關於本發明之實施形態之基板處理裝置!,係對基板進 仃加熱處理(或冷卻處理)。惟,此僅為例示,基板處理裝 置1對基板進行熱處理以外之處理時亦為本發明之適用範 圍。又,基板處理裝置!作為處理對象之基板,並無特別 限制,例如,半導體晶圓、液晶顯示裝置用玻璃基板、 PDP(電漿顯*器面板)用玻璃基板、光碟用玻璃基板、磁 105795.doc 1276157 碟用玻璃基板及磁碟用陶瓷基板等。以下,參照圖卜圖u 說明該基板處理裝置1之構造。 {1全體構造} 圖1係表示關於本發明之實施形態之基板處理裝置丨之概 略全體構造之立體圖。於圖i,定義以設置基板處理裝置 之也板面FL為XY平面之χγζ直角座標系,向地板面几上 之搬运路901延伸的方向為χ軸方向。搬送路卯丨係,搬送According to the invention of claim 7, the substrate processing apparatus has a moon shape of a plurality of processing chambers, and the structure can be surely supported by a simple structure. According to the invention of claim 8, the specific member can be moved with a small force. [Embodiment] > A substrate processing apparatus according to an embodiment of the present invention! The substrate is heated (or cooled). However, this is merely an example, and the substrate processing apparatus 1 is also applicable to the substrate in addition to the heat treatment of the substrate. Also, the substrate processing device! The substrate to be processed is not particularly limited, and examples thereof include a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a PDP (plasma display panel), a glass substrate for a optical disk, and a glass for magnetic disk 105795.doc 1276157 A ceramic substrate for a substrate or a magnetic disk. Hereinafter, the structure of the substrate processing apparatus 1 will be described with reference to FIG. Fig. 1 is a perspective view showing a schematic overall configuration of a substrate processing apparatus according to an embodiment of the present invention. In Fig. i, a χγζ rectangular coordinate system in which the plate surface FL of the substrate processing apparatus is also set to the XY plane is defined, and the direction in which the conveyance path 901 on the floor surface extends is the z-axis direction. Transporting roads, transporting

基板處理裝置1作為處理對象之基板w之搬送機器人之移 動路徑,基板處理裴置1,係對搬送機器人由上游側工序 搬送來之基板W進行特定處理。 士圖1所不’基板處理裝置1,於處理裝置框架11之内部 於垂直方向層疊收容複數處理室13之多層式裝置。再者, 於請示具有3個處理室13之基板處理裝’惟處理室 :3:數$亦可為2個以下或4個以上。處理裝置框㈣,係 之管或角鐵等棒狀構件結合形成之略長方體形 狀之框體,作為於内 σ支持處理至13之支持構造之作用。 於處理裝置框架11之晋狄„ 柘狀播技 。,备W需要安裝有外裝或棚板之 板狀構件。各個處理室13, 八Μ & & /、有有盍之略長方體形狀,可 刀離成為下側構件之 之上苗η 圣形狀之本體131及成為上側構件 於基板處理裝置1,鄰 框¥21。^接處理旋置框架11併設有維修用 杧木21。維修用框架21, 成為骨路之管或角鐵等棒狀構=置框架11同樣地’將 形狀。維修用框竿21… &形成’具有略長方體 木21,可僅於維修時設置,亦可常時設 105795.doc 10· 1276157 置 &日守5又置維修用框架21時,亦可將處理框架丨丨與維修 用框架2 1結合成一個框架作為一體物構成。 構成各個處理室13之各個本體131及上蓋132,對基板w 進行處理時,於各構件規定之處理裝置框架u内部之處理 時位置以處理裝置框架11支持,惟進行維修(保養)時,於 各構件規定之維修用框架21之内部維修時位置,以維修用The substrate processing apparatus 1 serves as a moving path of the transport robot of the substrate w to be processed, and the substrate processing apparatus 1 performs specific processing on the substrate W transported by the transport robot by the upstream side process. In the substrate processing apparatus 1, the multi-layer apparatus for accommodating the plurality of processing chambers 13 is vertically stacked inside the processing apparatus frame 11. Further, the substrate processing apparatus having the three processing chambers 13 is required to have a processing chamber: 3: the number $ may be two or less or four or more. The processing device frame (4) is a frame having a substantially rectangular parallelepiped shape formed by a rod-like member such as a tube or an angle iron, and functions as a support structure for the internal σ support treatment to 13. In the processing device frame 11, the Jindi 柘 播 播 。 , , , 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 需要 。 。 。 。 。 。 。 。 。 The knife can be separated from the upper member of the lower member, the upper body 131, and the upper member, in the substrate processing apparatus 1, and the adjacent frame is 21. The processing is placed on the rotary frame 11 and the maintenance beech 21 is provided. The frame 21 is a rod-shaped structure such as a bone path tube or an angle iron. The frame 11 is similarly shaped. The maintenance frame 21... is formed to have a slightly rectangular wooden body 21, which can be set only during maintenance. When the maintenance frame 21 is placed in the same time, the processing frame 丨丨 and the maintenance frame 21 may be combined into one frame as a single body. The respective processing chambers 13 are configured. When the substrate w is processed, the main body 131 and the upper cover 132 are supported by the processing device frame 11 at the processing position inside the processing device frame u defined by each member, but the maintenance is performed for each member when performing maintenance (maintenance). Internal maintenance of frame 21 Position to repair a

框架21支持。各個本體131及蓋132,可於處理時位置與維 修時位置之間獨立地移動。 處理扃置框架11及維修用框架21,係設於設置基板處理 裝置之地板面FL之相異區域上,維修用框架21,獨立於處 理裝置框架11於處理裝置框架丨丨之外部支持本體i3i及蓋 132之支持構造❶藉此,處理裝置框架丨丨與維修用框架η 並不互相依存於對方可支持本體131及蓋132,本體131及 上盍132於維修時位置以維修用框架21支持時,維修用框 架不會對處理裝置框架u有大的作用(負荷)。因此,於 基板處理裝置1 ’即使將本體131及蓋132移動至處理裝置 框架11外部之維修時位置時,由於藉由獨立於處理農置框 架U之維修用框架21支持本體⑶及蓋132,與先前之單邊 支持之情形不同,不會對處理裝置框架11施加大的負荷。 因此,於基板處理裝置丨,於維修時位置,可確實地支持 本體m及蓋132 ’並且無須如單邊支持之構件之複雜構 造’可以簡潔的構造支持本體131及上蓋132。此外,如後 述,於基板處理裝置卜由於可將本體131及上蓋132於處 理裝置框架11内部分離’之後將需要的構件由處理裝置框 105795.doc 1276157 架π拉出,故無須於處理室13設置開啟上蓋132之複雜的 構件’於此點’亦可以簡潔的構造確實地支持本體13丨及 上蓋132 〇 再者’於先前之技術,為防止起因於單邊支持之彎曲或 下垂’本體13 1及上蓋132需要相當的剛性,於基板處理裝 置1 ’藉由使用支持各個本體13丨及上蓋丨32全體之維修用 框架21,可降低本體13丨及上蓋132所需剛性。因此,於基 板處理裝置1,可將本體13丨及上蓋132輕量化,向維修時 位置之拉出所需之力也小。此係,反過來說,於基板處理 裝置’可避免增加本體131及上蓋132重量,即,可避免增 加基板處理裝置1之重量,而可使處理對象之基板w之尺 寸大型化。 又’基板處理裝置1,由於即使將本體Π1及上蓋132之 中的複數由處理裝置框架11内部向維修用框架2丨内部移動 也不會有傾倒之虞,因此無需設置防止複數構件被拉出之 機構,可使構造簡潔。 以下’說明由處理位置向維修位置拉出本體13丨及上蓋 132 ° {2處理室及其週邊構造) 圖2〜圖7係放大表示基板處理裝置1之一個處理室13及其 週邊之構造之圖。於此,圖2〜5,係表示相當於從彳方向 所視正面圖’圖2係表示各個本體ι31及上蓋132於各個處 理時位置PT及PT’之狀態,圖3係表示本體13 1於維修時位 置PM而上蓋132於處理時位置]?丁,之上方位置(以下,亦稱 105795.doc -12- 1276157 為「開放時位置」)P0,之狀態,圖4係表示本體131於處理 時位置PT而上蓋132於維修時位置PM,之狀態,圖5係表示 本體13 1於處理時位置ρτ而上蓋132於開放時位置p〇,之狀 悲。又’圖6及圖7係表示相當於從+χ方向所視側面圖,圖 6係表示各個本體131及上蓋132於處理時位置ρτ&ρτ,之狀 態’圖7係表示本體131於處理時位置ρτ而上蓋132於開放 時位置Ρ0’之狀態。 如圖2〜圖7所示,於本體131之底面131L,設置有對基板 W進行加熱處理之加熱板(或對基板w進行冷卻處理之冷卻 板)15之外,於處理室13内部亦設置有用於升降基板w之無 圖示之升降梢或該升降梢之驅動部等(以下,將該等總稱 為「附隨物」)。於本實施形態,該附隨物與本體13丨一起 移動。 又,於基板處理裝置i,設有··本體移動機構16,其係 使本體13 1於處理時位置ρτ與維修時位置pM之間移動者; 上蓋移動機構17,其係使上蓋132於處理時位置pT,與維修 日守位置ΡΜ之間移動者。於基板處理裝置丨,本體移動機構 16及上蓋移動機構Π,使本體131及上蓋132之中至少一個 構件(一邊或雙方)於處理時位置ρτ(ρτ,)與維修時位置 ΡΜ(ΡΜ’)之間移動,可只將需要退避之構件退避至維修時 位置 ΡΜ(ΡΜ,)。 以下’依序說明本體移動機構16及上蓋移動機構17。 〇本體搬送機構; 如圖2〜圖7所示,本體移動機構16,具備:執道162a, 105795.doc 13 1276157 其係鋪設於凸出在處理裝置框架u之内面之架台i6ia;執 道162b,其係鋪設於凸出在維修用框架^之内面之架台 161b,可動區塊163,其係固定於本體131之底面131L之一 邊的端部;及車輪164,其係安裝於本體131之底面1311^之 另一端部。執道162a、執道162b及可動區塊163構成,線 性引導(直線運動引導機構),藉由使可動區塊163於執道 162a、執道162b上,將本體131之移動方向限制於軌道 162a、執道162b之長邊方向。車輪164,可將γ軸方向為軸 旋轉,藉由於架台161a、l61b上旋轉移動,減少移動本體 131所需之力。 於基板處理裝置1,使本體131之處理時位置?7與維修時 位置PM之高度呈一致地構成處理裝置框架u及維修用框 架21。因此,可動區塊163所滑動之執道162&、軌道16孔 以長邊方向為士X方向水平鋪設,並且,成為車輪i64之通 行處之架台l61a、161b之上面亦呈水平面(χγ平面卜又, 於處理裴置框架11與維修用框架21之境界附近之架台 16!a、161b及軌道162a、軌道162b之間隙,充分小至不會 妨礙本體131之滑行,而架台161a、161b及軌道162&、軌 道162b提供連續地連接處理時位置ρτ與維修時位置之 移動路徑。因此,於基板處理裝置!,使用本體移動機構 16之本體ι31之移動成水平移動,而可以小的力將本體i3i 於處理時位置PT與維修時位置PM之間平滑地移動。 再者,於上述例,說明了本體131之一邊的端部經由線 ^生引導支持,而本體131之另一端部經由車輪支持之本體 105795.doc -14- 1276157 移動機構16,但並不妨礙將雙方的端部經由車輪支持,或 將雙方的端部經由線性引導支持。惟,於如上述之線性引 導與車輪之組合’相較於只用車輪之情形,有容易將本體 轴方向之位置維持一定,可將基板…正確的導入處理 室13之内部之優點。又,只用線性引導之情形,需要高精 又也平行鋪5又之成對軌道,而如上述藉由組合線性引導與 車輪,有在鋪設軌道162&、執道162b時所要求的尺寸精度Frame 21 support. Each of the body 131 and the cover 132 is independently movable between a position at the time of processing and a position at the time of maintenance. The processing frame 11 and the maintenance frame 21 are disposed on different areas of the floor surface FL on which the substrate processing apparatus is disposed, and the maintenance frame 21 supports the main body i3i independently of the processing device frame 11 in the processing device frame And the support structure of the cover 132, whereby the processing device frame 丨丨 and the maintenance frame η do not depend on each other on the support body 131 and the cover 132, and the body 131 and the upper cover 132 are supported by the maintenance frame 21 at the time of maintenance. At this time, the maintenance frame does not have a large effect (load) on the processing device frame u. Therefore, when the substrate processing apparatus 1' moves the main body 131 and the cover 132 to the maintenance position outside the processing apparatus frame 11, since the main body (3) and the cover 132 are supported by the maintenance frame 21 independent of the processing of the agricultural frame U, Unlike the case of the previous one-sided support, no large load is applied to the processing device frame 11. Therefore, in the substrate processing apparatus, the body m and the cover 132' can be surely supported at the time of maintenance, and the complicated structure of the member such as the unilateral support is not required. The support body 131 and the upper cover 132 can be constructed in a compact manner. Further, as will be described later, since the substrate processing apparatus can separate the main body 131 and the upper cover 132 from the inside of the processing apparatus frame 11, the required components are pulled out by the processing apparatus frame 105795.doc 1276157, so that it is not necessary for the processing chamber 13 The complicated member that is provided to open the upper cover 132 can also support the body 13 丨 and the upper cover 132 in a compact configuration. Furthermore, in the prior art, in order to prevent bending or sagging caused by the unilateral support, the body 13 1 and the upper cover 132 require considerable rigidity, and the substrate processing apparatus 1' can reduce the rigidity required for the main body 13 and the upper cover 132 by using the maintenance frame 21 that supports the entire body 13 and the upper cover 32. Therefore, in the substrate processing apparatus 1, the main body 13A and the upper cover 132 can be made lighter, and the force required to pull out the position at the time of maintenance is also small. In this case, in the substrate processing apparatus, it is possible to avoid increasing the weight of the main body 131 and the upper cover 132, that is, to increase the weight of the substrate processing apparatus 1, and to increase the size of the substrate w to be processed. Further, in the substrate processing apparatus 1, even if the plural numbers of the main body Π1 and the upper cover 132 are moved inside the processing device frame 11 to the inside of the maintenance frame 2, there is no possibility of tipping over. Therefore, it is not necessary to prevent the plurality of members from being pulled out. The mechanism can make the structure simple. The following is a description of the structure of the processing chamber 13 and the surrounding structure of the substrate processing apparatus 1 and its peripheral structure. Figure. 2 to 5, the front view of the main body ι31 and the upper cover 132 at the respective processing positions PT and PT' is shown in FIG. 2, and FIG. 3 shows the main body 13 1 At the time of the maintenance position PM, the upper cover 132 is in the processing position, the upper position (hereinafter, also referred to as 105795.doc -12- 1276157 is the "open position") P0, the state, FIG. 4 shows the body 131 in the processing In the state of the time position PT and the upper cover 132 at the position M of the maintenance, FIG. 5 shows the position ρτ of the main body 13 1 at the time of processing and the position p 上 of the upper cover 132 at the time of opening. 6 and FIG. 7 are views corresponding to the side view from the +χ direction, and FIG. 6 is a view showing the state of each of the main body 131 and the upper cover 132 at the processing position ρτ & ρτ. FIG. 7 shows the main body 131 during processing. The position ρτ and the upper cover 132 are in the state of the open position Ρ0'. As shown in FIG. 2 to FIG. 7, the bottom surface 131L of the main body 131 is provided with a heating plate for heating the substrate W (or a cooling plate for cooling the substrate w) 15, and is also disposed inside the processing chamber 13. There are a lifting tip for raising and lowering the substrate w, a driving portion for the lifting tip, and the like (hereinafter, these are collectively referred to as "attached objects"). In this embodiment, the attachment moves with the body 13丨. Further, the substrate processing apparatus i is provided with a main body moving mechanism 16 for moving the main body 13 1 between the processing position ρτ and the maintenance time position pM; and the upper cover moving mechanism 17 for processing the upper cover 132 The time position pT, and the position of the maintenance day position ΡΜ move. In the substrate processing apparatus 丨, the main body moving mechanism 16 and the upper cover moving mechanism 使, at least one of the main body 131 and the upper cover 132 (one or both sides) at the processing position ρτ(ρτ,) and the maintenance position ΡΜ(ΡΜ') Moving between them, you can only retract the parts that need to be retracted to the position at the time of maintenance (ΡΜ,). Hereinafter, the main body moving mechanism 16 and the upper cover moving mechanism 17 will be described in order. As shown in FIG. 2 to FIG. 7 , the main body moving mechanism 16 includes: an obstruction 162a, 105795.doc 13 1276157 which is laid on the gantry i6ia protruding from the inner surface of the processing device frame u; The pedestal 161b is laid on the inner surface of the maintenance frame, the movable block 163 is fixed to one end of the bottom surface 131L of the main body 131, and the wheel 164 is attached to the bottom surface of the main body 131. The other end of 1311^. The trajectory 162a, the executor 162b, and the movable block 163 constitute a linear guide (linear motion guiding mechanism). By moving the movable block 163 on the trajectory 162a and the trajectory 162b, the moving direction of the body 131 is restricted to the track 162a. The direction of the long side of 162b. The wheel 164 can rotate the γ-axis direction as an axis, and the force required to move the body 131 is reduced by the rotational movement on the gantry 161a, l61b. In the substrate processing apparatus 1, the processing position of the body 131 is made? 7 The processing device frame u and the maintenance frame 21 are configured in conformity with the height of the position PM at the time of maintenance. Therefore, the 162& trajectory of the movable block 163 is horizontally laid in the direction of the long side, and the upper surface of the gantry l61a, 161b which is the passage of the wheel i64 is also a horizontal plane (χγ plane) Further, the gap between the gantry 16!a, 161b, the rail 162a, and the rail 162b in the vicinity of the boundary between the processing frame 11 and the maintenance frame 21 is sufficiently small so as not to hinder the sliding of the main body 131, and the gantry 161a, 161b and the rail 162& 162b provides a moving path for continuously connecting the processing position ρτ and the position at the time of maintenance. Therefore, in the substrate processing apparatus!, the movement of the body ι 31 of the body moving mechanism 16 is horizontally moved, and the body can be moved with a small force. I3i smoothly moves between the processing position PT and the maintenance position PM. Furthermore, in the above example, it is explained that the end of one side of the body 131 is supported by the wire guide, and the other end of the body 131 is supported by the wheel. The body 105795.doc -14- 1276157 moves the mechanism 16, but does not prevent the ends of both sides from being supported by the wheels, or the ends of both sides are supported via linear guidance. The combination of the linear guide and the wheel described above is easier to maintain the position of the body axis direction than the wheel alone, and the substrate can be correctly introduced into the interior of the processing chamber 13. Further, only linear guidance is used. In the case of high precision and parallel alignment of 5 pairs of tracks, as described above by combining linear guidance with the wheel, there is the dimensional accuracy required when laying the track 162 &

不會太嚴苛的優點。 又,圖2〜圖7,例示於本體131之底面131L設有2個可動 區塊163及2個車輪164之例,惟可動區塊163或車輪164之 數®,係應考慮本體131之尺寸及重量等適當變更者。再 者,亦可代替車輪164,於本體131之底面131L設置可自由 方疋轉的滑輪,以減少移動本體丨3丨所需之力。 〇上蓋搬送機構; 上盍移動機構17,包含使上蓋132於開放時位置p〇,與維 修時位置PM之間移動之上蓋滑動機構。上蓋滑動機構, 如圖2〜圖7所示,具備··一對軌道171a,其係支持於處理 裝置框条11之内部;一對執道171b,其係支持於維修用框 架21之内部;及車輪173,其係設於上蓋132之端部。 執道171a ’係具有溝型(口字型)之剖面形狀之棒狀構 件’長邊方向呈±Χ方向地水平支持。又,軌道〗7} a,使開 口部相對地平行且支持於同一高度,該開口部之寬幅(溝 的寬幅)’較車輪之直徑大。該等點,執道17 1]3亦相同。 執道171a、17lb之中,處理裝置框架丨丨之内部之一對軌道 105795.doc -15- 1276157 ma可邊維持平行及相同高度而升降,維修用框架21内部 之一對軌道171b對於維修用框架21固定。然後,於基板處 理裝置1,以軌道171a與軌道1711}高度一致之狀態,進行 上蓋132於開放時位置P〇,與維修時位置1>]^,間之滑行。上Not too strict. 2 to 7, an example in which two movable blocks 163 and two wheels 164 are provided on the bottom surface 131L of the main body 131, but the number of movable blocks 163 or wheels 164 is considered to be the size of the body 131. And the appropriate changes such as weight. Further, instead of the wheel 164, a pulley that can freely rotate is provided on the bottom surface 131L of the body 131 to reduce the force required to move the body 丨3丨. The upper cover moving mechanism 17 includes a cover sliding mechanism that moves the upper cover 132 between the open position 132 and the maintenance position PM. As shown in FIG. 2 to FIG. 7, the upper cover sliding mechanism includes a pair of rails 171a supported by the inside of the processing device frame strip 11 and a pair of lanes 171b supported by the inside of the maintenance frame 21; And a wheel 173 disposed at an end of the upper cover 132. The obstruction 171a' is a rod-shaped member having a groove-shaped (mouth-shaped) cross-sectional shape. The longitudinal direction is horizontally supported in the ±Χ direction. Further, the track 7} a is such that the opening portion is relatively parallel and supported at the same height, and the width (width of the groove) of the opening portion is larger than the diameter of the wheel. These points, the same as the road 17 1]3. Among the lanes 171a and 17b, one of the inner pair of rails 105795.doc -15-1276157 ma of the processing device frame can be raised and lowered while maintaining parallel and the same height, and one of the pair of rails 171b for maintenance is used for maintenance. The frame 21 is fixed. Then, in the substrate processing apparatus 1, the upper cover 132 is slid between the open position P〇 and the maintenance position 1> in a state in which the track 171a and the track 1711} are in the same height. on

蓋132之滑行,係藉由可將丫軸方向作為旋轉軸旋轉之車輪 173,於軌道l71a、171b之溝之内部,與軌道171&、17以 之下面接觸之狀態旋轉而實現。此外,於車輪i73之側 面,凸設具有球弧狀外形形狀之引導球174,引導球174與 執道171a、171b之側面接觸,將上蓋132之士γ方向之位置 限制於特定位置。藉由引導球174,可防止向士乂方向移動 時上蓋132向士Υ方向之進路偏離。 例示於上蓋m之端部設有4個車輪 再者,於圖2〜圖7, 173之例,車輪173之數量,係應可考慮上蓋132之尺寸或 重量等適當變更者。又,上蓋132之滑行亦可不是用車輪 1 73而用線性引導或滑行執等進行。 執道171之升降,係藉由本體部17“固定於處理裝置框 架11之>飞缸175實現。具體而言,於基板處理裝置工本體部 心固定於處理裝置框架u之汽缸175之活塞咖與執道 171a連接,藉由活塞175b按照施加之氣體信號向垂直方向 做反覆運動,進行軌道171a之升降。汽缸175,當上蓋Η〕 在於處理裝置框架11内部時,可作為一起升降上蓋υ〕與 執道171之上蓋升降機構而作用。當然,亦可代替汽缸 175’使用油壓缸或電動缸,亦可使用連線機構等輔:機 構以作業者之人工操作升降上蓋13 2。 105795.doc -16- 1276157The sliding of the cover 132 is realized by rotating the wheel 173 which can rotate the x-axis direction as a rotating shaft, and the inside of the groove of the rails 111a and 171b is rotated in contact with the lower side of the rails 171 & Further, on the side of the wheel i73, a guide ball 174 having a spherical arc-shaped outer shape is protruded, and the guide ball 174 comes into contact with the side faces of the road 171a, 171b, and the position of the upper cover 132 in the gamma direction is restricted to a specific position. By guiding the ball 174, the deviation of the approach of the upper cover 132 toward the gentry in the direction of the gentry can be prevented. For example, four wheels are provided at the end of the upper cover m. Further, in the case of Figs. 2 to 7, 173, the number of the wheels 173 should be appropriately changed in consideration of the size or weight of the upper cover 132. Further, the sliding of the upper cover 132 may be performed by linear guidance or taxiing without using the wheel 1 73. The lifting and lowering of the road 171 is realized by the main body portion 17 "fixed to the processing device frame 11". Specifically, the piston of the substrate processing device body is fixed to the piston of the cylinder 175 of the processing device frame u. The coffee is connected to the road 171a, and the piston 175b is moved in the vertical direction in accordance with the applied gas signal to raise and lower the rail 171a. The cylinder 175, when the upper cover 在于 is inside the processing device frame 11, can be lifted and lowered together. 〕 It functions with the upper lifting mechanism of the road 171. Of course, it is also possible to use a hydraulic cylinder or an electric cylinder instead of the cylinder 175', and it is also possible to use an auxiliary mechanism such as a wiring mechanism to lift and lower the upper cover 13 2 by the operator's manual operation. .doc -16- 1276157

—於基板處理裝置卜對基板w進行熱處理時,為使處理 至13内部之溫度分布-定,隔離處理室13内部與外氣為 佳。士此,於基板處理裝置!,對基㈣進行熱處理時, 將上蓋131與軌道171a一起由開放時位置p〇,下降至處理時 =置PT使之呈設於本體131之側面之上端之襯墊⑶a與上 蓋132接觸之狀態,進-步接著,使執道171a之上面盥車 輪m接觸向上蓋132施加向下的負荷,使上蓋132呈押付 襯墊1J la之狀態即實現處理室13之内部維持氣密之狀態。 藉由κ現如此之氣密狀態,於基板處理裝置丨,無須使本 體131與上蓋132之止動機構等,可使本體ΐ3ι與上蓋η〕之 刀離作業或密接作業容易,並且即使本體l3i或上蓋Η?有 起因於熱處理之膨脹,可容易地實現處理室13内部之氣密 又於基板處理裝置1,由於在基板處理時上蓋丨32 會向本體131押附,因此可有效地防止因加熱而使上蓋a〕 浮起§然,可將確保氣密之襯墊13 1 a,並非本體13 1 側,而設於上蓋132亦可得到同樣的效果。 再者,於基板處理裝置i,將上蓋132由處理時位置 向維修時位置PM,移動時,係將執道171a拉高至與執道 Hlb相同高度,先將本體131與上蓋132分離使上蓋。二上 升至開放時位置P0,,之後將上蓋132滑行至維修時位置 pM。此時,於處理裝置框架u與維修用框架以之境界附 近之軌道171a、171b之間隙,充分小至不會妨礙上蓋132 之α行’而執道171a、171b提供連續地連接開放位置p〇, ”、、隹修時位置pM,之移動路徑。因此,於基板處理裝置1, 105795.doc -17- 1276157 使用上蓋移動機構1 7之上蓋132之移動之主要部份成水平 移動,而可以小的力將上蓋132於處理時位置PT1與維修時 位置PM1之間平滑地移動。 {3·維修}- When the substrate processing apparatus heat-treats the substrate w, it is preferable to isolate the inside of the processing chamber 13 from the outside air in order to set the temperature distribution inside the processing to 13. Here, in the substrate processing device! When heat-treating the base (4), the upper cover 131 and the rail 171a are lowered from the open position p〇 to the state in which the lining is applied to the upper end of the side surface of the main body 131 to be in contact with the upper cover 132. Then, the step of step 171a causes the wheel m to contact the upper cover 132 to apply a downward load, so that the upper cover 132 is in the state of the pad 1J la, that is, the inside of the processing chamber 13 is maintained airtight. By the κ being in such an airtight state, in the substrate processing apparatus, the body ΐ3ι and the upper cover η] can be easily separated from the work or the close operation without the need of the body 131 and the upper cover 132, etc., and even the body l3i Or the upper cover? Due to the expansion of the heat treatment, the airtight inside the processing chamber 13 can be easily realized in the substrate processing apparatus 1. Since the upper cover 32 is attached to the body 131 during the substrate processing, the cause can be effectively prevented. The upper cover a] is floated by heating. § However, the airtight cushion 13 1 a can be provided on the side of the main body 13 1 , and the same effect can be obtained by providing the upper cover 132 . Further, in the substrate processing apparatus i, when the upper cover 132 is moved from the processing position to the maintenance position PM, the lane 171a is raised to the same height as the lane Hlb, and the body 131 and the upper cover 132 are separated first to cover the upper cover. . When the second position is raised to the open position P0, the upper cover 132 is then slid to the maintenance position pM. At this time, the gap between the processing device frame u and the rails 171a and 171b near the boundary of the maintenance frame is sufficiently small to not hinder the α row ' of the upper cover 132 and the lanes 171a and 171b are continuously connected to the open position p〇. , ",, the position of the repair time position pM, the movement path. Therefore, in the substrate processing apparatus 1, 105795.doc -17-1276157, the main part of the movement of the upper cover 132 using the upper cover moving mechanism 17 is horizontally moved, and The small force smoothly moves the upper cover 132 between the processing position PT1 and the maintenance position PM1. {3·Maintenance}

以下,邊舉具體事例說明進行處理室13之本體13 1或上 蓋132之維修時本體131或上蓋132之退避。再者,以下來 照之圖8〜圖11係,將基板處理裝置1從-γ方向所示之正面 圖’惟為說明本體13 1或上蓋1 3 2之位置成概略正面圖,省 略先前所述本體移動機構16及上蓋移動機構17。 〇本體之維修; 進行本體之維修時,作業者,如圖8所示,使用本體移 動機構16將維修對象之本體131Μ由處理時位置卩丁(虛線)拉 出至、、隹修時位置ΡΜ(實線)才開始維修。詳言之,作業者, 使對應本體13 1Μ之上蓋132由處理時位置ΡΤ,(虛線)上升至 開放時位置ρ〇’(實線)將本體131Μ與上蓋分離,之後, 使本體131Μ由處理時位置ρτ滑行至維修時位置?“,於維 修用框架21内部開始維修。本體13ιμ之滑行,可以人工 喿作進行亦可使用以馬達作為動力源之驅動機構。於維 修用框架21構築作業用立足處在進行維修也無妨。 出至、准U時位置ΡΜ之本體13以,上面完全開放,呈 可容易地執行清掃等之維修之狀態。於此,只要將本體 1 3 1IV[之附隨物舉起丰 ^寻不θ有與具起者干涉之部位的方式 構成維修用框架21,丨丄 伙备 則卩使疋父換該附隨物等的大規模維 修亦可容易地執杆。 b外’於維修用框架21設置本體13 1 105795.doc 1276157 之升降機構,則可將本體131M下降至適當的高度再進行 • 維修,而可提升維修之作業性。 又,於基板處理裝置1,由於即使是完全開放本體13im 之上面時,亦無需將上蓋132向上方舉起之作業,故無須 於上方確保為將上蓋132舉起之空間,亦無需舉起上蓋132 之機構。因此,基板處理裝置丨,可有效利用所設置之工 廠之空間。再者,於基板處理裝置丨,即使是開放本體 Φ i31M之上面之狀態,於上面的上方並不存在如上蓋132之 重畺物’故可容易地確保維修時作業者之安全。 完成維修之本體131M,回覆至處理時位置1>7,之後, 將上蓋132下降,再度呈與上蓋132密接之狀態。 再者,於上述說明,表示將本體131]^之全體拉出至維 修用框架21之例,惟僅進行本體131之+又方向之端部附近 之維修時,亦可不將全體拉出,而只開放進行維修之端部 附近之上面地將本體131之一部分拉出至維修用框架21。 泰又,於上述說明,表示將維修對象之本體131M之全體拉 出至維修用框架21之例,惟亦可如圖9所示,將維修對象 之本體131JV[留在處理裝置框架n内部,拉出其餘的本體 131及上蓋132至維修用框架21,於處理裝置框架“内部同 樣可容易地執行維修。 〇上蓋之維修 進行上蓋之維修時,作業者,如圖i 〇所示,使用上蓋移 動機構17將成為維修對象之上蓋13罵由處理時位置打,拉 出至為維修時位置PM,再開始作業。詳言之,作業者,使 105795.doc •19- 1276157 上盖132M由處理時位置PT,上升至開放時位置p〇,分離本體 U1與上蓋132M,之後,使上蓋132]^由開放時位置p〇,、、腎 行至維修時位置PM’,於維㈣框架21内部開始維修。: 蓋132M之滑行,亦可以人卫操作進行,使^馬達作為 動力源之驅動機構亦可。於維修用框架21構築作業用立足 處在進行維修也無妨。Hereinafter, the retreat of the main body 131 or the upper cover 132 of the main body 13 1 or the upper cover 132 of the processing chamber 13 will be described with reference to specific examples. In the following, in the front view of the substrate processing apparatus 1 from the -γ direction, the position of the main body 13 1 or the upper cover 133 is shown in a schematic front view, and the foregoing description is omitted. The main body moving mechanism 16 and the upper cover moving mechanism 17. Maintenance of the main body; When the maintenance of the main body is performed, the operator, as shown in FIG. 8, uses the main body moving mechanism 16 to pull the main body 131 of the maintenance object from the processing position (dotted line) to the position at the time of repairing. (solid line) began to repair. In detail, the operator causes the upper cover 13 of the corresponding body 13 1Μ to be moved from the processing position ΡΤ, (dotted line) to the open position ρ〇' (solid line) to separate the body 131Μ from the upper cover, and then the body 131 is processed by the upper body. When the position ρτ slides to the maintenance position? "The maintenance is started inside the maintenance frame 21. The sliding of the main body 13μ is possible, and the driving mechanism using the motor as the power source can be used. It is also possible to perform maintenance on the maintenance frame 21. When the body 13 is in the position of the U-position, the upper part is completely open, and the state of maintenance such as cleaning can be easily performed. Here, as long as the body 1 3 1IV is attached, The maintenance frame 21 is formed in such a manner as to interfere with the part of the person in charge, and the 丨丄 备 容易 容易 换 换 换 换 换 换 换 换 大规模 大规模 大规模 大规模 大规模 大规模 大规模 大规模 大规模 大规模 大规模 大规模 大规模The lifting mechanism of the body 13 1 105795.doc 1276157 can lower the main body 131M to an appropriate height and perform maintenance, thereby improving the workability of the maintenance. Also, in the substrate processing apparatus 1, since even the body 13im is completely open In the above case, there is no need to lift the upper cover 132 upward, so that it is not necessary to secure the space for lifting the upper cover 132 above, and there is no need to lift the upper cover 132. Therefore, the substrate processing apparatus丨The space of the factory to be installed can be effectively utilized. Further, in the substrate processing apparatus, even in the state above the open body Φ i31M, the weight of the cover 132 is not present above the upper surface, so that it can be easily ensured. The safety of the operator during maintenance is completed. The main body 131M that has been repaired is returned to the processing position 1 > 7, and then the upper cover 132 is lowered and placed in close contact with the upper cover 132. Further, in the above description, the main body 131 is shown. ^All of them are pulled out to the maintenance frame 21, but only when the maintenance is performed near the end of the main body 131 and the direction is not pulled out, but only the upper side near the end for maintenance is opened. One part of the main body 131 is pulled out to the maintenance frame 21. The above description shows an example in which the entire body 131M of the maintenance object is pulled out to the maintenance frame 21, but the maintenance object may be as shown in FIG. The body 131JV [remaining inside the processing device frame n, pulling out the remaining body 131 and the upper cover 132 to the maintenance frame 21, and performing maintenance in the inside of the processing device frame as well. When the upper cover is repaired and the upper cover is repaired, the operator, as shown in Fig. 〇, uses the upper cover moving mechanism 17 to make the upper cover 13 of the maintenance target, and is pulled out to the position PM for maintenance, and then starts. operation. In detail, the operator makes the 105795.doc •19-1276157 upper cover 132M rise from the processing position PT to the open position p〇, separates the body U1 from the upper cover 132M, and then makes the upper cover 132]^ from the open position P〇,,, kidney to the maintenance position PM', maintenance within the Wei (4) frame 21. : The sliding of the cover 132M can also be carried out by the human guard, so that the motor can be used as the driving mechanism of the power source. It is no problem that the maintenance frame 21 can be used for maintenance work.

拉出至維修時位置讀,之上蓋Π2Μ,容易髒的下面完全 開放’呈可容易地執行清掃等之維修之狀態。X,於維修 用框木21 ,又置上蓋132M之升降機構,則可將上蓋下 降至適當的高度再進行維修,而可提升維修之作業性。完 成維修之上蓋132M,回覆至處理時位置ρτ,,之後下降, 再度呈與本體131密接之狀態。 再者,於上述說明’表示將上蓋132Μ之全體拉出至維 修用框架21之例,惟僅進行上蓋132之仰向之端部附近 之維修時,亦可不將全體拉出,而只開放進行維修之端部 附近之下面地將上蓋職之—部分拉出至維修用框架 21。又,於上述說明,表示將維修對象之上蓋!现之全 體拉出至維修用框架21之例,惟亦可如圖u所示,將靜 2之上蓋132M留在處理裝置框架内部,拉出其餘的 本體m及上蓋132至維修用框架21 ’於處理裝置框㈣内 部同樣可容易地執行維修。 {4變形例} 表示本體131及上蓋〗32之雙方可退避 〇關於構件之退避 於上述實施形態, I05795.doc -20· 1276157 至維修日^位置PM(pm,)之例,惟本發明亦包含只有本體131 ’ 或上蓋132之任一可退避至維修時位置PM(PM,)之樣態。或 者採用’維持本體131與上蓋132結合進行退避至維修時位 置之樣恶,或將處理室丨3分離為3個以上之構件,其全部 或部分獨立地可退避至維修時位置之樣態亦無妨。 又,並非本體131之全體,而只有本體131之底面或附隨 物退避至維修時位置,使本體131之其餘部分留在處理裝 φ 置框木11之内部之樣態,或本體13 1之底面或附隨物留在 處理裝置框架11之内部,而本體131之其餘部分退避至維 修時位置之樣態亦無妨。 再者,於上述實施形態,表示本體131及上蓋132之雙方 ^維修時位置以維修用框架21支持之例,惟亦可使本體 或上蓋13 2之任一如先前技術單邊支持於處理裝置框架 1卜 八 ◦關於升降機構; • 於上述實施形態,藉由上升上蓋132使本體131與上蓋 m分離’惟亦可構成為可以升降機構升降本體i3i或槪塾 1318,藉由下降本體131或襯墊13U,使本體131與上蓋 132分離。 再者,升降機構並非必要,亦可使之呈 由維修用框架2!向處理裝置框牟n ^工 处衣置框木11水平移動即可使本體 131與上蓋132密接。 〇處理室之支持; 代替上述維修用框架2丨,於蕻由罝 於猎由早邊支持而可將本體或 105795.doc -21 · 1276157 上蓋向維修時位置拉出之基板處理裝置,將拉出之本體或 上蓋由下方藉由構造物支持亦無妨。例如,如圖12之侧面 圖所不,於本體331經由單邊滑行樑381支持於處理裝置框 =31之基板處理裝置3,將本體331之一部分由處理裝置框 架31拉出,於地板面上可水平移動之構造物4〇ι載置其底 面,再將本體331之全體由處理裝置框架31拉出亦無妨。 又,如圖13之側面圖所示,本體531經由單邊滑行樑581支 持於處理裝置框架51之基板處理裝置5,將由上蓋532分離 之本體531之-部分由處理裝置框架51拉出,於地板面上 可水平移動之構造物601載置其底面,再將本體531之全體 由處理裝置框架51拉出亦無妨。 【圖式簡單說明】 圖1係表示關於本發明之實施形態之基板處理裝置丨之概 略全體構成之立體圖。 圖2係放大表示基板處理裝置】之處理室。及其週 造之正面圖。 圖3係放大表示基板處理裝置j之處理㈣及其週邊之 造之正面圖。 1之處理室13及其週邊之構 圖4係放大表示基板處理裝置 造之正面圖。 圖5係放大表不基板處理裝 造之正面圖。 圖6係放大表示基板處理裝 造之側面圖。 置1之處理室13及其週邊之構 置1之處理室I3及其週邊之構 105795.doc -22-When it is pulled out to the position at the time of maintenance, the upper cover is 2 Μ, and the underside of the dirt is completely opened, and the maintenance state such as cleaning can be easily performed. X. In the maintenance of the frame wood 21 and the lifting mechanism of the cover 132M, the upper cover can be lowered to an appropriate height for maintenance, and the maintenance workability can be improved. The upper cover 132M is completed and returned to the processing position ρτ, and then lowered to be in close contact with the body 131. In the above description, the example in which the entire upper cover 132 is pulled out to the maintenance frame 21 is used. However, when only the vicinity of the end portion of the upper cover 132 is repaired, the whole can be pulled out without being pulled out. The upper part of the vicinity of the end of the repair is pulled out to the maintenance frame 21. In addition, in the above description, it is indicated that the maintenance object is over the cover! Now, all of them are pulled out to the maintenance frame 21, but as shown in Fig. u, the static upper cover 132M is left inside the processing device frame, and the remaining body m and the upper cover 132 are pulled out to the maintenance frame 21'. Maintenance can also be easily performed inside the processing device frame (4). {4 Modifications} It is shown that both the main body 131 and the upper cover 〖32 are retractable, and the member is retracted from the above embodiment, I05795.doc -20·1276157 to the maintenance date ^ position PM(pm,), but the present invention is also Contains only one of the body 131' or the upper cover 132 that can be retracted to the maintenance position PM (PM,). Or adopting 'maintaining the body 131 in combination with the upper cover 132 to retreat to the position at the time of maintenance, or separating the processing chamber 丨3 into three or more members, all or part of which can be independently retracted to the position at the time of maintenance. No problem. Moreover, it is not the entirety of the body 131, but only the bottom surface of the body 131 or the attached object is retracted to the position at the time of maintenance, so that the rest of the body 131 remains in the interior of the processing frame 11, or the body 13 1 It is also possible that the bottom surface or the accompanying material remains inside the processing device frame 11, and the rest of the body 131 is retracted to the position at the time of maintenance. Furthermore, in the above embodiment, both the main body 131 and the upper cover 132 are supported by the maintenance frame 21, but any one of the main body or the upper cover 13 may be supported by the processing device as one of the prior art. The frame 1 is a lifting mechanism; • in the above embodiment, the main body 131 is separated from the upper cover m by raising the upper cover 132. However, the lifting body i3i or the crucible 1318 can be lifted and lowered by the lifting body 131 or The pad 13U separates the body 131 from the upper cover 132. Further, the elevating mechanism is not necessary, and the maintenance frame 2 can be placed in the maintenance device frame 牟n ^ the work clothing frame 11 to move horizontally so that the main body 131 and the upper cover 132 are in close contact with each other. 〇Processing room support; In place of the above-mentioned maintenance frame 2丨, the substrate processing device that can pull the main body or the 105795.doc -21 · 1276157 cover to the maintenance position by the support of the early side will pull It is also possible to support the body or the upper cover by the structure below. For example, as shown in the side view of FIG. 12, the main body 331 is supported by the substrate processing apparatus 3 of the processing apparatus frame=31 via the single-side sliding beam 381, and a part of the main body 331 is pulled out from the processing apparatus frame 31 on the floor surface. It is also possible that the structure that can be moved horizontally is placed on the bottom surface, and the entire body 331 is pulled out of the processing apparatus frame 31. Further, as shown in the side view of FIG. 13, the main body 531 is supported by the substrate processing apparatus 5 of the processing apparatus frame 51 via the one-side sliding beam 581, and the portion of the main body 531 separated by the upper cover 532 is pulled out by the processing apparatus frame 51. The structure 601 which is horizontally movable on the floor surface is placed on the bottom surface thereof, and the entire body 531 is pulled out from the processing apparatus frame 51. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an overall configuration of a substrate processing apparatus according to an embodiment of the present invention. Fig. 2 is an enlarged view showing a processing chamber of the substrate processing apparatus. And the front view of its creation. Fig. 3 is a front elevational view showing the process (four) of the substrate processing apparatus j and its periphery. The configuration of the processing chamber 13 and its periphery in Fig. 4 is an enlarged front view showing the substrate processing apparatus. Fig. 5 is a front elevational view showing the substrate processing of the substrate. Fig. 6 is a side elevational view showing the substrate processing assembly in an enlarged manner. The processing chamber 13 of the processing chamber 13 and its surrounding structure 1 and its surrounding structure are constructed. 105795.doc -22-

Claims (1)

1276157 、申請專利範圍: 種基板處理裝置,其特徵在於:具有對基板進 處理之處理室,且具備: 丁特疋 第1支持構造,其係於在上述處理室對基板進行處理 :::位置之處理時位置,支持構成上述處理室之特定構 第2支持構造,其係於與上述處理時位置相異之退避 時位置,與上述第1支持構造獨立而於上述第1支持槿1 之外部支持上述特定構件者;及 k 移動機構,其係使上述特定構件於上述處理時位置與 上述退避時位置之間移動者。 〃 2.如請求項1之基板處理装置,其中 上述處理室,可分離為複數構件; 上述移動機構係將該複數構件之中至少一個構件作為 上述特疋構件,使之於上述處理時位置與退避時位置之 間移動。 3·如請求項1之基板處理裝置,其中 上述基板處理裝置具有複數上述處理室; 上述第1支持構造及上述第2支持構造分別將構成複數 f述處理室各個之上料㈣件在各上述敎構件所規 定之上述處理時位置及上述退避時位置支持,· 上述移動機構係使上述特定構件在各上述特定構件所 規定之上述處理時位置及上述退避時位置之間移動。 4.如請求項1之基板處理裝置,其中 105795.doc 1276157 上述移動機構於上述處理 間,使上述特定構件水平移動訂迹退避時位置之 5種基板處理裝置’其特徵在u有對基 處理之處理室,且具備: 進仃特疋 第1支持構造,其係支持 複數構件U 彳構成上以理室之可分離之 6. 移動機構,其係將該複數構件 移動至上述第1支持構造之外部者。 個特疋構件 如請求項5之基板處理裝置,其中進—步具備: 第2支持構造,其係與上述第丨支持 筮7 ±枯摄& 待構造獨立而於上述 第支持構造之外部支持上述特定構件; 支構係於由上述第1支持構造進行支持之第1 /、上述第2支持構造進行支持之第2支持位置 之間,移動上述特定構件。 如請求項5之基板處理裝置,其中 上述基板處理裝置具有複數上述處理室; 述第1支持構造支持構成複數上述處理室各個之上 述特定構件; 上述移動機構將才冓成複數上述處ί里室各個之上述特定 構件向上述第1支持構造之外部移動。 8·如請求項6之基板處理裝置,其中 上述私動機構於上述第丨支持位置與上述第2支持位置 之間,使上述特定構件水平移動。 105795.doc1276157. Patent application scope: A substrate processing apparatus comprising: a processing chamber for processing a substrate; and comprising: a Dingte first support structure for processing the substrate in the processing chamber::: position The processing position position supports a specific configuration second support structure constituting the processing chamber, and is at a retracted position different from the processing position, and is independent of the first support structure and outside the first support 槿1 And a k-moving mechanism that moves the specific member between the processing position and the retracted position. 2. The substrate processing apparatus according to claim 1, wherein the processing chamber is separable into a plurality of members; and the moving mechanism is configured to use at least one of the plurality of members as the characteristic member so as to be at the processing position Move between positions when retracting. 3. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus includes a plurality of processing chambers; and the first support structure and the second support structure respectively form a plurality of processing materials in each of the processing chambers. The processing position position and the retracted position position defined by the crucible member are supported, and the moving mechanism moves the specific member between the processing position and the retracted position defined by each of the specific members. 4. The substrate processing apparatus according to claim 1, wherein the moving mechanism is configured to move the specific member horizontally to the five kinds of substrate processing apparatuses at the time of the retracting position during the processing, and the characteristic processing is performed on the substrate. The processing chamber further includes: a first support structure for supporting the plurality of members U 彳 to form a separable upper chamber; a moving mechanism for moving the plurality of members to the first support structure The outsider. The special component is the substrate processing apparatus of claim 5, wherein the step further comprises: a second support structure, which is externally supported by the above-mentioned first support structure independently of the above-mentioned third support ±7±枯photo& The specific member is configured to move the specific member between the second support positions supported by the first/second support structure supported by the first support structure. The substrate processing apparatus of claim 5, wherein the substrate processing apparatus has a plurality of processing chambers; the first supporting structure supports the specific components constituting each of the plurality of processing chambers; and the moving mechanism is configured to form the plurality of chambers Each of the specific members described above moves to the outside of the first support structure. 8. The substrate processing apparatus according to claim 6, wherein the private movement mechanism moves the specific member horizontally between the second support position and the second support position. 105795.doc
TW094137538A 2005-01-31 2005-10-26 Substrate processing apparatus TWI276157B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005023565A JP2006210808A (en) 2005-01-31 2005-01-31 Substrate-treating apparatus
JP2005022859A JP4515275B2 (en) 2005-01-31 2005-01-31 Substrate processing equipment

Publications (2)

Publication Number Publication Date
TW200639923A TW200639923A (en) 2006-11-16
TWI276157B true TWI276157B (en) 2007-03-11

Family

ID=37176629

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094137538A TWI276157B (en) 2005-01-31 2005-10-26 Substrate processing apparatus

Country Status (2)

Country Link
KR (1) KR100747962B1 (en)
TW (1) TWI276157B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5350692B2 (en) * 2008-07-03 2013-11-27 東京エレクトロン株式会社 Substrate processing apparatus and support frame used therefor
KR101160167B1 (en) * 2010-01-08 2012-06-28 세메스 주식회사 Substrate treating apparatus and storing unit
KR102497795B1 (en) * 2016-07-04 2023-02-09 세메스 주식회사 Apparatus for treating substrate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100515955B1 (en) * 2003-11-18 2005-09-23 주식회사 에이디피엔지니어링 Processing chamber of FPD manufacturing machine having a device for opening the cover

Also Published As

Publication number Publication date
TW200639923A (en) 2006-11-16
KR100747962B1 (en) 2007-08-08
KR20060088003A (en) 2006-08-03

Similar Documents

Publication Publication Date Title
TWI641402B (en) Particle ray medical device and operation method thereof
TWI276157B (en) Substrate processing apparatus
TW503445B (en) Method and apparatus for improved substrate handling
JP4754304B2 (en) Substrate processing apparatus, load lock chamber unit, and carrying-out method of transfer apparatus
US11083420B2 (en) Robotic operating table and hybrid operating system
JP2009049413A5 (en)
US20180110486A1 (en) Operation table with robot arm
TW201011834A (en) Method and apparatus for detecting the substrate temperature in a laser anneal system
CN111246914B (en) Radiation therapy system
US10605829B2 (en) Transfer unit and prober
JP2013169289A (en) Couch with patient tilting device
TWI232922B (en) Slide slit type thermal treatment unit
TWI544515B (en) The cover holds the fixture
JP4515275B2 (en) Substrate processing equipment
KR20180107740A (en) Storage facility for object of paying of respects
US11052498B2 (en) Invertible part loading system
CN114007687A (en) Radiation therapy system
JP4471487B2 (en) Vacuum processing equipment, vacuum processing method
KR100773263B1 (en) Apparatus for vacuum processing
KR100841942B1 (en) Sliding door of apparatus that treatment substrate
JP4021983B2 (en) Stage equipment for vacuum laser annealing equipment
JP2008275376A (en) Body surface monitor
JP2000070698A (en) Treatment apparatus equipped with treatment container having direct-acting mechanism
JP2020178019A (en) Substrate processing apparatus
JP2016014514A (en) Thermal treatment device