JP7020595B2 - 純銅板 - Google Patents

純銅板 Download PDF

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Publication number
JP7020595B2
JP7020595B2 JP2021540098A JP2021540098A JP7020595B2 JP 7020595 B2 JP7020595 B2 JP 7020595B2 JP 2021540098 A JP2021540098 A JP 2021540098A JP 2021540098 A JP2021540098 A JP 2021540098A JP 7020595 B2 JP7020595 B2 JP 7020595B2
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JP
Japan
Prior art keywords
less
mass ppm
heat treatment
copper plate
pure copper
Prior art date
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JP2021540098A
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English (en)
Japanese (ja)
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JPWO2021177470A1 (https=
Inventor
裕隆 松永
優樹 伊藤
広行 森
典久 飯田
基裕 日高
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of JPWO2021177470A1 publication Critical patent/JPWO2021177470A1/ja
Application granted granted Critical
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
JP2021540098A 2020-03-06 2021-03-08 純銅板 Active JP7020595B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020038771 2020-03-06
JP2020038771 2020-03-06
PCT/JP2021/008963 WO2021177470A1 (ja) 2020-03-06 2021-03-08 純銅板

Publications (2)

Publication Number Publication Date
JPWO2021177470A1 JPWO2021177470A1 (https=) 2021-09-10
JP7020595B2 true JP7020595B2 (ja) 2022-02-16

Family

ID=77614083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021540098A Active JP7020595B2 (ja) 2020-03-06 2021-03-08 純銅板

Country Status (7)

Country Link
US (1) US20240124954A1 (https=)
EP (1) EP4116451A4 (https=)
JP (1) JP7020595B2 (https=)
KR (1) KR102927900B1 (https=)
CN (1) CN115244197B (https=)
TW (1) TWI872218B (https=)
WO (1) WO2021177470A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI870562B (zh) * 2020-03-06 2025-01-21 日商三菱綜合材料股份有限公司 純銅板
JP7342957B2 (ja) * 2020-03-06 2023-09-12 三菱マテリアル株式会社 純銅板、銅／セラミックス接合体、絶縁回路基板
JP7473066B2 (ja) * 2022-07-29 2024-04-23 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
WO2024024909A1 (ja) * 2022-07-29 2024-02-01 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
JP7444324B2 (ja) * 2022-07-29 2024-03-06 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
EP4467675A4 (en) * 2022-07-29 2025-12-24 Mitsubishi Materials Corp PURE COPPER MATERIAL, INSULATING SUBSTRATE, AND ELECTRONIC DEVICE
WO2024024899A1 (ja) * 2022-07-29 2024-02-01 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
JP7444323B2 (ja) * 2022-07-29 2024-03-06 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
KR102572477B1 (ko) * 2023-04-06 2023-08-29 엘에스전선 주식회사 유연성이 우수한 무산소동 또는 무산소동 합금 로드
CN120519734A (zh) * 2025-06-30 2025-08-22 宁波金田电材有限公司 一种高耐热高导电铜合金及其制备方法与应用
CN121575267B (zh) * 2026-01-27 2026-03-27 宁波兴业盛泰集团有限公司 无氧铜带材及其制备方法和应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000212660A (ja) 1999-01-18 2000-08-02 Nippon Mining & Metals Co Ltd フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2014111805A (ja) 2012-12-05 2014-06-19 Mitsubishi Materials Corp 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品及び端子
JP2016125093A (ja) 2014-12-26 2016-07-11 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品、端子及びバスバー
JP2017043790A (ja) 2015-08-24 2017-03-02 三菱マテリアル株式会社 高純度銅スパッタリングターゲット材

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62282797A (ja) * 1986-05-29 1987-12-08 Dowa Mining Co Ltd セラミツクス−銅直接接合用銅材
JPH062058A (ja) 1992-06-23 1994-01-11 Furukawa Electric Co Ltd:The 結晶粒成長抑制無酸素銅
JP2010282797A (ja) * 2009-06-03 2010-12-16 Honda Motor Co Ltd 燃料電池システムの制御方法
JP4869415B2 (ja) * 2010-02-09 2012-02-08 三菱伸銅株式会社 純銅板の製造方法及び純銅板
JP5752736B2 (ja) * 2013-04-08 2015-07-22 三菱マテリアル株式会社 スパッタリング用ターゲット
JP6962298B2 (ja) 2018-09-03 2021-11-05 トヨタ自動車株式会社 固体電池用正極活物質層

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000212660A (ja) 1999-01-18 2000-08-02 Nippon Mining & Metals Co Ltd フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2014111805A (ja) 2012-12-05 2014-06-19 Mitsubishi Materials Corp 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品及び端子
JP2016125093A (ja) 2014-12-26 2016-07-11 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品、端子及びバスバー
JP2017043790A (ja) 2015-08-24 2017-03-02 三菱マテリアル株式会社 高純度銅スパッタリングターゲット材

Also Published As

Publication number Publication date
CN115244197B (zh) 2023-10-17
KR20220146483A (ko) 2022-11-01
EP4116451A1 (en) 2023-01-11
WO2021177470A1 (ja) 2021-09-10
EP4116451A4 (en) 2024-03-27
TW202202635A (zh) 2022-01-16
US20240124954A1 (en) 2024-04-18
CN115244197A (zh) 2022-10-25
TWI872218B (zh) 2025-02-11
KR102927900B1 (ko) 2026-02-13
JPWO2021177470A1 (https=) 2021-09-10

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