KR102927900B1 - 순구리판 - Google Patents

순구리판

Info

Publication number
KR102927900B1
KR102927900B1 KR1020227029842A KR20227029842A KR102927900B1 KR 102927900 B1 KR102927900 B1 KR 102927900B1 KR 1020227029842 A KR1020227029842 A KR 1020227029842A KR 20227029842 A KR20227029842 A KR 20227029842A KR 102927900 B1 KR102927900 B1 KR 102927900B1
Authority
KR
South Korea
Prior art keywords
less
massppm
grain
heat treatment
copper plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227029842A
Other languages
English (en)
Korean (ko)
Other versions
KR20220146483A (ko
Inventor
히로타카 마츠나가
유키 이토
히로유키 모리
노리히사 이이다
모토히로 히타카
Original Assignee
미쓰비시 마테리알 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰비시 마테리알 가부시키가이샤 filed Critical 미쓰비시 마테리알 가부시키가이샤
Publication of KR20220146483A publication Critical patent/KR20220146483A/ko
Application granted granted Critical
Publication of KR102927900B1 publication Critical patent/KR102927900B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
KR1020227029842A 2020-03-06 2021-03-08 순구리판 Active KR102927900B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020038771 2020-03-06
JPJP-P-2020-038771 2020-03-06
PCT/JP2021/008963 WO2021177470A1 (ja) 2020-03-06 2021-03-08 純銅板

Publications (2)

Publication Number Publication Date
KR20220146483A KR20220146483A (ko) 2022-11-01
KR102927900B1 true KR102927900B1 (ko) 2026-02-13

Family

ID=77614083

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227029842A Active KR102927900B1 (ko) 2020-03-06 2021-03-08 순구리판

Country Status (7)

Country Link
US (1) US20240124954A1 (https=)
EP (1) EP4116451A4 (https=)
JP (1) JP7020595B2 (https=)
KR (1) KR102927900B1 (https=)
CN (1) CN115244197B (https=)
TW (1) TWI872218B (https=)
WO (1) WO2021177470A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI870562B (zh) * 2020-03-06 2025-01-21 日商三菱綜合材料股份有限公司 純銅板
JP7342957B2 (ja) * 2020-03-06 2023-09-12 三菱マテリアル株式会社 純銅板、銅／セラミックス接合体、絶縁回路基板
JP7473066B2 (ja) * 2022-07-29 2024-04-23 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
WO2024024909A1 (ja) * 2022-07-29 2024-02-01 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
JP7444324B2 (ja) * 2022-07-29 2024-03-06 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
EP4467675A4 (en) * 2022-07-29 2025-12-24 Mitsubishi Materials Corp PURE COPPER MATERIAL, INSULATING SUBSTRATE, AND ELECTRONIC DEVICE
WO2024024899A1 (ja) * 2022-07-29 2024-02-01 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
JP7444323B2 (ja) * 2022-07-29 2024-03-06 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
KR102572477B1 (ko) * 2023-04-06 2023-08-29 엘에스전선 주식회사 유연성이 우수한 무산소동 또는 무산소동 합금 로드
CN120519734A (zh) * 2025-06-30 2025-08-22 宁波金田电材有限公司 一种高耐热高导电铜合金及其制备方法与应用
CN121575267B (zh) * 2026-01-27 2026-03-27 宁波兴业盛泰集团有限公司 无氧铜带材及其制备方法和应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000212660A (ja) 1999-01-18 2000-08-02 Nippon Mining & Metals Co Ltd フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2016125093A (ja) 2014-12-26 2016-07-11 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品、端子及びバスバー

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62282797A (ja) * 1986-05-29 1987-12-08 Dowa Mining Co Ltd セラミツクス−銅直接接合用銅材
JPH062058A (ja) 1992-06-23 1994-01-11 Furukawa Electric Co Ltd:The 結晶粒成長抑制無酸素銅
JP2010282797A (ja) * 2009-06-03 2010-12-16 Honda Motor Co Ltd 燃料電池システムの制御方法
JP4869415B2 (ja) * 2010-02-09 2012-02-08 三菱伸銅株式会社 純銅板の製造方法及び純銅板
JP6248388B2 (ja) 2012-12-05 2017-12-20 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用部品及び端子
JP5752736B2 (ja) * 2013-04-08 2015-07-22 三菱マテリアル株式会社 スパッタリング用ターゲット
JP6651737B2 (ja) 2015-08-24 2020-02-19 三菱マテリアル株式会社 高純度銅スパッタリングターゲット材
JP6962298B2 (ja) 2018-09-03 2021-11-05 トヨタ自動車株式会社 固体電池用正極活物質層

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000212660A (ja) 1999-01-18 2000-08-02 Nippon Mining & Metals Co Ltd フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2016125093A (ja) 2014-12-26 2016-07-11 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品、端子及びバスバー

Also Published As

Publication number Publication date
CN115244197B (zh) 2023-10-17
KR20220146483A (ko) 2022-11-01
EP4116451A1 (en) 2023-01-11
WO2021177470A1 (ja) 2021-09-10
EP4116451A4 (en) 2024-03-27
JP7020595B2 (ja) 2022-02-16
TW202202635A (zh) 2022-01-16
US20240124954A1 (en) 2024-04-18
CN115244197A (zh) 2022-10-25
TWI872218B (zh) 2025-02-11
JPWO2021177470A1 (https=) 2021-09-10

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