JP7001660B2 - 電力およびrf用途用の設計された基板構造 - Google Patents
電力およびrf用途用の設計された基板構造 Download PDFInfo
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- JP7001660B2 JP7001660B2 JP2019217661A JP2019217661A JP7001660B2 JP 7001660 B2 JP7001660 B2 JP 7001660B2 JP 2019217661 A JP2019217661 A JP 2019217661A JP 2019217661 A JP2019217661 A JP 2019217661A JP 7001660 B2 JP7001660 B2 JP 7001660B2
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Description
[0001]本出願は、2016年6月14日に出願された「ENGINEERED SUBSTRATE STRUCTURE FOR POWER AND RF APPLICATIONS」という名称の米国仮特許出願第62/350,084号明細書、および2016年6月14日に出願された「ENGINEERED SUBSTRATE STRUCTURE AND METHOD OF MANUFACTURE」という名称の米国仮特許出願第62/350,077号明細書に基づく優先権を主張し、その開示内容は、全ての目的のためにその全体が参照により本明細書に組み込まれる。
ン層に結合された実質的単結晶シリコン層、および実質的単結晶シリコン層に結合されたエピタキシャルIII-V層とを含む。
である。導電層がポリシリコンである実施形態では、ポリシリコン層の厚さは、500~5,000Å程度、例えば2,500Åであり得る。幾つかの実施形態では、ポリシリコン層は、第1の接着層112(例えば、TEOS層)を完全に囲むようにシェルとして形成することができ、それにより完全に封入された第1の接着層を形成し、またLPCVDプロセスを使用して形成できる。他の実施形態では、後述するように、導電性材料は、接着層の一部、例えば基板構造の下半分に形成することができる。幾つかの実施形態では、導電性材料を完全封入層として形成し、続いて基板構造の片側で除去することができる。
構造はバリア層118を含まなかった。図2Aを参照すると、セラミックコア中に存在する幾つかの種(例えば、イットリウム、カルシウム、およびアルミニウム)は、設計された層120/122中で無視できる濃度まで低下する。カルシウム、イットリウム、およびアルミニウムの濃度は、それぞれ3、4、および6桁下がる。
ホウ素によるドーピングは約1×1019cm-3から1×1020cm-3の範囲のレベルである。導電層の存在は、設計された基板を半導体処理ツール、例えば静電チャック(ESC)を有するツールに静電チャックする際に有用である。導電層314は、処理後の迅速なデチャックを可能にする。したがって、本発明の実施形態は、従来のシリコンウエハと共に利用される方法で処理できる基板構造を提供する。当業者であれば、多くの変形、修正、および代替案を認識するであろう。
層)を接合層に接合することは、層がシリコンウエハから転写される単結晶シリコン層である層転写プロセスを利用する。
きる。
板構造はその後除去される。しかしながら、RFおよびパワー装置用途の場合、設計された基板構造は完成した装置の一部を形成し、その結果、設計された基板構造または設計された基板構造の要素の電気的、熱的、および他の特性は、特定の用途に対して重要である。
Claims (18)
- 基板を製造する方法であって、前記方法は、
多結晶セラミックコアを提供し、
前記多結晶セラミックコアを第1の接着性シェルに封入し、
前記第1の接着性シェルを導電性シェルに封入し、
前記導電性シェルを第2の接着性シェルに封入し、
前記第2の接着性シェルをバリアシェルに封入することによって支持構造を形成することと、
接合層を前記支持構造に接合することと、
実質的単結晶シリコン層を前記接合層に接合することと、
前記実質的単結晶シリコン層上に、エピタキシャル成長によってエピタキシャルシリコン層を形成することと、
前記エピタキシャルシリコン層上に、エピタキシャル成長によって1つ以上のエピタキシャルIII-V層を形成することと、
を含む、方法。 - 前記1つ以上のエピタキシャルIII-V層から前記エピタキシャルシリコン層へと通過する複数のビアを形成することをさらに含む、請求項1に記載の方法。
- 前記多結晶セラミックコアが窒化アルミニウムを含む、請求項1に記載の方法。
- 前記1つ以上のエピタキシャルIII-V層がエピタキシャル窒化ガリウム層を含む、請求項1に記載の方法。
- 前記第1の接着性シェルは第1のテトラエチルオルトシリケート(TEOS)シェルを含み、
前記導電性シェルはポリシリコンシェルを含み、
前記第2の接着性シェルは第2のTEOSシェルを含み、
前記バリアシェルは窒化シリコンシェルを含み、
前記接合層は酸化シリコンを含む、請求項1に記載の方法。 - 前記第1のTEOSシェルはTEOSの単一層を含み、
前記ポリシリコンシェルはポリシリコンの単一層を含み、
前記第2のTEOSシェルはTEOSの単一層を含み、
前記窒化シリコンシェルは窒化シリコンの単一層を含む、請求項5に記載の方法。 - 前記1つ以上のエピタキシャルIII-V層の厚さが、約5μm以上である、請求項4に記載の方法。
- 前記実質的単結晶シリコン層を接合することが、剥離によって実行される、請求項1に記載の方法。
- 前記実質的単結晶シリコン層が約0.5μmの厚さを有する、請求項8に記載の方法。
- 基板を製造する方法であって、前記方法は、
多結晶セラミックコアを提供し、
前記多結晶セラミックコアに結合された第1の接着層を形成し、
前記第1の接着層に結合された導電層を形成し、
前記導電層に結合された第2の接着層を形成し、
前記第2の接着層に結合されたバリア層を形成することによって支持構造を形成することと、
前記支持構造に結合された接合層を形成することと、
実質的単結晶シリコン層を前記接合層に接合することと、
前記実質的単結晶シリコン層に結合された1つ以上のエピタキシャルIII-V層を形成することと、
を含む、方法。 - 前記多結晶セラミックコアが窒化アルミニウムを含む、請求項10に記載の方法。
- 前記1つ以上のエピタキシャルIII-V層がエピタキシャル窒化ガリウム層を含む、請求項11に記載の方法。
- 前記エピタキシャル窒化ガリウム層が約5μm以上の厚さを有する、請求項12に記載の方法。
- 前記実質的単結晶シリコン層を接合することが、剥離によって実行される、請求項10に記載の方法。
- 前記1つ以上のエピタキシャルIII-V層を形成する前に、
前記実質的単結晶シリコン層に結合されたエピタキシャルシリコン層を形成することをさらに含み、
前記1つ以上のエピタキシャルIII-V層が前記エピタキシャルシリコン層に結合される、請求項14に記載の方法。 - 前記エピタキシャルシリコン層が歪んでいる、請求項15に記載の方法。
- 前記第1の接着層はテトラエチルオルトシリケート(TEOS)を含み、
前記導電層はポリシリコンを含み、
前記第2の接着層はTEOSを含み、
前記バリア層は窒化シリコンを含み、
前記接合層は酸化シリコンを含む、請求項10に記載の方法。 - 前記第1の接着層が前記多結晶セラミックコアを封入し、
前記導電層が前記第1の接着層を封入し、
前記第2の接着層が前記導電層を封入し、
前記バリア層が前記第2の接着層を封入する、請求項17に記載の方法。
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EP3469119A4 (en) | 2020-02-26 |
WO2017218536A1 (en) | 2017-12-21 |
JP6626607B2 (ja) | 2019-12-25 |
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KR102361057B1 (ko) | 2022-02-08 |
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