JP7118069B2 - 縦型パワーデバイスのための方法およびシステム - Google Patents
縦型パワーデバイスのための方法およびシステム Download PDFInfo
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- JP7118069B2 JP7118069B2 JP2019534971A JP2019534971A JP7118069B2 JP 7118069 B2 JP7118069 B2 JP 7118069B2 JP 2019534971 A JP2019534971 A JP 2019534971A JP 2019534971 A JP2019534971 A JP 2019534971A JP 7118069 B2 JP7118069 B2 JP 7118069B2
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- layer
- gallium nitride
- epitaxial
- type gallium
- forming
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- 238000000034 method Methods 0.000 title claims description 151
- 229910002601 GaN Inorganic materials 0.000 claims description 168
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 149
- 239000000758 substrate Substances 0.000 claims description 95
- 230000004888 barrier function Effects 0.000 claims description 46
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 32
- 239000004065 semiconductor Substances 0.000 claims description 24
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 claims description 23
- 239000000919 ceramic Substances 0.000 claims description 22
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 239000002019 doping agent Substances 0.000 claims description 8
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- 239000010410 layer Substances 0.000 description 460
- 230000008569 process Effects 0.000 description 58
- 239000000463 material Substances 0.000 description 45
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 32
- 229920005591 polysilicon Polymers 0.000 description 27
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 22
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 21
- 239000012790 adhesive layer Substances 0.000 description 20
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 20
- 229910052710 silicon Inorganic materials 0.000 description 18
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- 239000013078 crystal Substances 0.000 description 16
- 238000012986 modification Methods 0.000 description 15
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- 229910010293 ceramic material Inorganic materials 0.000 description 14
- 229910052814 silicon oxide Inorganic materials 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 12
- 238000005137 deposition process Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 12
- 229910052581 Si3N4 Inorganic materials 0.000 description 11
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 11
- 239000004020 conductor Substances 0.000 description 10
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 8
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- 238000009792 diffusion process Methods 0.000 description 6
- QZQVBEXLDFYHSR-UHFFFAOYSA-N gallium(III) oxide Inorganic materials O=[Ga]O[Ga]=O QZQVBEXLDFYHSR-UHFFFAOYSA-N 0.000 description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 5
- 229910052796 boron Inorganic materials 0.000 description 5
- 230000015556 catabolic process Effects 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 5
- 229910010271 silicon carbide Inorganic materials 0.000 description 5
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
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- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
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- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 239000011573 trace mineral Substances 0.000 description 3
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- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 2
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- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 238000000277 atomic layer chemical vapour deposition Methods 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
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- 229910003460 diamond Inorganic materials 0.000 description 2
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- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 2
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- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical group [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910020776 SixNy Inorganic materials 0.000 description 1
- 229910020781 SixOy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
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- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
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- 229910052788 barium Inorganic materials 0.000 description 1
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- 229910052790 beryllium Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
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- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
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- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
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- 238000009616 inductively coupled plasma Methods 0.000 description 1
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- 238000001465 metallisation Methods 0.000 description 1
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- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- PCLURTMBFDTLSK-UHFFFAOYSA-N nickel platinum Chemical compound [Ni].[Pt] PCLURTMBFDTLSK-UHFFFAOYSA-N 0.000 description 1
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- 229910052763 palladium Inorganic materials 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
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- 238000007736 thin film deposition technique Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
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- -1 yttria) Chemical compound 0.000 description 1
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- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66522—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with an active layer made of a group 13/15 material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66712—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7788—Vertical transistors
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- H—ELECTRICITY
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
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- H01L21/02373—Group 14 semiconducting materials
- H01L21/02378—Silicon carbide
Description
[0001]本出願は、2016年12月28日に申請された米国仮特許出願第62/439,860号、および2017年12月19日に申請された米国非仮特許出願第15/847,716号の利点を主張するものであり、それらの開示は、その全体が参照により組み込まれる。
Claims (20)
- 半導体デバイスを形成する方法であって、前記方法が、
多結晶セラミックコア、
前記多結晶セラミックコアを封入するバリア層、
前記バリア層に結合された接合層、および
前記接合層に結合された実質的に単結晶のシリコン層、
を含む人工基板を用意するステップと、
前記人工基板に結合されたショットキーダイオードを形成するステップであって、前記ショットキーダイオードが頂面および底面を有し、前記底面が前記実質的に単結晶のシリコン層に結合されている、ステップと、
前記ショットキーダイオードの前記頂面に結合されたショットキーコンタクトを形成するステップと、
前記ショットキーコンタクトに結合された金属メッキを形成するステップと、
前記ショットキーダイオードの前記底面を露出させるために前記人工基板を除去するステップと、
前記ショットキーダイオードの前記底面上にオーミックコンタクトを形成するステップと、
を含む、方法。 - 前記ショットキーダイオードを前記形成するステップが、
前記実質的に単結晶のシリコン層に結合された第1のエピタキシャルN型窒化ガリウム層を形成するステップであって、前記第1のエピタキシャルN型窒化ガリウム層が第1のドーピング濃度を有する、ステップと、
前記第1のエピタキシャルN型窒化ガリウム層に結合された第2のエピタキシャルN型窒化ガリウム層を形成するステップであって、前記第2のエピタキシャルN型窒化ガリウム層が前記第1のドーピング濃度よりも少ない第2のドーピング濃度を有する、ステップと、
を含み、
前記ショットキーコンタクトが前記第2のエピタキシャルN型窒化ガリウム層に結合され、前記オーミックコンタクトが前記第1のエピタキシャルN型窒化ガリウム層に結合されている、
請求項1に記載の方法。 - 前記第1のエピタキシャルN型窒化ガリウム層を形成する前に、前記実質的に単結晶のシリコン層に結合されたバッファ層を形成するステップであって、前記第1のエピタキシャルN型窒化ガリウム層が前記バッファ層に結合されている、ステップをさらに含む、請求項2に記載の方法。
- 前記バッファ層が窒化アルミニウムガリウムを含む、請求項3に記載の方法。
- 前記バッファ層が窒化アルミニウム層と、窒化アルミニウムガリウム層と、窒化ガリウム層と、を含む複数の層を含む、請求項3に記載の方法。
- 前記第2のエピタキシャルN型窒化ガリウム層が約10μmよりも大きな厚さを有する、請求項2に記載の方法。
- 前記第2のエピタキシャルN型窒化ガリウム層が約20μmよりも大きな厚さを有する、請求項2に記載の方法。
- 前記金属メッキが約50μm~約100μmの範囲にある厚さを有する、請求項1に記載の方法。
- 前記多結晶セラミックコアが多結晶窒化アルミニウムガリウム(AlGaN)を含む、請求項1に記載の方法。
- 前記実質的に単結晶のシリコン層が(111)表面配向を有する、請求項1に記載の方法。
- 多結晶セラミックコア、
前記多結晶セラミックコアを封入するバリア層、
前記バリア層に結合された接合層、および
前記接合層に結合された実質的に単結晶のシリコン層
を含む人工基板を用意するステップと、
前記実質的に単結晶のシリコン層に結合されたバッファ層を形成するステップと、
前記バッファ層に結合されたパワートランジスタを形成するステップであって、前記パワートランジスタが頂面および底面を有し、前記底面が前記バッファ層に結合されている、ステップと、
前記パワートランジスタの頂面に結合されたゲートコンタクトを形成するステップと、
前記パワートランジスタの前記頂面に結合された第1のソースコンタクトおよび第2のソースコンタクトを形成するステップと、
前記人工基板を除去するステップと、
前記パワートランジスタの前記底面を露出させるために前記バッファ層を除去するステップと、
前記パワートランジスタの前記底面に結合されたドレインコンタクトを形成するステップと、
を含む、
半導体デバイスを形成する方法。 - 前記パワートランジスタを形成するステップが、
前記バッファ層に結合された第1のエピタキシャルN型窒化ガリウム層を形成するステップであって、前記第1のエピタキシャルN型窒化ガリウム層が第1のドーピング濃度を有する、ステップと、
前記第1のエピタキシャルN型窒化ガリウム層に結合された第2のエピタキシャルN型窒化ガリウム層を形成するステップであって、前記第2のエピタキシャルN型窒化ガリウム層が前記第1のドーピング濃度よりも少ない第2のドーピング濃度を有する、ステップと、
前記第2のエピタキシャルN型窒化ガリウム層内部に第1のP型窒化ガリウム領域および第2のP型窒化ガリウム領域を形成するステップであって、前記第1のP型窒化ガリウム領域および前記第2のP型窒化ガリウム領域がトレンチによって互いに分離されており、前記トレンチの上方の、前記第2のエピタキシャルN型窒化ガリウム層の一部がチャネル領域を形成する、ステップと、
前記チャネル領域に結合されたエピタキシャル窒化アルミニウムガリウム層を形成するステップと、
前記エピタキシャル窒化アルミニウムガリウム層に結合されたゲート誘電体層を形成するステップと、
前記ゲートコンタクトが前記ゲート誘電体層に結合され、前記第1のソースコンタクトが前記第1のP型窒化ガリウム領域に結合され、前記第2のソースコンタクトが前記第2のP型窒化ガリウム領域に結合され、前記ドレインコンタクトが前記第1のエピタキシャルN型窒化ガリウム層の背面に結合されている、
請求項11に記載の方法。 - 前記第1のP型窒化ガリウム領域および前記第2のP型窒化ガリウム領域を形成するステップが、前記第2のエピタキシャルN型窒化ガリウム層の第1の領域および第2の領域にP型ドーパントを注入するステップを含む、請求項12に記載の方法。
- 前記第1のP型窒化ガリウム領域および前記第2のP型窒化ガリウム領域を形成するステップが、
前記第2のエピタキシャルN型窒化ガリウム層上にエピタキシャルP型窒化ガリウム層を形成するステップと、
前記エピタキシャルP型窒化ガリウム層の一部を除去して前記第2のエピタキシャルN型窒化ガリウム層の一部を露出させる前記トレンチを形成するステップであって、前記トレンチが、前記エピタキシャルP型窒化ガリウム層の残りの部分を前記第1のP型窒化ガリウム領域と前記第2のP型窒化ガリウム領域とに分離する、ステップと、
前記第2のエピタキシャルN型窒化ガリウム層の前記露出した部分、および前記エピタキシャルP型窒化ガリウム層の前記残りの部分に再成長エピタキシャルN型窒化ガリウム層を形成するステップと、
を含む、請求項12に記載の方法。 - 前記第2のエピタキシャルN型窒化ガリウム層が約10μmよりも大きな厚さを有する、請求項12に記載の方法。
- 前記第2のエピタキシャルN型窒化ガリウム層が約20μmよりも大きな厚さを有する、請求項12に記載の方法。
- 前記多結晶セラミックコアが多結晶窒化アルミニウムガリウム(AlGaN)を含む、請求項11に記載の方法。
- 前記実質的に単結晶のシリコン層が(111)表面配向を有する、請求項11に記載の方法。
- 前記バッファ層が窒化アルミニウムガリウムを含む、請求項11に記載の方法。
- 前記バッファ層が、窒化アルミニウム層と、窒化アルミニウムガリウム層と、窒化ガリウム層と、を含む複数の層を含む、請求項11に記載の方法。
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US15/847,716 US10204778B2 (en) | 2016-12-28 | 2017-12-19 | Method and system for vertical power devices |
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JP2015056486A (ja) | 2013-09-11 | 2015-03-23 | 株式会社東芝 | 半導体装置およびその製造方法 |
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CN110291645A (zh) | 2019-09-27 |
EP3563422A4 (en) | 2020-08-05 |
US10204778B2 (en) | 2019-02-12 |
US20180182620A1 (en) | 2018-06-28 |
CN110291645B (zh) | 2023-06-06 |
TWI754710B (zh) | 2022-02-11 |
KR102532814B1 (ko) | 2023-05-15 |
WO2018125723A1 (en) | 2018-07-05 |
TW201841211A (zh) | 2018-11-16 |
EP3563422A1 (en) | 2019-11-06 |
KR20190098764A (ko) | 2019-08-22 |
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