TWI793755B - 用於功率及rf應用的工程基板結構 - Google Patents
用於功率及rf應用的工程基板結構 Download PDFInfo
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- TWI793755B TWI793755B TW110133509A TW110133509A TWI793755B TW I793755 B TWI793755 B TW I793755B TW 110133509 A TW110133509 A TW 110133509A TW 110133509 A TW110133509 A TW 110133509A TW I793755 B TWI793755 B TW I793755B
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US10622468B2 (en) | 2017-02-21 | 2020-04-14 | QROMIS, Inc. | RF device integrated on an engineered substrate |
US10734303B2 (en) * | 2017-11-06 | 2020-08-04 | QROMIS, Inc. | Power and RF devices implemented using an engineered substrate structure |
US10586844B2 (en) * | 2018-01-23 | 2020-03-10 | Texas Instruments Incorporated | Integrated trench capacitor formed in an epitaxial layer |
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CN111987140A (zh) * | 2019-05-21 | 2020-11-24 | 世界先进积体电路股份有限公司 | 基底及其制造方法 |
JP7319227B2 (ja) | 2020-05-11 | 2023-08-01 | 信越化学工業株式会社 | Iii-v族化合物結晶用ベース基板及びその製造方法 |
KR20230020968A (ko) | 2020-06-09 | 2023-02-13 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Iii족 질화물계 에피택셜 성장용 기판과 그 제조 방법 |
JP2022012558A (ja) | 2020-07-01 | 2022-01-17 | 信越化学工業株式会社 | 大口径iii族窒化物系エピタキシャル成長用基板とその製造方法 |
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KR20230137921A (ko) | 2021-02-05 | 2023-10-05 | 신에쯔 한도타이 가부시키가이샤 | 질화물 반도체기판 및 그의 제조방법 |
JP7549549B2 (ja) | 2021-02-26 | 2024-09-11 | 信越半導体株式会社 | 窒化物半導体基板およびその製造方法 |
EP4306689A1 (en) * | 2021-03-10 | 2024-01-17 | Shin-Etsu Chemical Co., Ltd. | Seed substrate for epitaxial growth use and method for manufacturing same, and semiconductor substrate and method for manufacturing same |
CN117413345A (zh) * | 2021-06-08 | 2024-01-16 | 信越半导体株式会社 | 氮化物半导体基板及其制造方法 |
JP2023025432A (ja) * | 2021-08-10 | 2023-02-22 | 信越半導体株式会社 | 窒化物半導体基板及びその製造方法 |
EP4407657A1 (en) * | 2021-09-21 | 2024-07-31 | Shin-Etsu Handotai Co., Ltd. | Nitride semiconductor substrate and method for producing same |
WO2023063046A1 (ja) * | 2021-10-15 | 2023-04-20 | 信越半導体株式会社 | 窒化物半導体基板及びその製造方法 |
WO2023063278A1 (ja) * | 2021-10-15 | 2023-04-20 | 信越半導体株式会社 | 窒化物半導体基板及びその製造方法 |
JP2023065227A (ja) | 2021-10-27 | 2023-05-12 | 信越化学工業株式会社 | エピタキシャル成長用種基板およびその製造方法、ならびに半導体基板およびその製造方法 |
WO2023119916A1 (ja) | 2021-12-21 | 2023-06-29 | 信越半導体株式会社 | 窒化物半導体基板および窒化物半導体基板の製造方法 |
JP2023098137A (ja) * | 2021-12-28 | 2023-07-10 | 信越化学工業株式会社 | 高特性エピタキシャル成長用基板とその製造方法 |
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TWI743136B (zh) | 2021-10-21 |
WO2017218536A1 (en) | 2017-12-21 |
JP7001660B2 (ja) | 2022-01-19 |
JP2019523994A (ja) | 2019-08-29 |
CN109844184A (zh) | 2019-06-04 |
KR20190019122A (ko) | 2019-02-26 |
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