JP6995621B2 - 電気接続テープ - Google Patents
電気接続テープ Download PDFInfo
- Publication number
- JP6995621B2 JP6995621B2 JP2017542083A JP2017542083A JP6995621B2 JP 6995621 B2 JP6995621 B2 JP 6995621B2 JP 2017542083 A JP2017542083 A JP 2017542083A JP 2017542083 A JP2017542083 A JP 2017542083A JP 6995621 B2 JP6995621 B2 JP 6995621B2
- Authority
- JP
- Japan
- Prior art keywords
- composition
- electrical connection
- tape
- flux
- solder powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
- B23K35/0238—Sheets, foils layered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Cable Accessories (AREA)
Description
本願は、参照により本明細書にその全体を援用する、2015年2月11日出願の米国特許出願第62/114,820号、発明の名称「電気接続テープ」に対し35USC119(e)条に基づく利益を主張する。
Claims (8)
- キャリアフィルムに、
はんだ粉末及びはんだ付用フラックスを含有する組成物が塗布され、乾燥されることによって得られた電気接続テープであって、
前記組成物が、前記はんだ付用フラックスを50wt%から70wt%含有し、且つ前記はんだ粉末を30wt%から50wt%含有することを特徴とする電気接続テープ。 - 前記組成物が、はんだ付用フラックスを含有し、前記はんだ粉末が前記はんだ付用フラックス中に配されている請求項1に記載の電気接続テープ。
- 前記組成物が、エポキシ及び/又はアクリルを含む請求項2に記載の電気接続テープ。
- 前記組成物が、エポキシ及びアクリルの少なくともいずれかを含有する請求項1に記載の電気接続テープ。
- 前記組成物が、フィラー材料を含み、前記フィラー材料が、ガラスフリットを含む請求項1に記載の電気接続テープ。
- 前記組成物が、添加剤を含み、前記添加剤が、サーモクロミック染料を含有する請求項1に記載の電気接続テープ。
- はんだ付用フラックス、及び、エポキシ及び/又はアクリルの少なくともいずれかを含有する組成物を準備することと、
はんだ粉末を前記組成物に添加することと、
前記はんだ粉末を添加した前記組成物をキャリアフィルム上にキャスティングすることと、
乾燥炉で、前記キャリアフィルムを乾燥させ、乾燥テープを作製することと、
前記乾燥テープを所望の幅に切断して電気接続テープを作製することと
を含むことを特徴とする請求項1から5のいずれかに記載の電気接続テープの製造方法。 - 前記テープの乾燥炉での乾燥が、5分間から15分間、前記組成物の溶剤の沸点より10℃から15℃低い温度で、前記テープを乾燥することを含む請求項7に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562114820P | 2015-02-11 | 2015-02-11 | |
US62/114,820 | 2015-02-11 | ||
PCT/US2016/017331 WO2016130662A1 (en) | 2015-02-11 | 2016-02-10 | Electrical connection tape |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018505060A JP2018505060A (ja) | 2018-02-22 |
JP6995621B2 true JP6995621B2 (ja) | 2022-01-14 |
Family
ID=56614813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017542083A Active JP6995621B2 (ja) | 2015-02-11 | 2016-02-10 | 電気接続テープ |
Country Status (6)
Country | Link |
---|---|
US (1) | US10625356B2 (ja) |
EP (2) | EP4037103A1 (ja) |
JP (1) | JP6995621B2 (ja) |
KR (1) | KR102038377B1 (ja) |
TW (1) | TWI772254B (ja) |
WO (1) | WO2016130662A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10160066B2 (en) * | 2016-11-01 | 2018-12-25 | GM Global Technology Operations LLC | Methods and systems for reinforced adhesive bonding using solder elements and flux |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001164210A (ja) | 1999-12-13 | 2001-06-19 | Sumitomo Bakelite Co Ltd | 異方導電フィルム及びそれを用いた電子機器 |
WO2007125650A1 (ja) | 2006-04-27 | 2007-11-08 | Sumitomo Bakelite Co., Ltd. | 接着テープ、半導体パッケージおよび電子機器 |
JP2008300443A (ja) | 2007-05-29 | 2008-12-11 | Sumitomo Bakelite Co Ltd | 半導体ウエハーの接合方法および半導体装置の製造方法 |
JP2011123277A (ja) | 2009-12-10 | 2011-06-23 | Shin-Etsu Chemical Co Ltd | 光硬化性樹脂組成物、該組成物を用いたフィルム状接着剤及び接着シート |
WO2013062095A1 (ja) | 2011-10-26 | 2013-05-02 | 日立化成株式会社 | リフローフィルム、はんだバンプ形成方法、はんだ接合の形成方法及び半導体装置 |
JP5921650B2 (ja) | 2014-11-25 | 2016-05-24 | 三菱電機株式会社 | 誘導加熱調理器 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4667869A (en) | 1981-10-05 | 1987-05-26 | Raychem Corporation | Soldering methods and devices |
JPH0247459B2 (ja) | 1982-07-28 | 1990-10-19 | Dainippon Ink & Chemicals | Shinkinemachitsukuekishokagobutsu |
JPS5921650U (ja) * | 1982-07-28 | 1984-02-09 | 岩崎電気株式会社 | 両面接着具 |
JPS61276873A (ja) | 1985-05-31 | 1986-12-06 | Sony Chem Kk | 導電異方性接着剤 |
JP3134703B2 (ja) | 1995-03-07 | 2001-02-13 | 松下電器産業株式会社 | 電子部品の半田付け用フラックスの塗布装置および塗布方法 |
CA2221961C (en) * | 1995-05-24 | 2008-02-05 | Fry's Metals Inc. | Epoxy-based, voc-free soldering flux |
JP4368946B2 (ja) * | 1996-08-16 | 2009-11-18 | ダウ・コーニング・コーポレーション | 印刷可能組成物、並びにその印刷回路板の製造に用いる誘電表面への適用 |
US7022266B1 (en) * | 1996-08-16 | 2006-04-04 | Dow Corning Corporation | Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards |
US6337522B1 (en) * | 1997-07-10 | 2002-01-08 | International Business Machines Corporation | Structure employing electrically conductive adhesives |
US7182241B2 (en) * | 2002-08-09 | 2007-02-27 | Micron Technology, Inc. | Multi-functional solder and articles made therewith, such as microelectronic components |
US7261841B2 (en) | 2003-11-19 | 2007-08-28 | E. I. Du Pont De Nemours And Company | Thick film conductor case compositions for LTCC tape |
KR20090005209A (ko) * | 2006-04-24 | 2009-01-12 | 히다치 가세고교 가부시끼가이샤 | 접착재 테이프 |
US7754005B2 (en) * | 2006-05-02 | 2010-07-13 | Kyphon Sarl | Bone cement compositions comprising an indicator agent and related methods thereof |
JPWO2008023452A1 (ja) * | 2006-08-25 | 2010-01-07 | 住友ベークライト株式会社 | 接着テープ、接合体および半導体パッケージ |
TWI414580B (zh) * | 2006-10-31 | 2013-11-11 | Sumitomo Bakelite Co | 黏著帶及使用該黏著帶而成之半導體裝置 |
US7911059B2 (en) | 2007-06-08 | 2011-03-22 | SeniLEDS Optoelectronics Co., Ltd | High thermal conductivity substrate for a semiconductor device |
JPWO2010027017A1 (ja) | 2008-09-05 | 2012-02-02 | 住友ベークライト株式会社 | 導電接続材料およびそれを用いた端子間の接続方法ならびに接続端子の製造方法 |
JP5728636B2 (ja) | 2010-09-29 | 2015-06-03 | パナソニックIpマネジメント株式会社 | 導電性接着剤、及びそれを用いた回路基板、電子部品モジュール |
CN103180079B (zh) | 2010-11-08 | 2016-03-30 | 松下知识产权经营株式会社 | 焊料转印基材的制造方法、焊料预涂方法、及焊料转印基材 |
JP2015009394A (ja) * | 2013-06-27 | 2015-01-19 | 京セラ株式会社 | 圧電アクチュエータ、それを用いた液体吐出ヘッドおよび記録装置 |
-
2016
- 2016-02-10 US US15/549,535 patent/US10625356B2/en active Active
- 2016-02-10 KR KR1020177025406A patent/KR102038377B1/ko active IP Right Grant
- 2016-02-10 JP JP2017542083A patent/JP6995621B2/ja active Active
- 2016-02-10 EP EP22162649.2A patent/EP4037103A1/en active Pending
- 2016-02-10 EP EP16749792.4A patent/EP3257109B1/en active Active
- 2016-02-10 WO PCT/US2016/017331 patent/WO2016130662A1/en active Application Filing
- 2016-02-15 TW TW105104335A patent/TWI772254B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001164210A (ja) | 1999-12-13 | 2001-06-19 | Sumitomo Bakelite Co Ltd | 異方導電フィルム及びそれを用いた電子機器 |
WO2007125650A1 (ja) | 2006-04-27 | 2007-11-08 | Sumitomo Bakelite Co., Ltd. | 接着テープ、半導体パッケージおよび電子機器 |
JP2008300443A (ja) | 2007-05-29 | 2008-12-11 | Sumitomo Bakelite Co Ltd | 半導体ウエハーの接合方法および半導体装置の製造方法 |
JP2011123277A (ja) | 2009-12-10 | 2011-06-23 | Shin-Etsu Chemical Co Ltd | 光硬化性樹脂組成物、該組成物を用いたフィルム状接着剤及び接着シート |
WO2013062095A1 (ja) | 2011-10-26 | 2013-05-02 | 日立化成株式会社 | リフローフィルム、はんだバンプ形成方法、はんだ接合の形成方法及び半導体装置 |
JP5921650B2 (ja) | 2014-11-25 | 2016-05-24 | 三菱電機株式会社 | 誘導加熱調理器 |
Also Published As
Publication number | Publication date |
---|---|
JP2018505060A (ja) | 2018-02-22 |
KR102038377B1 (ko) | 2019-10-31 |
EP3257109A4 (en) | 2018-08-01 |
US10625356B2 (en) | 2020-04-21 |
TWI772254B (zh) | 2022-08-01 |
TW201635314A (zh) | 2016-10-01 |
KR20170118783A (ko) | 2017-10-25 |
EP3257109B1 (en) | 2022-06-22 |
WO2016130662A1 (en) | 2016-08-18 |
US20180036818A1 (en) | 2018-02-08 |
EP4037103A1 (en) | 2022-08-03 |
EP3257109A1 (en) | 2017-12-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2676218C (en) | High temperature solder materials | |
JP2012174332A (ja) | 導電性接合材料、導体の接合方法、及び半導体装置の製造方法 | |
WO2013146504A1 (ja) | ダイボンド用導電性ペースト及び該導電性ペーストによるダイボンド方法 | |
US6740544B2 (en) | Solder compositions for attaching a die to a substrate | |
JP2012532979A (ja) | 超音波接合用の異方性伝導性の接着剤及びこれを利用した電子部品間の接続方法 | |
JP2010149185A (ja) | 金属フィラー、はんだペースト、及び接続構造体 | |
JP5442566B2 (ja) | 導電性接合剤及びその接合方法 | |
US10413992B2 (en) | Method for joining structural material, joining sheet, and joint structure | |
JP2014028380A (ja) | 金属フィラー、はんだペースト、及び接続構造体 | |
JP6995621B2 (ja) | 電気接続テープ | |
CN112961633A (zh) | 一种低温固化的导电胶及其制备方法 | |
JP2007237271A (ja) | 半田接着剤および半田接着剤を用いた電子部品実装構造 | |
JP5077684B2 (ja) | ピン転写用Au−Sn合金はんだペースト | |
WO2014129006A1 (ja) | 硬化剤、該硬化剤を含む熱硬化性樹脂組成物、それを用いた接合方法、および熱硬化性樹脂の硬化温度の制御方法 | |
JP2011251330A (ja) | 高温鉛フリーはんだペースト | |
JP2002120086A (ja) | 無鉛はんだ及びその製造方法 | |
JPS63123594A (ja) | 低温接合用合金 | |
JPH04190997A (ja) | 電子部品のハンダ付け用フラツクスおよび電子部品の半田付け方法 | |
JP6335588B2 (ja) | 異方導電性接着剤の製造方法 | |
KR102106996B1 (ko) | 솔더입자를 포함한 시트를 사용한 부품 실장 방법 | |
JP4010717B2 (ja) | 電気接点の接合方法 | |
JP5310664B2 (ja) | 電子部品実装方法 | |
KR101214061B1 (ko) | 저가형 이방 도전성 페이스트를 사용한 전기적 접합 구조물의 제조방법 | |
JP6361370B2 (ja) | 硬化剤、該硬化剤を含む熱硬化性樹脂組成物、それを用いた接合方法、および熱硬化性樹脂の硬化温度の制御方法 | |
JP2023176346A (ja) | 回路接続構造体の製造方法及び回路接続装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170921 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180912 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180925 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20181211 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20190207 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190225 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20190806 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191205 |
|
C60 | Trial request (containing other claim documents, opposition documents) |
Free format text: JAPANESE INTERMEDIATE CODE: C60 Effective date: 20191205 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20191212 |
|
C21 | Notice of transfer of a case for reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C21 Effective date: 20191217 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20200207 |
|
C211 | Notice of termination of reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C211 Effective date: 20200218 |
|
C22 | Notice of designation (change) of administrative judge |
Free format text: JAPANESE INTERMEDIATE CODE: C22 Effective date: 20200908 |
|
C13 | Notice of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: C13 Effective date: 20201215 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20210312 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20210409 |
|
C22 | Notice of designation (change) of administrative judge |
Free format text: JAPANESE INTERMEDIATE CODE: C22 Effective date: 20210413 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20210510 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210614 |
|
C13 | Notice of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: C13 Effective date: 20210914 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210916 |
|
C302 | Record of communication |
Free format text: JAPANESE INTERMEDIATE CODE: C302 Effective date: 20210921 |
|
C23 | Notice of termination of proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C23 Effective date: 20211019 |
|
C03 | Trial/appeal decision taken |
Free format text: JAPANESE INTERMEDIATE CODE: C03 Effective date: 20211130 |
|
C30A | Notification sent |
Free format text: JAPANESE INTERMEDIATE CODE: C3012 Effective date: 20211130 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20211215 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6995621 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |