JP6982688B2 - 表面処理された銀粉末及びその製造方法 - Google Patents

表面処理された銀粉末及びその製造方法 Download PDF

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Publication number
JP6982688B2
JP6982688B2 JP2020524301A JP2020524301A JP6982688B2 JP 6982688 B2 JP6982688 B2 JP 6982688B2 JP 2020524301 A JP2020524301 A JP 2020524301A JP 2020524301 A JP2020524301 A JP 2020524301A JP 6982688 B2 JP6982688 B2 JP 6982688B2
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JP
Japan
Prior art keywords
silver powder
treatment agent
silver
weight
acid
Prior art date
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Active
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JP2020524301A
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English (en)
Japanese (ja)
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JP2021501266A (ja
Inventor
イ、ミヨン
キム、ヨンファン
ジン、ウミン
カン、テフン
チェ、ゼウォン
リ、チャングン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LS MnM Inc
Original Assignee
LS Nikko Copper Inc
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Publication date
Application filed by LS Nikko Copper Inc filed Critical LS Nikko Copper Inc
Publication of JP2021501266A publication Critical patent/JP2021501266A/ja
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • B22F9/16Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102Metallic powder coated with organic material
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00Metallic composition of the powder or its coating
    • B22F2301/25Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255Silver or gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Non-Insulated Conductors (AREA)
JP2020524301A 2017-10-31 2018-10-16 表面処理された銀粉末及びその製造方法 Active JP6982688B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2017-0143177 2017-10-31
KR1020170143177A KR102061720B1 (ko) 2017-10-31 2017-10-31 표면 처리된 은 분말 및 이의 제조방법
PCT/KR2018/012184 WO2019088509A1 (fr) 2017-10-31 2018-10-16 Poudre d'argent traitée en surface et son procédé de préparation

Publications (2)

Publication Number Publication Date
JP2021501266A JP2021501266A (ja) 2021-01-14
JP6982688B2 true JP6982688B2 (ja) 2021-12-17

Family

ID=66332084

Family Applications (1)

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JP2020524301A Active JP6982688B2 (ja) 2017-10-31 2018-10-16 表面処理された銀粉末及びその製造方法

Country Status (4)

Country Link
JP (1) JP6982688B2 (fr)
KR (1) KR102061720B1 (fr)
CN (1) CN111511489B (fr)
WO (1) WO2019088509A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102454264B1 (ko) * 2020-03-25 2022-10-14 엘에스니꼬동제련 주식회사 점도 안정성이 향상된 전도성 페이스트용 은 분말 및 이의 제조방법
KR102401091B1 (ko) * 2020-11-03 2022-05-23 엘에스니꼬동제련 주식회사 탄성도가 우수한 전도성 페이스트용 은 분말 및 이의 제조방법
CN113275584B (zh) * 2021-05-20 2023-11-14 苏州星翰新材料科技有限公司 一种微纳米银粉及其制备方法和应用
CN115070058B (zh) * 2022-08-16 2022-11-01 西安锐创微米科技有限公司 一种抗氧化能力强的高结晶度高球形度钯粉的制备方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
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JPS62295960A (ja) * 1986-06-16 1987-12-23 Toho Chem Ind Co Ltd 導電性塗布剤組成物
JP4025839B2 (ja) * 1996-09-12 2007-12-26 Dowaエレクトロニクス株式会社 銀粉および銀粉の製造方法
JP3447971B2 (ja) * 1999-02-10 2003-09-16 東光株式会社 誘電体磁器組成物
JP2000231828A (ja) 1999-02-12 2000-08-22 Murata Mfg Co Ltd 導電性ペースト
JP2005190907A (ja) * 2003-12-26 2005-07-14 Mitsui Mining & Smelting Co Ltd 表面処理金属粉、その表面処理金属粉を用いた導電性ペースト、及びその導電性ペーストを用いて得られるプリント配線板及びチップ部品
JP4706637B2 (ja) * 2004-11-29 2011-06-22 Dic株式会社 導電性ペースト、及び導電性ペーストの製造方法
CN100577328C (zh) * 2004-11-29 2010-01-06 大日本油墨化学工业株式会社 表面处理的含银粉末的制造方法、以及使用表面处理的含银粉末的银糊剂
JP5139659B2 (ja) * 2006-09-27 2013-02-06 Dowaエレクトロニクス株式会社 銀粒子複合粉末およびその製造法
JP2010199034A (ja) * 2009-02-27 2010-09-09 Dic Corp 太陽電池用導電性ペースト及びその製造方法
US8574338B2 (en) * 2010-11-17 2013-11-05 E I Du Pont De Nemours And Company Reactor and continuous process for producing silver powders
KR101554580B1 (ko) * 2011-03-01 2015-09-21 도와 일렉트로닉스 가부시키가이샤 도전용 은코팅 유리분말 및 그 제조 방법, 및 도전성 페이스트
KR20130035014A (ko) * 2011-09-29 2013-04-08 삼성전기주식회사 금속 입자의 제조방법, 이를 이용하여 제조된 잉크 조성물 및 페이스트 조성물
MY185528A (en) * 2011-11-18 2021-05-19 Sumitomo Metal Mining Co Silver powder, method for producing silver powder, and conductive paste
JP6389091B2 (ja) * 2013-10-01 2018-09-12 Dowaエレクトロニクス株式会社 銀被覆銅粉及びその製造方法、並びに導電性ペースト
JP6282616B2 (ja) * 2014-07-30 2018-02-21 Dowaエレクトロニクス株式会社 銀粉およびその製造方法
JP6029720B2 (ja) * 2014-07-31 2016-11-24 Dowaエレクトロニクス株式会社 銀粉及びその製造方法、並びに導電性ペースト
CN107000050B (zh) * 2014-09-29 2019-11-26 同和电子科技有限公司 银粉及其制备方法、以及亲水性导电浆料
KR101733165B1 (ko) * 2015-08-12 2017-05-08 엘에스니꼬동제련 주식회사 고온 소결형 도전성 페이스트용 은 분말의 제조방법

Also Published As

Publication number Publication date
KR20190048316A (ko) 2019-05-09
KR102061720B1 (ko) 2020-01-02
CN111511489B (zh) 2023-04-21
CN111511489A (zh) 2020-08-07
JP2021501266A (ja) 2021-01-14
WO2019088509A1 (fr) 2019-05-09

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