JP2019200912A - 光焼結型組成物及びそれを用いた導電膜の形成方法 - Google Patents
光焼結型組成物及びそれを用いた導電膜の形成方法 Download PDFInfo
- Publication number
- JP2019200912A JP2019200912A JP2018094610A JP2018094610A JP2019200912A JP 2019200912 A JP2019200912 A JP 2019200912A JP 2018094610 A JP2018094610 A JP 2018094610A JP 2018094610 A JP2018094610 A JP 2018094610A JP 2019200912 A JP2019200912 A JP 2019200912A
- Authority
- JP
- Japan
- Prior art keywords
- cuprous oxide
- oxide particles
- copper
- conductive film
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title description 23
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 claims abstract description 92
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 claims abstract description 92
- 229940112669 cuprous oxide Drugs 0.000 claims abstract description 92
- 239000002245 particle Substances 0.000 claims abstract description 87
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000002923 metal particle Substances 0.000 claims abstract description 23
- 239000002904 solvent Substances 0.000 claims abstract description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052718 tin Inorganic materials 0.000 claims abstract description 15
- 229910052742 iron Inorganic materials 0.000 claims abstract description 14
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 11
- 229910052709 silver Inorganic materials 0.000 claims abstract description 10
- 239000004332 silver Substances 0.000 claims abstract description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 7
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims abstract description 5
- 229910052720 vanadium Inorganic materials 0.000 claims abstract description 5
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims description 40
- 239000011248 coating agent Substances 0.000 claims description 38
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 19
- 239000000654 additive Substances 0.000 claims description 18
- 230000000996 additive effect Effects 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 239000011230 binding agent Substances 0.000 claims description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052748 manganese Inorganic materials 0.000 claims description 2
- 239000011572 manganese Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 18
- 238000006243 chemical reaction Methods 0.000 description 20
- 239000011164 primary particle Substances 0.000 description 18
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 17
- 229910001431 copper ion Inorganic materials 0.000 description 17
- -1 iron ions Chemical class 0.000 description 17
- 238000005245 sintering Methods 0.000 description 14
- 239000003638 chemical reducing agent Substances 0.000 description 12
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 11
- 239000005750 Copper hydroxide Substances 0.000 description 11
- 229910001956 copper hydroxide Inorganic materials 0.000 description 11
- 238000006722 reduction reaction Methods 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 239000007864 aqueous solution Substances 0.000 description 10
- 239000002585 base Substances 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- 238000002156 mixing Methods 0.000 description 9
- 239000003513 alkali Substances 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 150000004677 hydrates Chemical class 0.000 description 7
- 150000002500 ions Chemical class 0.000 description 7
- 230000009467 reduction Effects 0.000 description 7
- 229910001432 tin ion Inorganic materials 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- XHCLAFWTIXFWPH-UHFFFAOYSA-N [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] XHCLAFWTIXFWPH-UHFFFAOYSA-N 0.000 description 5
- 238000000635 electron micrograph Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 229910001935 vanadium oxide Inorganic materials 0.000 description 5
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- 239000005751 Copper oxide Substances 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 239000012670 alkaline solution Substances 0.000 description 4
- 229910000431 copper oxide Inorganic materials 0.000 description 4
- 229910001437 manganese ion Inorganic materials 0.000 description 4
- UODXCYZDMHPIJE-UHFFFAOYSA-N menthanol Chemical compound CC1CCC(C(C)(C)O)CC1 UODXCYZDMHPIJE-UHFFFAOYSA-N 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229910001456 vanadium ion Inorganic materials 0.000 description 4
- 229910052724 xenon Inorganic materials 0.000 description 4
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 101000916532 Rattus norvegicus Zinc finger and BTB domain-containing protein 38 Proteins 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000008103 glucose Substances 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000035484 reaction time Effects 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
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- GZNAASVAJNXPPW-UHFFFAOYSA-M tin(4+) chloride dihydrate Chemical compound O.O.[Cl-].[Sn+4] GZNAASVAJNXPPW-UHFFFAOYSA-M 0.000 description 3
- FWPIDFUJEMBDLS-UHFFFAOYSA-L tin(II) chloride dihydrate Substances O.O.Cl[Sn]Cl FWPIDFUJEMBDLS-UHFFFAOYSA-L 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000005749 Copper compound Substances 0.000 description 2
- 229930091371 Fructose Natural products 0.000 description 2
- RFSUNEUAIZKAJO-ARQDHWQXSA-N Fructose Chemical compound OC[C@H]1O[C@](O)(CO)[C@@H](O)[C@@H]1O RFSUNEUAIZKAJO-ARQDHWQXSA-N 0.000 description 2
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- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
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- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 2
- 150000001785 cerium compounds Chemical class 0.000 description 2
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- 150000001880 copper compounds Chemical class 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
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- HKSGQTYSSZOJOA-UHFFFAOYSA-N potassium argentocyanide Chemical compound [K+].[Ag+].N#[C-].N#[C-] HKSGQTYSSZOJOA-UHFFFAOYSA-N 0.000 description 1
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- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
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- 238000007873 sieving Methods 0.000 description 1
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
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- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 description 1
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- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 description 1
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- REYHXKZHIMGNSE-UHFFFAOYSA-M silver monofluoride Chemical compound [F-].[Ag+] REYHXKZHIMGNSE-UHFFFAOYSA-M 0.000 description 1
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- KKKDGYXNGYJJRX-UHFFFAOYSA-M silver nitrite Chemical compound [Ag+].[O-]N=O KKKDGYXNGYJJRX-UHFFFAOYSA-M 0.000 description 1
- FJOLTQXXWSRAIX-UHFFFAOYSA-K silver phosphate Chemical compound [Ag+].[Ag+].[Ag+].[O-]P([O-])([O-])=O FJOLTQXXWSRAIX-UHFFFAOYSA-K 0.000 description 1
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- YPNVIBVEFVRZPJ-UHFFFAOYSA-L silver sulfate Chemical compound [Ag+].[Ag+].[O-]S([O-])(=O)=O YPNVIBVEFVRZPJ-UHFFFAOYSA-L 0.000 description 1
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- RHUVFRWZKMEWNS-UHFFFAOYSA-M silver thiocyanate Chemical compound [Ag+].[S-]C#N RHUVFRWZKMEWNS-UHFFFAOYSA-M 0.000 description 1
- LMEWRZSPCQHBOB-UHFFFAOYSA-M silver;2-hydroxypropanoate Chemical compound [Ag+].CC(O)C([O-])=O LMEWRZSPCQHBOB-UHFFFAOYSA-M 0.000 description 1
- CLDWGXZGFUNWKB-UHFFFAOYSA-M silver;benzoate Chemical compound [Ag+].[O-]C(=O)C1=CC=CC=C1 CLDWGXZGFUNWKB-UHFFFAOYSA-M 0.000 description 1
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- VFWRGKJLLYDFBY-UHFFFAOYSA-N silver;hydrate Chemical compound O.[Ag].[Ag] VFWRGKJLLYDFBY-UHFFFAOYSA-N 0.000 description 1
- DOQQTKLDEQSKIE-UHFFFAOYSA-N silver;isocyanate Chemical compound [Ag+].[N-]=C=O DOQQTKLDEQSKIE-UHFFFAOYSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
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- JVBXVOWTABLYPX-UHFFFAOYSA-L sodium dithionite Chemical compound [Na+].[Na+].[O-]S(=O)S([O-])=O JVBXVOWTABLYPX-UHFFFAOYSA-L 0.000 description 1
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- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- VPKAOUKDMHJLAY-UHFFFAOYSA-J tetrasilver;phosphonato phosphate Chemical compound [Ag+].[Ag+].[Ag+].[Ag+].[O-]P([O-])(=O)OP([O-])([O-])=O VPKAOUKDMHJLAY-UHFFFAOYSA-J 0.000 description 1
- OBBXFSIWZVFYJR-UHFFFAOYSA-L tin(2+);sulfate Chemical compound [Sn+2].[O-]S([O-])(=O)=O OBBXFSIWZVFYJR-UHFFFAOYSA-L 0.000 description 1
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 1
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 1
- KPZSTOVTJYRDIO-UHFFFAOYSA-K trichlorocerium;heptahydrate Chemical compound O.O.O.O.O.O.O.Cl[Ce](Cl)Cl KPZSTOVTJYRDIO-UHFFFAOYSA-K 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- QUTYHQJYVDNJJA-UHFFFAOYSA-K trisilver;2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [Ag+].[Ag+].[Ag+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QUTYHQJYVDNJJA-UHFFFAOYSA-K 0.000 description 1
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- HHLMAPLNEHBVPJ-UHFFFAOYSA-J vanadium(4+) tetraacetate Chemical compound [V+4].CC([O-])=O.CC([O-])=O.CC([O-])=O.CC([O-])=O HHLMAPLNEHBVPJ-UHFFFAOYSA-J 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
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Abstract
Description
また、本発明は、前記光焼結型組成物を基材に塗布して塗膜を形成する工程と、前記塗膜に光を照射することにより前記塗膜中の亜酸化銅粒子を還元する工程とを備えることを特徴とする導電膜の形成方法である。
500mLの反応容器に48質量%の水酸化ナトリウム水溶液25.0g及び純水100.0gを加え、反応容器内を撹拌しながら、反応容器内の温度を40℃に調整して、アルカリ溶液を調製した。
一方、100mLのガラスビーカーに塩化銅(II)二水和物17.3g(0.1モル)、純水80.0g及び2価のスズイオン源としての塩化スズ(II)二水和物0.45g(0.002モル)を加えて、銅イオンと2価のスズイオンとを含有する水溶液を調製した。反応容器内の温度を40℃に維持しつつ、銅イオンと2価のスズイオンとを含有する水溶液を、反応容器に約2分かけて添加した後、10分間攪拌し、水酸化銅を析出させた。
上記で得られた亜酸化銅粒子を用いて光焼結型組成物の調製及び導電膜の形成を行った。
具体的には、表1に示す配合割合で、亜酸化銅粒子、銅粒子、バインダー樹脂及び溶媒を、混練機を用いて大気圧下、30分間1,000rpmで混練してペースト状の光焼結型組成物を調製した。光焼結型組成物をポリイミド基材(東レ・デュポン株式会社製カプトン(登録商標)500H)上にスクリーン印刷により、1mm×20mmの長方形パターンを印刷し、厚さ4μmの塗膜を形成した。塗膜を大気雰囲気下、80℃で10分間乾燥させた。ポリイミド基材上に形成された塗膜に、キセノンパルス光照射装置(ゼノン・コーポレーション製S−2300)を用いてパルス光を1パルス照射(電圧:2,700V、パルス幅:2,500マイクロ秒)して導電膜を形成した。
低抵抗率計(株式会社三菱化学アナリテック製ロレスタ(登録商標)−GPMCP−T600)を用いて室温における導電膜の体積抵抗率を測定した。また、形成された導電膜を目視で観察し、塗膜の飛散が見られず均一な導電膜が形成されているものを均一性「良好」と判断し、塗膜の飛散が見られるものを均一性「不良」と判断した。更に、形成された導電膜にテープを貼り付けた後、テープを剥離し、テープの粘着面に導電膜が付着しておらず且つポリイミド基材上に形成された導電膜がそのまま残存しているものを密着性「良好」と判断し、剥離したテープの粘着面に導電膜が付着しているものを密着性「不良」と判断した。結果を表2に示す。
表1に示すように光焼結型組成物の配合割合を変更したこと以外は実施例1と同様にして導電膜を形成した。導電膜の評価結果を表2に示す。
表1に示すように光焼結型組成物の配合割合を変更したこと以外は実施例1と同様にして導電膜を形成した。導電膜の評価結果を表2に示す。
表1に示すように光焼結型組成物の配合割合を変更したこと以外は実施例1と同様にして導電膜を形成した。導電膜の評価結果を表2に示す。
上記したスズ含有亜酸化銅粒子の作製において、塩化スズ(II)二水和物0.45g(0.002モル)の代わりに塩化セリウム(III)7水和物0.745g(0.002モル)を用いて亜酸化銅粒子を作製した。この亜酸化銅粒子の平均一次粒子径は270nmであり、セリウムの含有量は21000ppmであった。スズ含有亜酸化銅粒子の代わりにセリウム含有亜酸化銅粒子を用いたこと以外は実施例1と同様にして導電膜を形成した。導電膜の評価結果を表2に示す。
上記したスズ含有亜酸化銅粒子の作製において、塩化スズ(II)二水和物0.45g(0.002モル)の代わりに硫酸鉄(II)7水和物0.695g(0.0025モル)を用いて亜酸化銅粒子を作製した。この亜酸化銅粒子の平均一次粒子径は100nmであり、鉄の含有量は1380ppmであった。スズ含有亜酸化銅粒子の代わりに鉄含有亜酸化銅粒子を用いたこと以外は実施例1と同様にして導電膜を形成した。導電膜の評価結果を表2に示す。
表1に示すように光焼結型組成物の配合割合を変更したこと以外は実施例1と同様にして導電膜を形成した。導電膜の評価結果を表2に示す。
表1に示すように光焼結型組成物の配合割合を変更したこと以外は実施例1と同様にして導電膜を形成しようとしたところ、塗膜の飛散が生じた。
金属粒子:銅粒子(三井金属鉱業株式会社製1100YP、D50=1.2μm)
バインダー樹脂:アクリル樹脂(共栄社化学株式会社製オリコックスKC1100)
溶媒:α−,β−,γ−テルピネオールの異性体混合物
Claims (7)
- スズ、マンガン、バナジウム、セリウム、鉄及び銀からなる群から選択される少なくとも1種の添加元素を含有する亜酸化銅粒子と、20℃における体積抵抗率が1.0×10−3Ω・cm以下である金属粒子と、溶媒とを含むことを特徴とする光焼結型組成物。
- 前記金属粒子が、金、銀、銅、亜鉛、スズ、アルミニウム、ニッケル、コバルト及びマンガンからなる群から選択される少なくとも1種の金属粒子であることを特徴とする請求項1に記載の光焼結型組成物。
- 前記添加元素がスズであり且つその含有量が1ppm〜30000ppmであることを特徴とする請求項1又は2に記載の光焼結型組成物。
- バインダー樹脂を更に含むことを特徴とする請求項1〜3のいずれか一項に記載の光焼結型組成物。
- 前記亜酸化銅粒子と前記金属粒子とを合計で10質量%〜90質量%且つ前記溶媒を10質量%〜90質量%含むことを特徴とする請求項1〜3のいずれか一項に記載の光焼結型組成物。
- 前記亜酸化銅粒子と前記金属粒子とを合計で10質量%〜90質量%且つ前記溶媒と前記バインダー樹脂とを合計で10質量%〜90質量%含むことを特徴とする請求項4に記載の光焼結型組成物。
- 請求項1〜6のいずれか一項に記載の光焼結型組成物を基材に塗布して塗膜を形成する工程と、
前記塗膜に光を照射することにより前記塗膜中の亜酸化銅粒子を還元する工程と
を備えることを特徴とする導電膜の形成方法。
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