JP6975630B2 - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

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Publication number
JP6975630B2
JP6975630B2 JP2017242942A JP2017242942A JP6975630B2 JP 6975630 B2 JP6975630 B2 JP 6975630B2 JP 2017242942 A JP2017242942 A JP 2017242942A JP 2017242942 A JP2017242942 A JP 2017242942A JP 6975630 B2 JP6975630 B2 JP 6975630B2
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Japan
Prior art keywords
liquid
valve
treatment liquid
pipe
nozzle
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Active
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JP2017242942A
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English (en)
Japanese (ja)
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JP2018142694A5 (enExample
JP2018142694A (ja
Inventor
仁司 中井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to KR1020197022463A priority Critical patent/KR102226378B1/ko
Priority to PCT/JP2018/002151 priority patent/WO2018155054A1/ja
Priority to CN201880009209.0A priority patent/CN110235226B/zh
Priority to TW107102925A priority patent/TWI661871B/zh
Publication of JP2018142694A publication Critical patent/JP2018142694A/ja
Publication of JP2018142694A5 publication Critical patent/JP2018142694A5/ja
Application granted granted Critical
Publication of JP6975630B2 publication Critical patent/JP6975630B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02343—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2017242942A 2017-02-27 2017-12-19 基板処理装置および基板処理方法 Active JP6975630B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020197022463A KR102226378B1 (ko) 2017-02-27 2018-01-24 기판 처리 장치 및 기판 처리 방법
PCT/JP2018/002151 WO2018155054A1 (ja) 2017-02-27 2018-01-24 基板処理装置および基板処理方法
CN201880009209.0A CN110235226B (zh) 2017-02-27 2018-01-24 基板处理装置以及基板处理方法
TW107102925A TWI661871B (zh) 2017-02-27 2018-01-26 基板處理裝置以及基板處理方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017035048 2017-02-27
JP2017035048 2017-02-27

Publications (3)

Publication Number Publication Date
JP2018142694A JP2018142694A (ja) 2018-09-13
JP2018142694A5 JP2018142694A5 (enExample) 2021-07-26
JP6975630B2 true JP6975630B2 (ja) 2021-12-01

Family

ID=63528274

Family Applications (1)

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JP2017242942A Active JP6975630B2 (ja) 2017-02-27 2017-12-19 基板処理装置および基板処理方法

Country Status (4)

Country Link
JP (1) JP6975630B2 (enExample)
KR (1) KR102226378B1 (enExample)
CN (1) CN110235226B (enExample)
TW (1) TWI661871B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110534452B (zh) * 2018-11-08 2022-06-14 北京北方华创微电子装备有限公司 用于清洗工艺腔室的漏液监控装置及清洗工艺腔室
JP7364460B2 (ja) 2019-12-25 2023-10-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7509657B2 (ja) 2020-10-29 2024-07-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI762072B (zh) * 2020-12-08 2022-04-21 力晶積成電子製造股份有限公司 晶圓清洗機台
DE102021100754A1 (de) * 2021-01-15 2022-07-21 Marco Systemanalyse Und Entwicklung Gmbh Dosierventil
JP2024158822A (ja) * 2023-04-28 2024-11-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2010521C3 (de) 1969-03-11 1974-05-09 Snam Progetti S.P.A., Mailand (Italien) Vorrichtung zur gleichzeitigen und quantitativen Bestimmung der Detonation und Frühzündung
JPH0770507B2 (ja) * 1989-07-05 1995-07-31 三菱電機株式会社 半導体ウエハ用洗浄装置
JP3577580B2 (ja) * 1998-03-17 2004-10-13 東京エレクトロン株式会社 空気駆動式液体供給装置
JP3730079B2 (ja) * 2000-03-21 2005-12-21 大日本スクリーン製造株式会社 基板処理装置
CN101436001B (zh) * 2003-07-28 2012-04-11 株式会社尼康 曝光装置、器件制造方法
JP2006156672A (ja) * 2004-11-29 2006-06-15 Dainippon Screen Mfg Co Ltd 基板処理装置
JP5073310B2 (ja) * 2007-02-13 2012-11-14 武蔵エンジニアリング株式会社 漏液検知機構およびそれを備えた液体材料塗布装置
JP5030767B2 (ja) * 2007-12-25 2012-09-19 大日本スクリーン製造株式会社 基板処理装置、および基板処理装置の異常処理方法
KR20100046784A (ko) * 2008-10-28 2010-05-07 세메스 주식회사 기판 처리 장치 및 방법
CN103295938B (zh) * 2013-05-29 2017-10-10 上海华虹宏力半导体制造有限公司 半导体处理设备
JP6059087B2 (ja) * 2013-05-31 2017-01-11 東京エレクトロン株式会社 液処理装置、液処理方法および記憶媒体
CN109037111B (zh) * 2015-02-25 2022-03-22 株式会社思可林集团 基板处理装置
JP6534578B2 (ja) * 2015-08-03 2019-06-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6624599B2 (ja) * 2015-08-05 2019-12-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および処理液吐出方法

Also Published As

Publication number Publication date
TW201834754A (zh) 2018-10-01
CN110235226B (zh) 2022-12-23
KR102226378B1 (ko) 2021-03-10
CN110235226A (zh) 2019-09-13
KR20190100368A (ko) 2019-08-28
TWI661871B (zh) 2019-06-11
JP2018142694A (ja) 2018-09-13

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