JP6964345B2 - 発光素子パッケージ及び光源装置 - Google Patents

発光素子パッケージ及び光源装置 Download PDF

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JP6964345B2
JP6964345B2 JP2018531510A JP2018531510A JP6964345B2 JP 6964345 B2 JP6964345 B2 JP 6964345B2 JP 2018531510 A JP2018531510 A JP 2018531510A JP 2018531510 A JP2018531510 A JP 2018531510A JP 6964345 B2 JP6964345 B2 JP 6964345B2
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light emitting
hole
emitting element
electrode
main body
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Expired - Fee Related
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JP2018531510A
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Japanese (ja)
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JP2020522117A (ja
JP2020522117A5 (enExample
Inventor
イ，テソン
イム，チャンマン
ソン，ジュンオ
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スージョウ レキン セミコンダクター カンパニー リミテッド
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Priority claimed from PCT/KR2017/011077 external-priority patent/WO2018221789A1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/835—Reflective materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/032—Manufacture or treatment of electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections

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JP2018531510A 2017-05-30 2017-09-29 発光素子パッケージ及び光源装置 Expired - Fee Related JP6964345B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR20170067187 2017-05-30
KR10-2017-0067187 2017-05-30
KR10-2017-0082348 2017-06-29
KR1020170082348A KR102356216B1 (ko) 2017-05-30 2017-06-29 발광소자 패키지 및 광원 장치
PCT/KR2017/011077 WO2018221789A1 (ko) 2017-05-30 2017-09-29 발광소자 패키지 및 광원 장치

Publications (3)

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JP2020522117A JP2020522117A (ja) 2020-07-27
JP2020522117A5 JP2020522117A5 (enExample) 2020-11-12
JP6964345B2 true JP6964345B2 (ja) 2021-11-10

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JP2018531510A Expired - Fee Related JP6964345B2 (ja) 2017-05-30 2017-09-29 発光素子パッケージ及び光源装置

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US (1) US11038087B2 (enExample)
EP (1) EP3439049B1 (enExample)
JP (1) JP6964345B2 (enExample)
KR (2) KR102356216B1 (enExample)
CN (2) CN109328400B (enExample)

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DE102018123031A1 (de) * 2018-09-19 2020-03-19 Osram Opto Semiconductors Gmbh Bauelement und herstellungsverfahren für ein bauelement
KR102382253B1 (ko) 2018-10-30 2022-04-01 주식회사 엘지에너지솔루션 메인 스위치를 위한 드라이버 회로 및 그것을 포함하는 제어 장치
JP7227478B2 (ja) * 2019-03-20 2023-02-22 日亜化学工業株式会社 樹脂パッケージおよび発光装置
JP7248803B2 (ja) * 2019-08-28 2023-03-29 京セラ株式会社 発光素子搭載用パッケージおよび発光装置
WO2021246389A1 (ja) * 2020-06-03 2021-12-09 日亜化学工業株式会社 面状光源及びその製造方法
JP7277865B2 (ja) * 2020-10-29 2023-05-19 日亜化学工業株式会社 面状光源及びその製造方法
DE102022126374A1 (de) * 2022-10-11 2024-04-11 Ams-Osram International Gmbh Verfahren zum herstellen eines bauelements und bauelement

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WO2000033374A1 (fr) * 1998-12-02 2000-06-08 Seiko Epson Corporation Couche conductrice anisotrope, puce a semi-conducteur et procede de conditionnement
JP4077170B2 (ja) * 2000-09-21 2008-04-16 シャープ株式会社 半導体発光装置
KR101366268B1 (ko) * 2007-07-16 2014-02-21 엘지전자 주식회사 발광 소자 패키지와 서브마운트 및 그 제조방법
KR101265642B1 (ko) 2007-07-23 2013-05-22 엘지전자 주식회사 발광 소자 패키지 및 그 제조방법
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JP2011181699A (ja) * 2010-03-01 2011-09-15 Seiko Instruments Inc 発光デバイス
JP2011192845A (ja) * 2010-03-15 2011-09-29 Seiko Instruments Inc 発光部品、発光器及び発光部品の製造方法
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KR101020963B1 (ko) 2010-04-23 2011-03-09 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지
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KR101591991B1 (ko) * 2010-12-02 2016-02-05 삼성전자주식회사 발광소자 패키지 및 그 제조 방법
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KR101997247B1 (ko) * 2012-11-14 2019-07-08 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 장치
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KR102031967B1 (ko) * 2013-05-07 2019-10-14 엘지이노텍 주식회사 발광 소자 패키지
KR102098245B1 (ko) 2014-02-11 2020-04-07 삼성전자 주식회사 광원 패키지 및 그를 포함하는 표시 장치
JP6407544B2 (ja) * 2014-03-28 2018-10-17 シチズン電子株式会社 Ｌｅｄ発光装置及びｌｅｄ発光装置の製造方法
KR102199991B1 (ko) * 2014-05-28 2021-01-11 엘지이노텍 주식회사 발광 소자 및 이를 구비한 라이트 유닛
KR102407329B1 (ko) 2015-08-05 2022-06-13 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 광원 모듈 및 이를 구비한 조명 장치

Also Published As

Publication number Publication date
CN109328400A (zh) 2019-02-12
US20200274042A1 (en) 2020-08-27
CN116169221A (zh) 2023-05-26
KR20180131336A (ko) 2018-12-10
KR102356216B1 (ko) 2022-01-28
US11038087B2 (en) 2021-06-15
EP3439049A1 (en) 2019-02-06
JP2020522117A (ja) 2020-07-27
EP3439049B1 (en) 2022-08-10
KR102437770B1 (ko) 2022-08-30
KR20180131303A (ko) 2018-12-10
CN109328400B (zh) 2023-04-04
EP3439049A4 (en) 2019-06-19

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