KR102356216B1 - 발광소자 패키지 및 광원 장치 - Google Patents

발광소자 패키지 및 광원 장치 Download PDF

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Publication number
KR102356216B1
KR102356216B1 KR1020170082348A KR20170082348A KR102356216B1 KR 102356216 B1 KR102356216 B1 KR 102356216B1 KR 1020170082348 A KR1020170082348 A KR 1020170082348A KR 20170082348 A KR20170082348 A KR 20170082348A KR 102356216 B1 KR102356216 B1 KR 102356216B1
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South Korea
Prior art keywords
light emitting
emitting device
electrode
hole
disposed
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Expired - Fee Related
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KR1020170082348A
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English (en)
Korean (ko)
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KR20180131303A (ko
Inventor
이태성
송준오
임창만
Original Assignee
쑤저우 레킨 세미컨덕터 컴퍼니 리미티드
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Priority to CN201780033280.8A priority Critical patent/CN109328400B/zh
Priority to EP17882276.3A priority patent/EP3439049B1/en
Priority to CN202310261116.XA priority patent/CN116169221A/zh
Priority to JP2018531510A priority patent/JP6964345B2/ja
Priority to US16/067,484 priority patent/US11038087B2/en
Priority to PCT/KR2017/011077 priority patent/WO2018221789A1/ko
Publication of KR20180131303A publication Critical patent/KR20180131303A/ko
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Publication of KR102356216B1 publication Critical patent/KR102356216B1/ko
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    • H01L33/20—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H01L33/36—
    • H01L33/486—
    • H01L33/62—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/835—Reflective materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/032—Manufacture or treatment of electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections

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KR1020170082348A 2017-05-30 2017-06-29 발광소자 패키지 및 광원 장치 Expired - Fee Related KR102356216B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN201780033280.8A CN109328400B (zh) 2017-05-30 2017-09-29 发光器件封装和光源设备
EP17882276.3A EP3439049B1 (en) 2017-05-30 2017-09-29 Light-emitting device package
CN202310261116.XA CN116169221A (zh) 2017-05-30 2017-09-29 发光器件封装和光源设备
JP2018531510A JP6964345B2 (ja) 2017-05-30 2017-09-29 発光素子パッケージ及び光源装置
US16/067,484 US11038087B2 (en) 2017-05-30 2017-09-29 Light emitting device package and light source apparatus
PCT/KR2017/011077 WO2018221789A1 (ko) 2017-05-30 2017-09-29 발광소자 패키지 및 광원 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20170067187 2017-05-30
KR1020170067187 2017-05-30

Publications (2)

Publication Number Publication Date
KR20180131303A KR20180131303A (ko) 2018-12-10
KR102356216B1 true KR102356216B1 (ko) 2022-01-28

Family

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KR1020170082348A Expired - Fee Related KR102356216B1 (ko) 2017-05-30 2017-06-29 발광소자 패키지 및 광원 장치
KR1020170153786A Active KR102437770B1 (ko) 2017-05-30 2017-11-17 발광소자 패키지 및 광원 장치

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Country Link
US (1) US11038087B2 (enExample)
EP (1) EP3439049B1 (enExample)
JP (1) JP6964345B2 (enExample)
KR (2) KR102356216B1 (enExample)
CN (2) CN116169221A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019045506A1 (ko) * 2017-09-01 2019-03-07 엘지이노텍 주식회사 발광소자 패키지 및 광원 장치
DE102018123031A1 (de) * 2018-09-19 2020-03-19 Osram Opto Semiconductors Gmbh Bauelement und herstellungsverfahren für ein bauelement
KR102382253B1 (ko) 2018-10-30 2022-04-01 주식회사 엘지에너지솔루션 메인 스위치를 위한 드라이버 회로 및 그것을 포함하는 제어 장치
JP7227478B2 (ja) * 2019-03-20 2023-02-22 日亜化学工業株式会社 樹脂パッケージおよび発光装置
JP7248803B2 (ja) * 2019-08-28 2023-03-29 京セラ株式会社 発光素子搭載用パッケージおよび発光装置
KR20230019404A (ko) * 2020-06-03 2023-02-08 니치아 카가쿠 고교 가부시키가이샤 면상 광원 및 그 제조 방법
JP7277865B2 (ja) * 2020-10-29 2023-05-19 日亜化学工業株式会社 面状光源及びその製造方法
DE102022126374A1 (de) * 2022-10-11 2024-04-11 Ams-Osram International Gmbh Verfahren zum herstellen eines bauelements und bauelement

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014158028A (ja) * 2013-02-18 2014-08-28 Lextar Electronics Corp 発光ダイオードのサブマウント及びそれを用いる発光装置の製造方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3618551B2 (ja) * 1998-06-30 2005-02-09 株式会社東芝 光半導体モジュール
CN1155997C (zh) * 1998-12-02 2004-06-30 精工爱普生株式会社 各向异性导电膜、半导体芯片的安装方法和半导体装置
JP4077170B2 (ja) * 2000-09-21 2008-04-16 シャープ株式会社 半導体発光装置
KR101366268B1 (ko) * 2007-07-16 2014-02-21 엘지전자 주식회사 발광 소자 패키지와 서브마운트 및 그 제조방법
KR101265642B1 (ko) 2007-07-23 2013-05-22 엘지전자 주식회사 발광 소자 패키지 및 그 제조방법
KR101144202B1 (ko) 2009-11-02 2012-05-10 삼성전기주식회사 엘이디 내장형 인쇄회로기판
JP2011181699A (ja) * 2010-03-01 2011-09-15 Seiko Instruments Inc 発光デバイス
JP2011192845A (ja) * 2010-03-15 2011-09-29 Seiko Instruments Inc 発光部品、発光器及び発光部品の製造方法
KR20110111173A (ko) 2010-04-02 2011-10-10 김경동 Ｌｅｄ 조명용 리드 프레임 및 그 제조방법
KR101020963B1 (ko) 2010-04-23 2011-03-09 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지
JP5426481B2 (ja) * 2010-05-26 2014-02-26 株式会社東芝 発光装置
JP5618189B2 (ja) * 2010-07-30 2014-11-05 大日本印刷株式会社 樹脂付リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法
KR101591991B1 (ko) * 2010-12-02 2016-02-05 삼성전자주식회사 발광소자 패키지 및 그 제조 방법
TWI435484B (zh) * 2011-04-07 2014-04-21 矽品精密工業股份有限公司 發光二極體封裝結構
JP5835133B2 (ja) * 2012-07-10 2015-12-24 豊田合成株式会社 Ｌｅｄ搭載用基板及びその製造方法
JP5994472B2 (ja) * 2012-08-09 2016-09-21 日亜化学工業株式会社 発光装置
KR101997247B1 (ko) * 2012-11-14 2019-07-08 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 장치
KR101353392B1 (ko) * 2013-02-07 2014-01-21 (주)포인트엔지니어링 광 디바이스 및 그 제조방법
CN103199187B (zh) * 2013-04-19 2015-11-25 安徽三安光电有限公司 一种发光二极管封装基板与封装结构及其制作方法
KR102031967B1 (ko) * 2013-05-07 2019-10-14 엘지이노텍 주식회사 발광 소자 패키지
KR102098245B1 (ko) 2014-02-11 2020-04-07 삼성전자 주식회사 광원 패키지 및 그를 포함하는 표시 장치
JP6407544B2 (ja) * 2014-03-28 2018-10-17 シチズン電子株式会社 Ｌｅｄ発光装置及びｌｅｄ発光装置の製造方法
KR102199991B1 (ko) * 2014-05-28 2021-01-11 엘지이노텍 주식회사 발광 소자 및 이를 구비한 라이트 유닛
KR102407329B1 (ko) 2015-08-05 2022-06-13 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 광원 모듈 및 이를 구비한 조명 장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014158028A (ja) * 2013-02-18 2014-08-28 Lextar Electronics Corp 発光ダイオードのサブマウント及びそれを用いる発光装置の製造方法

Also Published As

Publication number Publication date
US20200274042A1 (en) 2020-08-27
EP3439049A4 (en) 2019-06-19
KR102437770B1 (ko) 2022-08-30
EP3439049B1 (en) 2022-08-10
CN116169221A (zh) 2023-05-26
EP3439049A1 (en) 2019-02-06
JP2020522117A (ja) 2020-07-27
CN109328400B (zh) 2023-04-04
KR20180131303A (ko) 2018-12-10
KR20180131336A (ko) 2018-12-10
CN109328400A (zh) 2019-02-12
US11038087B2 (en) 2021-06-15
JP6964345B2 (ja) 2021-11-10

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