CN116169221A - 发光器件封装和光源设备 - Google Patents

发光器件封装和光源设备 Download PDF

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Publication number
CN116169221A
CN116169221A CN202310261116.XA CN202310261116A CN116169221A CN 116169221 A CN116169221 A CN 116169221A CN 202310261116 A CN202310261116 A CN 202310261116A CN 116169221 A CN116169221 A CN 116169221A
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CN
China
Prior art keywords
light emitting
emitting device
electrode
disposed
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310261116.XA
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English (en)
Chinese (zh)
Inventor
李太星
任仓满
宋俊午
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Liyu Semiconductor Co ltd
Original Assignee
Suzhou Liyu Semiconductor Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Liyu Semiconductor Co ltd filed Critical Suzhou Liyu Semiconductor Co ltd
Priority claimed from PCT/KR2017/011077 external-priority patent/WO2018221789A1/ko
Publication of CN116169221A publication Critical patent/CN116169221A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/835—Reflective materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/032—Manufacture or treatment of electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections

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  • Led Device Packages (AREA)
CN202310261116.XA 2017-05-30 2017-09-29 发光器件封装和光源设备 Pending CN116169221A (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR20170067187 2017-05-30
KR10-2017-0067187 2017-05-30
KR10-2017-0082348 2017-06-29
KR1020170082348A KR102356216B1 (ko) 2017-05-30 2017-06-29 발광소자 패키지 및 광원 장치
PCT/KR2017/011077 WO2018221789A1 (ko) 2017-05-30 2017-09-29 발광소자 패키지 및 광원 장치
CN201780033280.8A CN109328400B (zh) 2017-05-30 2017-09-29 发光器件封装和光源设备

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201780033280.8A Division CN109328400B (zh) 2017-05-30 2017-09-29 发光器件封装和光源设备

Publications (1)

Publication Number Publication Date
CN116169221A true CN116169221A (zh) 2023-05-26

Family

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Family Applications (2)

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CN201780033280.8A Active CN109328400B (zh) 2017-05-30 2017-09-29 发光器件封装和光源设备
CN202310261116.XA Pending CN116169221A (zh) 2017-05-30 2017-09-29 发光器件封装和光源设备

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Country Status (5)

Country Link
US (1) US11038087B2 (enExample)
EP (1) EP3439049B1 (enExample)
JP (1) JP6964345B2 (enExample)
KR (2) KR102356216B1 (enExample)
CN (2) CN109328400B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019045506A1 (ko) * 2017-09-01 2019-03-07 엘지이노텍 주식회사 발광소자 패키지 및 광원 장치
DE102018123031A1 (de) * 2018-09-19 2020-03-19 Osram Opto Semiconductors Gmbh Bauelement und herstellungsverfahren für ein bauelement
KR102382253B1 (ko) 2018-10-30 2022-04-01 주식회사 엘지에너지솔루션 메인 스위치를 위한 드라이버 회로 및 그것을 포함하는 제어 장치
JP7227478B2 (ja) * 2019-03-20 2023-02-22 日亜化学工業株式会社 樹脂パッケージおよび発光装置
JP7248803B2 (ja) * 2019-08-28 2023-03-29 京セラ株式会社 発光素子搭載用パッケージおよび発光装置
WO2021246389A1 (ja) * 2020-06-03 2021-12-09 日亜化学工業株式会社 面状光源及びその製造方法
JP7277865B2 (ja) * 2020-10-29 2023-05-19 日亜化学工業株式会社 面状光源及びその製造方法
DE102022126374A1 (de) * 2022-10-11 2024-04-11 Ams-Osram International Gmbh Verfahren zum herstellen eines bauelements und bauelement

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090008036A (ko) * 2007-07-16 2009-01-21 엘지전자 주식회사 발광 소자 패키지와 서브마운트 및 그 제조방법
US20120138988A1 (en) * 2010-12-02 2012-06-07 Sang Hyun Lee Light emitting device package and manufacturing method thereof
CN102738356A (zh) * 2011-04-07 2012-10-17 矽品精密工业股份有限公司 发光二极管封装结构
KR20140061797A (ko) * 2012-11-14 2014-05-22 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 장치
US20140231858A1 (en) * 2013-02-18 2014-08-21 Lextar Electronics Corporation LED Sub-Mount and Method for Manufacturing Light Emitting Device Using the Sub-Mount
KR20150136814A (ko) * 2014-05-28 2015-12-08 엘지이노텍 주식회사 발광 소자 및 이를 구비한 라이트 유닛
US20150372209A1 (en) * 2013-02-07 2015-12-24 Point Engineering Co., Ltd. Optical device and method for manufacturing same

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3618551B2 (ja) * 1998-06-30 2005-02-09 株式会社東芝 光半導体モジュール
WO2000033374A1 (fr) * 1998-12-02 2000-06-08 Seiko Epson Corporation Couche conductrice anisotrope, puce a semi-conducteur et procede de conditionnement
JP4077170B2 (ja) * 2000-09-21 2008-04-16 シャープ株式会社 半導体発光装置
KR101265642B1 (ko) 2007-07-23 2013-05-22 엘지전자 주식회사 발광 소자 패키지 및 그 제조방법
KR101144202B1 (ko) 2009-11-02 2012-05-10 삼성전기주식회사 엘이디 내장형 인쇄회로기판
JP2011181699A (ja) * 2010-03-01 2011-09-15 Seiko Instruments Inc 発光デバイス
JP2011192845A (ja) * 2010-03-15 2011-09-29 Seiko Instruments Inc 発光部品、発光器及び発光部品の製造方法
KR20110111173A (ko) 2010-04-02 2011-10-10 김경동 Ｌｅｄ 조명용 리드 프레임 및 그 제조방법
KR101020963B1 (ko) 2010-04-23 2011-03-09 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지
JP5426481B2 (ja) * 2010-05-26 2014-02-26 株式会社東芝 発光装置
JP5618189B2 (ja) * 2010-07-30 2014-11-05 大日本印刷株式会社 樹脂付リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法
JP5835133B2 (ja) * 2012-07-10 2015-12-24 豊田合成株式会社 Ｌｅｄ搭載用基板及びその製造方法
JP5994472B2 (ja) * 2012-08-09 2016-09-21 日亜化学工業株式会社 発光装置
CN103199187B (zh) * 2013-04-19 2015-11-25 安徽三安光电有限公司 一种发光二极管封装基板与封装结构及其制作方法
KR102031967B1 (ko) * 2013-05-07 2019-10-14 엘지이노텍 주식회사 발광 소자 패키지
KR102098245B1 (ko) 2014-02-11 2020-04-07 삼성전자 주식회사 광원 패키지 및 그를 포함하는 표시 장치
JP6407544B2 (ja) * 2014-03-28 2018-10-17 シチズン電子株式会社 Ｌｅｄ発光装置及びｌｅｄ発光装置の製造方法
KR102407329B1 (ko) 2015-08-05 2022-06-13 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 광원 모듈 및 이를 구비한 조명 장치

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090008036A (ko) * 2007-07-16 2009-01-21 엘지전자 주식회사 발광 소자 패키지와 서브마운트 및 그 제조방법
US20120138988A1 (en) * 2010-12-02 2012-06-07 Sang Hyun Lee Light emitting device package and manufacturing method thereof
CN102738356A (zh) * 2011-04-07 2012-10-17 矽品精密工业股份有限公司 发光二极管封装结构
KR20140061797A (ko) * 2012-11-14 2014-05-22 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 장치
US20150372209A1 (en) * 2013-02-07 2015-12-24 Point Engineering Co., Ltd. Optical device and method for manufacturing same
US20140231858A1 (en) * 2013-02-18 2014-08-21 Lextar Electronics Corporation LED Sub-Mount and Method for Manufacturing Light Emitting Device Using the Sub-Mount
KR20150136814A (ko) * 2014-05-28 2015-12-08 엘지이노텍 주식회사 발광 소자 및 이를 구비한 라이트 유닛

Also Published As

Publication number Publication date
CN109328400A (zh) 2019-02-12
US20200274042A1 (en) 2020-08-27
KR20180131336A (ko) 2018-12-10
KR102356216B1 (ko) 2022-01-28
US11038087B2 (en) 2021-06-15
EP3439049A1 (en) 2019-02-06
JP2020522117A (ja) 2020-07-27
JP6964345B2 (ja) 2021-11-10
EP3439049B1 (en) 2022-08-10
KR102437770B1 (ko) 2022-08-30
KR20180131303A (ko) 2018-12-10
CN109328400B (zh) 2023-04-04
EP3439049A4 (en) 2019-06-19

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