JP6956501B2 - フレキシブル基板の製造方法 - Google Patents

フレキシブル基板の製造方法 Download PDF

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Publication number
JP6956501B2
JP6956501B2 JP2017071689A JP2017071689A JP6956501B2 JP 6956501 B2 JP6956501 B2 JP 6956501B2 JP 2017071689 A JP2017071689 A JP 2017071689A JP 2017071689 A JP2017071689 A JP 2017071689A JP 6956501 B2 JP6956501 B2 JP 6956501B2
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Japan
Prior art keywords
support
polyimide
resin
general formula
resin layer
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JP2017071689A
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Japanese (ja)
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JP2017185807A (ja
Inventor
裕明 山田
王　宏遠
平石　克文
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Nippon Steel Chemical and Materials Co Ltd
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Nippon Steel Chemical and Materials Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D7/00—Producing flat articles, e.g. films or sheets
    • B29D7/01—Films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Mathematical Physics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Moulding By Coating Moulds (AREA)
  • Liquid Crystal (AREA)
JP2017071689A 2016-03-31 2017-03-31 フレキシブル基板の製造方法 Active JP6956501B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016073606 2016-03-31
JP2016073606 2016-03-31

Publications (2)

Publication Number Publication Date
JP2017185807A JP2017185807A (ja) 2017-10-12
JP6956501B2 true JP6956501B2 (ja) 2021-11-02

Family

ID=60046069

Family Applications (1)

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JP2017071689A Active JP6956501B2 (ja) 2016-03-31 2017-03-31 フレキシブル基板の製造方法

Country Status (4)

Country Link
JP (1) JP6956501B2 (ko)
KR (1) KR102358122B1 (ko)
CN (1) CN107263892B (ko)
TW (1) TWI765882B (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109476951B (zh) * 2016-08-03 2022-07-29 日产化学株式会社 剥离层形成用组合物和剥离层
JP7079076B2 (ja) * 2016-08-10 2022-06-01 日鉄ケミカル＆マテリアル株式会社 ポリイミド前駆体及びそれから生じるポリイミド
CN107994134B (zh) * 2017-11-09 2020-01-03 武汉华星光电半导体显示技术有限公司 一种柔性基板及其制备方法
CN107994129B (zh) 2017-11-20 2019-11-22 武汉华星光电半导体显示技术有限公司 柔性oled显示面板的制备方法
JP7016258B2 (ja) * 2017-12-28 2022-02-04 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルムの製造方法及びガラス－ポリイミド積層体
CN108807671A (zh) * 2018-08-02 2018-11-13 昆山国显光电有限公司 柔性显示屏的制备方法及制备柔性显示屏用复合基板
JP7217220B2 (ja) * 2018-12-28 2023-02-02 日鉄ケミカル＆マテリアル株式会社 ポリイミド前駆体組成物及びそれから生じるポリイミドフィルム及びフレキシブルデバイス、ポリイミドフィルムの製造方法
JP7265864B2 (ja) * 2018-12-28 2023-04-27 日鉄ケミカル＆マテリアル株式会社 ポリイミド前駆体及びポリイミド
JP7349253B2 (ja) 2019-03-29 2023-09-22 株式会社カネカ ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびフレキシブルデバイス、ならびにポリイミド膜の製造方法。
JP2021002622A (ja) 2019-06-24 2021-01-07 Ａｇｃ株式会社 電子デバイスの製造方法
JP7092247B1 (ja) 2021-09-24 2022-06-28 Ａｇｃ株式会社 積層体、及び積層体の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI313062B (en) * 2002-09-13 2009-08-01 Ind Tech Res Inst Method for producing active plastic panel displayers
GB0327093D0 (en) 2003-11-21 2003-12-24 Koninkl Philips Electronics Nv Active matrix displays and other electronic devices having plastic substrates
JP2008231327A (ja) 2007-03-22 2008-10-02 Ihara Chem Ind Co Ltd 高透明性を有するポリイミドおよびその製造方法
TWI354854B (en) 2008-09-15 2011-12-21 Ind Tech Res Inst Substrate structures applied in flexible electrica
CN104380366B (zh) * 2012-06-19 2017-09-08 新日铁住金化学株式会社 显示装置及其制造方法、以及显示装置支撑基材用聚酰亚胺膜及其制造方法
TWI664087B (zh) 2012-09-27 2019-07-01 日商日鐵化學材料股份有限公司 顯示裝置之製造方法
KR102020812B1 (ko) * 2013-06-17 2019-09-11 도레이 카부시키가이샤 적층 수지 블랙 매트릭스 기판의 제조 방법
JP5773090B1 (ja) * 2013-09-27 2015-09-02 東レ株式会社 ポリイミド前駆体、それから得られるポリイミド樹脂膜、ならびにそれを含む表示素子、光学素子、受光素子、タッチパネル、回路基板、有機ｅｌディスプレイ、および、有機ｅｌ素子ならびにカラーフィルタの製造方法
JP6354338B2 (ja) * 2014-05-30 2018-07-11 東レ株式会社 積層体、積層体の製造方法、及びこれを用いたフレキシブルデバイスの製造方法
KR102139455B1 (ko) * 2014-06-25 2020-07-30 아사히 가세이 가부시키가이샤 공극을 갖는 폴리이미드 필름 및 그 제조 방법
CN111808420B (zh) 2014-07-17 2021-09-28 旭化成株式会社 树脂前体及含有其的树脂组合物、聚酰亚胺树脂膜、树脂薄膜及其制造方法

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Publication number Publication date
TWI765882B (zh) 2022-06-01
KR20170113416A (ko) 2017-10-12
JP2017185807A (ja) 2017-10-12
TW201810754A (zh) 2018-03-16
KR102358122B1 (ko) 2022-02-04
CN107263892B (zh) 2020-10-16
CN107263892A (zh) 2017-10-20

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