JP6952515B2 - ワーク搬送装置、電子部品の製造装置、ワーク搬送方法、および、電子部品の製造方法 - Google Patents

ワーク搬送装置、電子部品の製造装置、ワーク搬送方法、および、電子部品の製造方法 Download PDF

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JP6952515B2
JP6952515B2 JP2017129099A JP2017129099A JP6952515B2 JP 6952515 B2 JP6952515 B2 JP 6952515B2 JP 2017129099 A JP2017129099 A JP 2017129099A JP 2017129099 A JP2017129099 A JP 2017129099A JP 6952515 B2 JP6952515 B2 JP 6952515B2
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Japanese (ja)
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JP2019012782A (ja
JP2019012782A5 (ko
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一郎 今井
一郎 今井
聡子 堀
聡子 堀
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Towa Corp
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Towa Corp
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Priority to JP2017129099A priority Critical patent/JP6952515B2/ja
Priority to KR1020180073583A priority patent/KR102192278B1/ko
Priority to CN201810693909.8A priority patent/CN109216248A/zh
Priority to TW107122504A priority patent/TWI667726B/zh
Publication of JP2019012782A publication Critical patent/JP2019012782A/ja
Publication of JP2019012782A5 publication Critical patent/JP2019012782A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Feeding Of Workpieces (AREA)
  • Mechanical Engineering (AREA)
JP2017129099A 2017-06-30 2017-06-30 ワーク搬送装置、電子部品の製造装置、ワーク搬送方法、および、電子部品の製造方法 Active JP6952515B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017129099A JP6952515B2 (ja) 2017-06-30 2017-06-30 ワーク搬送装置、電子部品の製造装置、ワーク搬送方法、および、電子部品の製造方法
KR1020180073583A KR102192278B1 (ko) 2017-06-30 2018-06-26 워크 반송 장치, 전자 부품의 제조 장치, 워크 반송 방법, 및, 전자 부품의 제조 방법
CN201810693909.8A CN109216248A (zh) 2017-06-30 2018-06-29 工件搬送装置、工件搬送法、电子零件的制造装置及制法
TW107122504A TWI667726B (zh) 2017-06-30 2018-06-29 工件搬送裝置、電子零件的製造裝置、工件搬送方法以及電子零件的製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017129099A JP6952515B2 (ja) 2017-06-30 2017-06-30 ワーク搬送装置、電子部品の製造装置、ワーク搬送方法、および、電子部品の製造方法

Publications (3)

Publication Number Publication Date
JP2019012782A JP2019012782A (ja) 2019-01-24
JP2019012782A5 JP2019012782A5 (ko) 2020-02-06
JP6952515B2 true JP6952515B2 (ja) 2021-10-20

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JP2017129099A Active JP6952515B2 (ja) 2017-06-30 2017-06-30 ワーク搬送装置、電子部品の製造装置、ワーク搬送方法、および、電子部品の製造方法

Country Status (4)

Country Link
JP (1) JP6952515B2 (ko)
KR (1) KR102192278B1 (ko)
CN (1) CN109216248A (ko)
TW (1) TWI667726B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220072935A (ko) * 2020-11-25 2022-06-03 세메스 주식회사 반도체 스트립 절단 및 분류 설비에서 패키지 건조 장치
JP7084519B1 (ja) * 2021-03-04 2022-06-14 Ｔｏｗａ株式会社 加工装置
JP7492263B2 (ja) * 2021-06-24 2024-05-29 アピックヤマダ株式会社 圧縮成形装置及び圧縮成形方法
JP7157860B1 (ja) * 2021-09-29 2022-10-20 Dmg森精機株式会社 工作機械用装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002050670A (ja) * 2000-08-04 2002-02-15 Toshiba Corp ピックアップ装置及びピックアップ方法
GB2370411B (en) 2000-12-20 2003-08-13 Hanmi Co Ltd Handler system for cutting a semiconductor package device
JP3636153B2 (ja) * 2002-03-19 2005-04-06 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
JP2005019909A (ja) * 2003-06-30 2005-01-20 Apic Yamada Corp 半導体製造装置
JP5054933B2 (ja) * 2006-05-23 2012-10-24 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5108481B2 (ja) * 2007-11-30 2012-12-26 Ｔｏｗａ株式会社 個片化された電子部品の搬送装置及び搬送方法
JP5126091B2 (ja) * 2009-02-02 2013-01-23 ウシオ電機株式会社 ワークステージ及び該ワークステージを使用した露光装置
JP5572353B2 (ja) * 2009-09-29 2014-08-13 日東電工株式会社 保護テープ剥離方法およびその装置
TWI435402B (zh) * 2010-09-06 2014-04-21 Wen Hua Chang Microchip pick and place mechanism
KR101711497B1 (ko) * 2010-10-29 2017-03-02 삼성전자주식회사 반도체 칩 실장 장치
JP6017382B2 (ja) * 2013-07-29 2016-11-02 Ｔｏｗａ株式会社 個片化された電子部品の搬送装置及び搬送方法
JP5737767B1 (ja) * 2013-12-24 2015-06-17 上野精機株式会社 点灯試験装置
JP6333648B2 (ja) * 2014-07-16 2018-05-30 Ｔｏｗａ株式会社 個片化物品の移送方法、製造方法及び製造装置
KR101610256B1 (ko) * 2014-11-05 2016-04-07 김성기 진공 흡착 플레이트
JP6338555B2 (ja) * 2015-07-10 2018-06-06 Ｔｏｗａ株式会社 吸着機構及び吸着方法並びに製造装置及び製造方法
KR20170074141A (ko) * 2015-12-21 2017-06-29 (주)제이티 플립소자 핸들러
JP2017175055A (ja) * 2016-03-25 2017-09-28 株式会社ディスコ パッケージ基板のハンドリング方法

Also Published As

Publication number Publication date
KR20190003371A (ko) 2019-01-09
TWI667726B (zh) 2019-08-01
TW201906058A (zh) 2019-02-01
KR102192278B1 (ko) 2020-12-17
JP2019012782A (ja) 2019-01-24
CN109216248A (zh) 2019-01-15

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