JP6944665B2 - 振動子及び振動子の製造方法 - Google Patents
振動子及び振動子の製造方法 Download PDFInfo
- Publication number
- JP6944665B2 JP6944665B2 JP2021511299A JP2021511299A JP6944665B2 JP 6944665 B2 JP6944665 B2 JP 6944665B2 JP 2021511299 A JP2021511299 A JP 2021511299A JP 2021511299 A JP2021511299 A JP 2021511299A JP 6944665 B2 JP6944665 B2 JP 6944665B2
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- JP
- Japan
- Prior art keywords
- layer
- base
- thickness
- sealing
- vibrating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title claims description 53
- 239000010410 layer Substances 0.000 claims description 286
- 238000007789 sealing Methods 0.000 claims description 217
- 239000002344 surface layer Substances 0.000 claims description 106
- 238000000034 method Methods 0.000 claims description 39
- 230000005284 excitation Effects 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 36
- 239000000956 alloy Substances 0.000 claims description 24
- 229910045601 alloy Inorganic materials 0.000 claims description 24
- 238000005304 joining Methods 0.000 claims description 18
- 239000010453 quartz Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 238000005275 alloying Methods 0.000 claims description 4
- 239000013078 crystal Substances 0.000 description 219
- 239000002184 metal Substances 0.000 description 45
- 230000002093 peripheral effect Effects 0.000 description 32
- 238000000605 extraction Methods 0.000 description 24
- 238000010586 diagram Methods 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 208000005137 Joint instability Diseases 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/022—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the cantilever type
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019067622 | 2019-03-29 | ||
| JP2019067622 | 2019-03-29 | ||
| PCT/JP2020/009694 WO2020203044A1 (ja) | 2019-03-29 | 2020-03-06 | 振動子及び振動子の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2020203044A1 JPWO2020203044A1 (ja) | 2021-09-13 |
| JP6944665B2 true JP6944665B2 (ja) | 2021-10-06 |
Family
ID=72668350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021511299A Active JP6944665B2 (ja) | 2019-03-29 | 2020-03-06 | 振動子及び振動子の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20210367579A1 (zh) |
| JP (1) | JP6944665B2 (zh) |
| CN (1) | CN112970195B (zh) |
| WO (1) | WO2020203044A1 (zh) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004129223A (ja) * | 2002-07-31 | 2004-04-22 | Murata Mfg Co Ltd | 圧電部品およびその製造方法 |
| JP4766831B2 (ja) * | 2002-11-26 | 2011-09-07 | 株式会社村田製作所 | 電子部品の製造方法 |
| JP2006074567A (ja) * | 2004-09-03 | 2006-03-16 | Seiko Epson Corp | 圧電デバイス |
| JP4513513B2 (ja) * | 2004-11-09 | 2010-07-28 | 株式会社村田製作所 | 電子部品の製造方法 |
| JP2006173557A (ja) * | 2004-11-22 | 2006-06-29 | Toshiba Corp | 中空型半導体装置とその製造方法 |
| JP5119866B2 (ja) * | 2007-03-22 | 2013-01-16 | セイコーエプソン株式会社 | 水晶デバイス及びその封止方法 |
| US9450556B2 (en) * | 2009-10-16 | 2016-09-20 | Avx Corporation | Thin film surface mount components |
| JP6127495B2 (ja) * | 2012-12-19 | 2017-05-17 | セイコーエプソン株式会社 | 振動片、振動子、発振器、電子機器、移動体、および振動片の製造方法 |
| JP6842682B2 (ja) * | 2017-09-13 | 2021-03-17 | 株式会社村田製作所 | 水晶振動素子およびその製造方法 |
-
2020
- 2020-03-06 JP JP2021511299A patent/JP6944665B2/ja active Active
- 2020-03-06 CN CN202080005895.1A patent/CN112970195B/zh active Active
- 2020-03-06 WO PCT/JP2020/009694 patent/WO2020203044A1/ja active Application Filing
-
2021
- 2021-08-09 US US17/397,650 patent/US20210367579A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20210367579A1 (en) | 2021-11-25 |
| WO2020203044A1 (ja) | 2020-10-08 |
| CN112970195A (zh) | 2021-06-15 |
| JPWO2020203044A1 (ja) | 2021-09-13 |
| CN112970195B (zh) | 2024-03-08 |
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